公开(公告)号：US08878210B2

公开(公告)日：2014-11-04

申请号：US13862022

申请日：2013-04-12

Applicant: Epistar Corporation

Inventor： Tzu-Chieh Hsu

IPC: H01L33/00 ,  H01L33/22 ,  H01L21/683 ,  H01L23/00 ,  H01L33/20

CPC classification number: H01L33/22 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/48 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/20 ,  H01L2221/68359 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A light emitting device comprising: a substrate, wherein the substrate comprises a first major surface, a second major surface opposite to the first major surface, and a sidewall wherein the entire sidewall is a substantially textured surface with a depth of 10˜150 μm; and a light emitting stack layer formed on the substrate.

Abstract translation: 1.一种发光器件，包括：衬底，其中所述衬底包括第一主表面，与所述第一主表面相对的第二主表面和侧壁，其中所述整个侧壁是深度为10〜150μm的基本上纹理的表面; 以及形成在基板上的发光层叠层。

公开(公告)号：US20130200414A1

公开(公告)日：2013-08-08

申请号：US13752423

申请日：2013-01-29

Applicant: Epistar corporation

Inventor： Chia-Liang Hsu ,  Han-Min Wu ,  Ye-Ming Hsu ,  Chien-Fu Huang ,  Tzu-Chieh Hsu ,  Min-Hsun Hsieh

IPC: H01L33/50

CPC classification number: H01L33/56 ,  G02B6/0025 ,  G02B6/0031 ,  G02B6/0073 ,  H01L33/48 ,  H01L33/486 ,  H01L33/50 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An encapsulated light-emitting diode device is disclosed. The encapsulated light-emitting diode device includes a circuit carrier including a surface; a light-emitting device including a transparent substrate, the transparent substrate including a first surface and a second surface; a light-emitting diode chip located on the first surface of the transparent substrate; and a first transparent glue covering the light-emitting diode chip and formed on the first surface; wherein the first surface and the surface comprise an included angle larger than zero; wherein the first transparent glue has a circular projection on the first surface and the light-emitting diode chip is substantially located at the center of the circular projection.

Abstract translation: 公开了封装的发光二极管装置。 封装的发光二极管装置包括：包括表面的电路载体; 包括透明基板的发光装置，所述透明基板包括第一表面和第二表面; 位于透明基板的第一表面上的发光二极管芯片; 以及覆盖所述发光二极管芯片并形成在所述第一表面上的第一透明胶; 其中所述第一表面和所述表面包括大于零的夹角; 其中所述第一透明胶在所述第一表面上具有圆形突起，并且所述发光二极管芯片基本上位于所述圆形突起的中心。