Donor substrate, and manufacturing method for display device
    61.
    发明专利
    Donor substrate, and manufacturing method for display device 审中-公开
    多晶硅基板和显示器件的制造方法

    公开(公告)号:JP2009146715A

    公开(公告)日:2009-07-02

    申请号:JP2007322501

    申请日:2007-12-13

    Abstract: PROBLEM TO BE SOLVED: To provide a donor substrate capable of reducing the number of transfer, and a manufacturing method for an organic light-emitting element using the donor substrate.
    SOLUTION: A partition 42 is provided on the donor substrate 40. A red color transfer layer 50R, a green color transfer layer 50G, and a blue color transfer layer 50B including light-emitting materials with various colors are formed on each zone partitioned by partitions 42, and all light-emitting layers of red color, green color, and blue color are formed on a transfer substrate by one transfer. When a width of the zone partitioned by the partition 42 is set up to be Wd and a width of a light-emitting zone 13C on the transfer substrate 11 is set up to be Ws, sections only where film thickness of the red color transfer layer 50R, the green color transfer layer 50G, and the blue color transfer layer 50B is uniform are transferred by satisfying the relationship of Wd>Ws. Furthermore, when a width of a light-heat conversion layer 43 is set up to be Wt, it is preferable that the relationship of Ws

    Abstract translation: 要解决的问题:提供能够减少转印次数的施主基板和使用施主基板的有机发光元件的制造方法。 解决方案:在施主基板40上设置分隔件42.在每个区域上形成包括各种颜色的发光材料的红色转印层50R,绿色转印层50G和蓝色转印层50B 通过分隔件42分隔开,并且通过一次转印在转印基板上形成红色,绿色和蓝色的所有发光层。 当由隔板42分隔的区域的宽度被设定为Wd,并且转印基板11上的发光区域13C的宽度被设置为Ws时,仅在红色转印层的膜厚度 50R,绿色转印层50G和蓝色转印层50B均匀地通过满足Wd> Ws的关系而被转印。 此外,当光热转换层43的宽度设定为Wt时,优选地满足Ws

    Printing device and printing method
    62.
    发明专利
    Printing device and printing method 审中-公开
    打印设备和打印方法

    公开(公告)号:JP2008027535A

    公开(公告)日:2008-02-07

    申请号:JP2006199942

    申请日:2006-07-21

    CPC classification number: B41J2/17509 B41J3/4071 B41J29/38

    Abstract: PROBLEM TO BE SOLVED: To solve the problem that in a printing device printing visible information on a label surface of a disk like recording medium which is rotationally driven by ejecting ink drops from an ejection nozzle provided on a printing head, it is difficult to adapt the ejection frequency of the ink drops to the optical disk rotationally driven at high speed and satisfactory printing quality can not be obtained since rotational speed of a spindle motor is lowered and its rotation is not stabilized when the optical disk is rotationally driven at a speed corresponding to a prescribed ejection frequency.
    SOLUTION: A print control part 53 is provided, ejecting the ink drops from the printing head 21 with a prescribed ejection frequency and controlling the ink drops so that the ink drop is dropped at prescribed intervals in a peripheral direction in a first rotation (Fig.14A) of an optical disk 101 and the ink drop is dropped on a part left in the first rotation in a second periphery (Fig.14B).
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:为了解决在打印装置中打印通过从设置在打印头上的喷嘴喷射墨滴旋转驱动的盘状记录介质的标签表面上的可见信息的问题,它是 难以使墨滴的喷射频率适应于以高速旋转驱动的光盘,并且由于主轴电动机的旋转速度降低并且当光盘被旋转驱动时其旋转不稳定,所以不能获得令人满意的打印质量 对应于规定喷射频率的速度。 解决方案:提供打印控制部分53,以预定的喷射频率从打印头21喷射墨滴,并控制墨滴,使得墨滴在第一旋转中沿周向以规定的间隔落下 (图14A),并且墨滴在第二周边中在第一旋转中留下的部分下落(图14B)。 版权所有(C)2008,JPO&INPIT

    Recording medium drive apparatus and recording medium driving method
    63.
    发明专利
    Recording medium drive apparatus and recording medium driving method 审中-公开
    记录介质驱动装置和记录介质驱动方法

