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公开(公告)号：EP3544788A1
公开(公告)日：2019-10-02
申请号：EP17906299.7
申请日：2017-04-18
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： ERICKSON, Kristopher J. , ANTHONY, Thomas C. , ZHAO, Lihua
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公开(公告)号：EP3436236A1
公开(公告)日：2019-02-06
申请号：EP16910707.5
申请日：2016-07-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： ZHAO, Yan , ERICKSON, Kristopher J. , HARTMAN, Aja , ZHAO, Lihua , CHAFFINS, Sterling , DEKAM, Kevin P.
IPC: B29C64/10 , B29C64/264 , B29C64/295 , B29C64/393 , B33Y10/00 , B33Y70/00
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公开(公告)号：EP3344711A1
公开(公告)日：2018-07-11
申请号：EP16888387.4
申请日：2016-01-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： GANAPATHIAPPAN, Sivapackia , TOM, Howard S. , ZHAO, Yan , ERICKSON, Kristopher J. , NAUKA, Krzysztof , ZHAO, Lihua
IPC: C09D11/10 , C09D11/037 , C09D11/32
Abstract: The present disclosure is drawn to coalescent inks and material sets, such as for 3D printing. In one example, the coalescent ink can include a conjugated polymer, a colorant imparting a visible color to the coalescent ink, and an ink vehicle comprising a high boiling point co-solvent having a boiling point of 250° C. or greater. The high boiling point co-solvent can be present in an amount from about 1 wt % to about 4 wt % with respect to the coalescent ink.
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公开(公告)号：EP3271416A1
公开(公告)日：2018-01-24
申请号：EP15899096.0
申请日：2015-07-23
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： NAUKA, Krzysztof , TOM, Howard S. , ERICKSON, Kristopher J. , ZHAO, Lihua , GANAPATHIAPPAN, Sivapackia
IPC: C08K3/00 , C08K5/00 , C08L101/00 , B33Y70/00
CPC classification number: B29C64/153 , B33Y70/00 , C08K3/20 , C08K3/22 , C08K3/30 , C08K3/32 , C08K5/00 , C08K5/0091 , C08K2003/2248 , C08K2201/005 , C08L71/12 , C08L77/02 , C08L101/00 , C08L101/12
Abstract: A three-dimensional printing build material composition includes a polymer particle, and a radiation absorbing additive mixed with the polymer particle. The radiation absorbing additive has a particle size ranging from about 1 μm to about 100 μm, and the radiation absorbing additive is to absorb incident radiation having wavelengths ranging from 700 nm to 10 μm.
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公开(公告)号：EP3765271A1
公开(公告)日：2021-01-20
申请号：EP18931716.7
申请日：2018-08-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： ERICKSON, Kristopher J. , BARRETT, Spencer , WILLIAMS, Kenneth
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Patent Agency Ranking
公开(公告)号：EP3765265A1
公开(公告)日：2021-01-20
申请号：EP18932125.0
申请日：2018-08-27
Applicant: Hewlett-Packard Development Company, L.P.
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公开(公告)号：EP3765262A1
公开(公告)日：2021-01-20
申请号：EP18909338.8
申请日：2018-03-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： ERICKSON, Kristopher J. , OLUBUMMO, Paul , HARTMAN, Aja , ZHAO, Lihua
IPC: B29C64/165 , B29C64/10 , B33Y70/00 , B33Y10/00
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公开(公告)号：EP3758866A1
公开(公告)日：2021-01-06
申请号：EP18921431.5
申请日：2018-06-08
Applicant: Hewlett-Packard Development Company, L.P.
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公开(公告)号：EP3638487A1
公开(公告)日：2020-04-22
申请号：EP17920494.6
申请日：2017-07-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： ERICKSON, Kristopher J. , ANTHONY, Thomas C.
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公开(公告)号：EP3408427A1
公开(公告)日：2018-12-05
申请号：EP16888489.8
申请日：2016-01-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： ERICKSON, Kristopher J. , NAUKA, Krzysztof , ANTHONY, Thomas , ZHAO, Lihua , TOM, Howard S.
CPC classification number: B22F3/008 , B33Y10/00 , B82B1/00 , B82B3/00 , C23C18/08 , C23C18/30 , C23C24/08 , C23C24/10 , C23C24/106
Abstract: Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles. The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.
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