公开(公告)号：EP1851265B1

公开(公告)日：2008-06-18

申请号：EP06708109.1

申请日：2006-02-08

Applicant: BASF SE

Inventor： EIBECK, Peter ,  ENGELMANN, Jochen ,  NEUHAUS, Ralf ,  FISCHER, Michael ,  BRUCHMANN, Bernd

IPC: C08J5/00

CPC classification number: C08L77/00 ,  C08K3/10 ,  C08K3/16 ,  C08K5/098 ,  C08K5/20 ,  C08L21/00 ,  C08L79/02 ,  C08L2666/20

Abstract: Disclosed are thermoplastic molding materials containing: A) 10 to 99 percent by weight of at least one thermoplastic polyamide; B) 0.1 to 5 percent by weight of at least one polyethyleneimine homopolymer or copolymer; C) 0.05 to 3 percent by weight of a lubricant; D) 0.05 to 3 percent by weight of a copper-containing stabilizer or a sterically hindered phenol or the mixtures thereof; E) 0 to 60 percent by weight of other additives, the total percentage by weight of components (A) to (E) amounting to 100 percent.

公开(公告)号：EP1776409B1

公开(公告)日：2008-05-07

申请号：EP05777287.3

申请日：2005-07-30

Applicant: BASF SE

Inventor： EIBECK, Peter ,  WARZELHAN, Volker ,  BRUCHMANN, Bernd

IPC: C08G69/48 ,  C08G69/46

CPC classification number: C08G69/48

Abstract: Disclosed is a method for producing high-molecular polyamides. Said method is characterized in that a polyamide A) is reacted with a compound B) at a temperature ranging from 150 to 350 °C, said compound B) releasing isocyanic acid at said reaction temperature. The concentration of the terminal amino groups in the used polyamide A) is greater than or equal to the concentration of the terminal carboxyl groups.