    公开(公告)号:JP2007257764A

    公开(公告)日:2007-10-04

    申请号:JP2006082415

    申请日:2006-03-24

    CPC classification number: B41J3/4071

    Abstract: PROBLEM TO BE SOLVED: To provide a recording medium drive apparatus and a method of printing a label surface for printing visible information on the label surface of an optical disk. SOLUTION: The recording medium drive apparatus comprises a recording and/or reproducing part 140 which at least records a data signal onto a recording surface of a recording medium or reproduces the data signal from the recording surface; a printing part 110 which prints the visible information on a main surface different from the recording surface of the recording medium by an ink jet system; a driver 134 which drives the recording medium; and a rotation control part 180 which switches the driving speed of the driver depending on a printing mode for printing the visible information on the main surface or a recording or reproducing mode for recording or reproducing the data signal on the recording surface. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种记录介质驱动装置和一种在光盘的标签表面上打印用于打印可见信息的标签表面的方法。 解决方案:记录介质驱动装置包括至少将数据信号记录到记录介质的记录表面上或从记录表面再现数据信号的记录和/或再现部分140; 打印部分110,其通过喷墨系统在与记录介质的记录表面不同的主表面上打印可见信息; 驱动记录介质的驱动器134; 以及旋转控制部180,其根据用于在主表面上打印可见信息的打印模式或用于在记录表面上记录或再现数据信号的记录或再现模式来切换驾驶员的驾驶速度。 版权所有(C)2008,JPO&INPIT

    Head module, liquid ejecting head and liquid ejector
    64.
    发明专利
    Head module, liquid ejecting head and liquid ejector 审中-公开
    头部模块,液体喷射头和液体喷射器

    公开(公告)号:JP2007196455A

    公开(公告)日:2007-08-09

    申请号:JP2006015581

    申请日:2006-01-24

    Abstract: PROBLEM TO BE SOLVED: To enable it to sharply reduce the space which is needed for the electrical connection of a head module. SOLUTION: A head module comprises two or more head chips 20 wherein an electrode to be electrically connected with a control substrate is mounted, a nozzle sheet 25 wherein a nozzle has been formed and two pieces of flexible wiring substrate 3 with wiring for electrically connecting the electrode of each head chip 20 with the connector of the control substrate. For each flexible wiring substrate 3, one end of the wiring is electrically connected with the electrode of each head chip 20, and the other end serves as an interposition terminal part 3b for the connector of the control substrate. The interposition terminal part 3b of each flexible wiring substrate 3 is arranged so as to be located at the position shifted mutually between each flexible wiring substrate 3. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:为了使其能够急剧减小头模块的电连接所需的空间。 解决方案:头模块包括两个或更多个头芯片20,其中安装有与控制基板电连接的电极,其中已经形成喷嘴的喷嘴板25和具有布线的两个柔性布线基板3 将每个头芯片20的电极与控制基板的连接器电连接。 对于每个柔性布线基板3,布线的一端与每个头芯片20的电极电连接,另一端用作用于控制基板的连接器的插入端子部分3b。 每个柔性布线基板3的插入端子部分3b布置成位于每个柔性布线基板3之间相互移动的位置。版权所有(C)2007,JPO&INPIT

    Recorder and/or player
    65.
    发明专利
    Recorder and/or player 审中-公开
    记录和/或播放器

    公开(公告)号:JP2007149173A

    公开(公告)日:2007-06-14

    申请号:JP2005339206

    申请日:2005-11-24

    Abstract: PROBLEM TO BE SOLVED: To record/play a disk and to perform printing on a print surface of the disk. SOLUTION: This recorder and/or player is provided with a disk tray 3 for rotatably holding an optical disk 10, wherein one surface disposed on the device main body 2 is a recording/reproducing surface 10b and the other surface is the print surface 10c, a tray moving mechanism 4 for moving the disk tray 3 over between the inside and outside of the device main body 2 through an opening part 12 of the device main body 2, a recording/playing part 5 arranged at a side facing the recording/reproducing surface 10b of the optical disk 10 held by the disk tray to perform recording/playing of the optical disk 10 at a recording/playing position at which the disk tray 3 is housed in the device main body 2, and a printing part 6 arranged at a side facing the print surface 10c of the optical disk 10 held by the disk tray 3 at a position going along the opening part 12 in the device main body 2 to print visible data on the print surface 10c of the optical disk 10. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:记录/播放磁盘并在磁盘的打印面上执行打印。 解决方案:该记录器和/或播放器设置有用于可旋转地保持光盘10的盘托架3,其中设置在设备主体2上的一个表面是记录/再现表面10b,另一个表面是打印 表面10c,用于通过设备主体2的开口部分12将盘托盘3移动到设备主体2的内部和外部之间的托盘移动机构4;布置在面向设备主体2的一侧的记录/播放部分5 记录/再现表面10b由盘托盘保持的光盘10在盘托盘3容纳在装置主体2中的记录/播放位置执行光盘10的记录/播放,以及打印部分 6,其布置在面向由盘托盘3保持的光盘10的打印表面10c的一侧沿着设备主体2中的开口部分12的位置,以在光盘10的打印表面10c上打印可视数据 。版权所有(C)2007,JPO&INPIT

