公开(公告)号：EP1807879B1

公开(公告)日：2020-01-22

申请号：EP05802534.7

申请日：2005-09-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： STREUBEL, Klaus ,  WIRTH, Ralph

IPC: H01L33/08 ,  H01L33/20

公开(公告)号：EP1964183B1

公开(公告)日：2018-01-03

申请号：EP06828550.1

申请日：2006-11-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： HAHN, Berthold ,  WIRTH, Ralph ,  ALBRECHT, Tony ,  AHLSTEDT, Magnus ,  ILLEK, Stefan ,  STREUBEL, Klaus

IPC: H01L33/14 ,  H01L33/42

CPC classification number: H01L33/145 ,  H01L33/42

公开(公告)号：EP2359668B1

公开(公告)日：2016-06-15

申请号：EP09774905.5

申请日：2009-12-14

Applicant: Osram Opto Semiconductors Gmbh

Inventor： WIRTH, Ralph ,  KLEIN, Markus

IPC: H05B33/08

CPC classification number: H05B33/0869 ,  H05B33/0872

公开(公告)号：EP1307928B1

公开(公告)日：2014-12-31

申请号：EP01984505.6

申请日：2001-08-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ILLEK, Stefan ,  PLÖSSL, Andreas ,  STREUBEL, Klaus ,  WEGLEITER, Walter ,  WIRTH, Ralph

IPC: H01L33/08 ,  H01L33/10 ,  H01L33/20 ,  H01L33/30 ,  H01L33/00

CPC classification number: H01L33/20 ,  H01L33/0079 ,  H01L33/08 ,  H01L33/10 ,  H01L33/30 ,  H01L33/405 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1222696B1

公开(公告)日：2014-07-30

申请号：EP00972599.5

申请日：2000-09-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： WIRTH, Ralph ,  STREUBEL, Klaus

IPC: H01L33/02 ,  H01L33/14 ,  H01L33/22 ,  H01L33/42

CPC classification number: H01L33/025 ,  H01L33/14 ,  H01L33/22 ,  H01L33/42 ,  H01L2933/0091

公开(公告)号：EP2494616A1

公开(公告)日：2012-09-05

申请号：EP10773869.2

申请日：2010-10-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BARCHMANN, Bernd ,  KALTENBACHER, Axel ,  STATH, Norbert ,  WEGLEITER, Walter ,  WEIDNER, Karl ,  WIRTH, Ralph

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L2224/24998 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic component comprising a carrier body (3) having a connection area (5). A semiconductor chip (7) is disposed on the carrier body (3). A contact area (10) is applied to the surface (8) of the semiconductor chip (7) facing away from the carrier body (3). The connection area (5) is electrically conductively connected to the contact region (10) by means of a self-supporting conductor structure (13). The invention relates to a method for producing an optoelectronic component.

公开(公告)号：EP2351461A1

公开(公告)日：2011-08-03

申请号：EP09799503.9

申请日：2009-11-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： WIRTH, Ralph

IPC: H05B33/08

CPC classification number: H05B33/0857 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic device for emitting mixed light comprising light in a first and a second wavelength range. Said device comprises in particular a first semiconductor light source (1) with a first light-emitting diode (11), which during operation emits light in the first wavelength range with a first intensity, a second semiconductor light source (2) with a second light-emitting diode (21), which during operation emits light in the second wavelength range with a second intensity, the first and the second wavelength ranges being different from one another, and a resistance element (3) comprising a temperature-dependent electric resistor. The first wavelength range and/or the first intensity of the light emitted by the first semiconductor light source (1) has or have a first temperature dependence and the second wavelength range and/or the second intensity of the light emitted by the second semiconductor light source (2) has or have a second temperature dependence that differs from the first temperature dependence, the resistance element (3) and the first semiconductor light source (1) form a series circuit (4) and the series circuit (4) and the second semiconductor light source (2) form a parallel circuit (5).

公开(公告)号：EP2319097A1

公开(公告)日：2011-05-11

申请号：EP09776012.8

申请日：2009-07-23

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： LINDER, Norbert ,  WIESMANN, Christopher ,  WIRTH, Ralph ,  STANLEY, Ross ,  HOUDRE, Romuald

IPC: H01L33/00

CPC classification number: H01L33/22 ,  H01L33/405 ,  H01L33/46

Abstract: A semiconductor chip is specified, comprising an active layer (2) provided for emitting an electromagnetic radiation, and a two-dimensional arrangement of structure units (5), which is disposed downstream of the active layer in a main emission direction (6) of the semiconductor chip. The structure units (5) are arranged in an arbitrary statistical distribution. A semiconductor chip having a directional emission characteristic can be realized by means of such an arrangement of structure units.

公开(公告)号：EP2067179A1

公开(公告)日：2009-06-10

申请号：EP07817459.6

申请日：2007-08-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： WINDISCH, Reiner ,  WIRTH, Ralph

IPC: H01L33/00

CPC classification number: H01L33/20 ,  H01L33/08 ,  H01L2924/0002 ,  H01L2933/0083 ,  H01L2924/00

Abstract: The invention relates to an LED semiconductor body (1) comprising at least one first radiation-generating active layer (31), at least one second radiation-generating active layer (32), and a photonic crystal (6). The invention also relates to the use of such an LED semiconductor body (1).

公开(公告)号：EP1210737B1

公开(公告)日：2019-02-27

申请号：EP00974281.8

申请日：2000-09-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： WIRTH, Ralph

IPC: H01L33/00