公开(公告)号：EP2319078B1

公开(公告)日：2018-09-19

申请号：EP09791099.6

申请日：2009-08-03

Applicant: QUALCOMM Incorporated

Inventor： TANG, Yiwu ,  JIN, Zhang

IPC: H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L23/522

CPC classification number: H01L23/5227 ,  H01L23/48 ,  H01L23/49534 ,  H01L23/50 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2224/0401

Abstract: An assembly involves an integrated circuit die that is bonded, e.g., flip-chip bonded, to a non-semiconductor substrate by a plurality of low-resistance microbumps. In one novel aspect, at least a part of a novel high-frequency transformer is disposed in the non-semiconductor substrate where the non-semiconductor substrate is the substrate of a ball grid array (BGA) integrated circuit package. At least one of the low-resistance microbumps connects the part of the transformer in the substrate to a circuit in the integrated circuit die. At two gigahertz, the novel transformer has a coupling coefficient k of at least at least 0.4 and also has a transformer quality factor Q of at least ten. The novel transformer structure sees use in coupling differential outputs of a mixer to a single-ended input of a driver amplifier in a transmit chain of an RF transceiver within a cellular telephone.

公开(公告)号：EP2319078A1

公开(公告)日：2011-05-11

申请号：EP09791099.6

申请日：2009-08-03

Applicant: QUALCOMM Incorporated

Inventor： TANG, Yiwu ,  JIN, Zhang

IPC: H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L23/522

CPC classification number: H01L23/5227 ,  H01L23/48 ,  H01L23/49534 ,  H01L23/50 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2224/0401

Abstract: An assembly involves an integrated circuit die that is bonded, e.g., flip-chip bonded, to a non-semiconductor substrate by a plurality of low-resistance microbumps. In one novel aspect, at least a part of a novel high-frequency transformer is disposed in the non-semiconductor substrate where the non-semiconductor substrate is the substrate of a ball grid array (BGA) integrated circuit package. At least one of the low-resistance microbumps connects the part of the transformer in the substrate to a circuit in the integrated circuit die. At two gigahertz, the novel transformer has a coupling coefficient k of at least at least 0.4 and also has a transformer quality factor Q of at least ten. The novel transformer structure sees use in coupling differential outputs of a mixer to a single-ended input of a driver amplifier in a transmit chain of an RF transceiver within a cellular telephone.

公开(公告)号：EP2100377A1

公开(公告)日：2009-09-16

申请号：EP07869188.8

申请日：2007-12-12

Applicant: QUALCOMM Incorporated

Inventor： TANG, Yiwu

IPC: H03L7/00

CPC classification number: H03L7/099 ,  H03B5/1215 ,  H03B5/1228 ,  H03B5/1243 ,  H03B5/1265 ,  H03B5/1278 ,  H03B2200/005

Abstract: A programmable varactor apparatus may include multiple binary weighted varactors controlled by multiple digital varactor bits. A programmable varactor apparatus may include a plurality of binary weighted varactors, and a control to selectively disable one or more of the plurality of binary weighted varactors to decrease an effective capacitance of the programmable varactor apparatus. A method for changing an effective capacitance of a programmable varactor apparatus may include providing a plurality of binary weighted varactors, and disabling one or more of the plurality of binary weighted varactors to decrease the effective capacitance of the programmable varactor apparatus.