    Head module, liquid delivering head, liquid delivering apparatus, and method of manufacturing head module
    66.
    发明专利
    Head module, liquid delivering head, liquid delivering apparatus, and method of manufacturing head module 审中-公开
    头模块,液体输送头,液体输送装置和制造头模块的方法

    公开(公告)号:JP2007062260A

    公开(公告)日:2007-03-15

    申请号:JP2005253293

    申请日:2005-09-01

    Abstract: PROBLEM TO BE SOLVED: To prevent a head module from coming into contact with a liquid by sealing an exposed part of a wiring substrate by a simple constitution, and also to reduce manufacturing costs.
    SOLUTION: An electrode 23 of a head chip 20 is exposed from a region not covered by a nozzle sheet 25 of a head chip positioning hole. A flexible wiring substrate 3 is arranged to cover the exposed electrode 23 of the head chip 20 at the side of a face of a module frame 11 where the nozzle sheet 25 is prepared. An electrode (tip of a wiring pattern 3a) of the flexible wiring substrate 3 is electrically connected with the electrode 23 of the head chip 20 via an anisotropic conductive film 28. At the same time, the wiring pattern 3a of the flexible wiring substrate 3 exposed from a gap between the head chip 20 and the module frame 11 is sealed by the anisotropic conductive film 28.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:通过简单的结构,通过用布线基板的露出部分密封来防止头模块与液体接触,并且还降低制造成本。 解决方案:头芯片20的电极23从未被头芯片定位孔的喷嘴片25覆盖的区域露出。 柔性布线基板3布置成覆盖头芯片20的暴露的电极23的模块框架11的制备喷嘴片25的表面的一侧。 柔性布线基板3的电极(布线图案3a的前端)经由各向异性导电膜28与磁头芯片20的电极23电连接。同时,柔性布线基板3的布线图案3a 从头芯片20和模块框架11之间的间隙露出的各向异性导电膜28被密封。(C)2007,JPO&INPIT

    Liquid delivery head and liquid delivery apparatus
    67.
    发明专利
    Liquid delivery head and liquid delivery apparatus 有权
    液体输送头和液体输送装置

    公开(公告)号:JP2007021909A

    公开(公告)日:2007-02-01

    申请号:JP2005207584

    申请日:2005-07-15

    Abstract: PROBLEM TO BE SOLVED: To substantially improve the convenience by making the removing work with a head module unit easier.
    SOLUTION: The apparatus has a head frame 2 wherein head module arranging holes which hold two or more head modules have been formed. For buffer tanks communicating with the ink liquid chambers of all head chips, the buffer tanks located in series in the module arranging holes are connected each other by a U-tube 13. A control board 4 with a connector 4a for electrically connecting to the head module is arranged so as to cover all buffer tanks, and the substrate has a notch 4b which lets a flexible wiring board 3 for electrically connecting an electrode of the head chip and the connector 4a of the control substrate 4 pass and an opening 4c enabling the U-tube 13 to be removed by an outside handling.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:通过使头部模块单元的移除工作更容易,大大提高了方便性。 解决方案:该装置具有头架2,其中已经形成了保持两个或更多个头模块的头模块配置孔。 对于与所有头部芯片的墨水液室连通的缓冲罐,串联在模块配置孔中的缓冲罐通过U形管13彼此连接。具有用于电连接到头部的连接器4a的控制板4 模块布置成覆盖所有缓冲罐,并且基板具有凹口4b,其使用于将头芯片的电极和控制基板4的连接器4a电连接的柔性布线板3通过,并且能够 U型管13由外部处理除去。 版权所有(C)2007,JPO&INPIT

    Head module, liquid delivering head and liquid delivering apparatus
    68.
    发明专利
    Head module, liquid delivering head and liquid delivering apparatus 审中-公开
    头部模块,液体输送头和液体输送装置

    公开(公告)号:JP2007007948A

    公开(公告)日:2007-01-18

    申请号:JP2005190059

    申请日:2005-06-29

    Abstract: PROBLEM TO BE SOLVED: To adopt an ACF connection which connects via an anisotropic conductive film, and to prevent leakage and sealing defects of a sealant from occurring.
    SOLUTION: Each nozzle sheet 25 is arranged to a head chip stationing hole 11b to have nozzles 25a positioned within the head chip stationing hole 11b, and to cover a part of the region of the head chip stationing hole 11b. At the same time, the nozzle sheet 25 is formed in a size of a necessary minimum to cover a part of the region of the head chip stationing hole 11b. A flexible wiring board 3 has its electrode electrically connected to an electrode of a head chip 20. At the same time, the flexible wiring board 3 is arranged to cover the exposed electrode of the head chip 20 at the face side where the nozzle sheet 25 is set. Moreover, the flexible wiring board 3 has projections 3a overlapped on the nozzle sheet 25 at both ends in a longitudinal direction of the nozzle sheet 25. The overlapped parts are bonded to the nozzle sheet 25.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:采用通过各向异性导电膜连接的ACF连接,并防止密封剂的泄漏和密封缺陷发生。

    解决方案:每个喷嘴片25布置在头部芯片固定孔11b上,以便具有位于头部芯片固定孔11b内的喷嘴25a,并且覆盖头部芯片固定孔11b的一部分区域。 同时,喷嘴片25形成为必要的最小尺寸以覆盖头部芯片固定孔11b的一部分区域。 柔性布线板3的电极与头芯片20的电极电连接。同时,柔性布线板3布置成在喷嘴片25的表面侧覆盖头部芯片20的暴露电极 被设置。 此外,柔性布线基板3在喷嘴片25的长度方向上的两端具有与喷嘴片25重叠的突起部3a。重叠部分与喷嘴片25接合。(C)2007, JPO&INPIT

    HEAD MODULE, LIQUID DELIVERING HEAD AND LIQUID DELIVERING APPARATUS

    公开(公告)号:JP2007001193A

    公开(公告)日:2007-01-11

    申请号:JP2005185285

    申请日:2005-06-24

    Applicant: SONY CORP

    Abstract: PROBLEM TO BE SOLVED: To let electric charges of a nozzle sheet discharge outside when the nozzle sheet is charged without costs being raised in the case of using a plurality of the nozzle sheets. SOLUTION: The nozzle sheet 25 is arranged to have a nozzle 25a positioned within a head chip stationing hole to each head chip stationing hole at one side face of a module frame 11. The module frame 11 and the nozzle sheet 25 are both formed of an electrically conductive material and bonded with an electrically conductive adhesive 14 so that both can be electrically conductive to each other. Each head chip 20 is arranged at each head chip stationing hole from the other side face of the module frame 11 so that a heating resistor 22 of the head chip 20 and the nozzle 25 are set at opposed positions. COPYRIGHT: (C)2007,JPO&INPIT

    MANUFACTURING METHOD FOR HEAD MODULE, MANUFACTURING METHOD FOR LIQUID DELIVERING HEAD, AND MANUFACTURING METHOD FOR LIQUID DELIVERING APPARATUS

    公开(公告)号:JP2007001192A

    公开(公告)日:2007-01-11

    申请号:JP2005185284

    申请日:2005-06-24

    Applicant: SONY CORP

    Abstract: PROBLEM TO BE SOLVED: To reduce manufacturing costs and to smooth a nozzle surface. SOLUTION: The manufacturing method comprises a first process of sticking each nozzle sheet 25 so that a nozzle 25a is positioned within a head chip stationing hole and covers a part of the region of the head chip stationing hole at one side face of a module frame 11 under a first temperature environment, a second process of sticking each head chip 20 to each head chip stationing hole from the other side face of the module frame 11 under a second temperature environment lower than the first temperature environment, a third process of attaching a flexible wiring board 3 to the face side of the module frame 11 where the nozzle sheet 25 is fitted so that an electrode of the flexible wiring board 3 and an electrode 23 of the head chip 20 are electrically connected with each other, and a fourth process of coating the nozzle sheet 25 stuck to the module frame 11 and an end part of the flexible wiring board 3 with a protecting cover 30. COPYRIGHT: (C)2007,JPO&INPIT

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