Abstract:
PROBLEM TO BE SOLVED: To provide a donor substrate capable of reducing the number of transfer, and a manufacturing method for an organic light-emitting element using the donor substrate. SOLUTION: A partition 42 is provided on the donor substrate 40. A red color transfer layer 50R, a green color transfer layer 50G, and a blue color transfer layer 50B including light-emitting materials with various colors are formed on each zone partitioned by partitions 42, and all light-emitting layers of red color, green color, and blue color are formed on a transfer substrate by one transfer. When a width of the zone partitioned by the partition 42 is set up to be Wd and a width of a light-emitting zone 13C on the transfer substrate 11 is set up to be Ws, sections only where film thickness of the red color transfer layer 50R, the green color transfer layer 50G, and the blue color transfer layer 50B is uniform are transferred by satisfying the relationship of Wd>Ws. Furthermore, when a width of a light-heat conversion layer 43 is set up to be Wt, it is preferable that the relationship of Ws
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that in a printing device printing visible information on a label surface of a disk like recording medium which is rotationally driven by ejecting ink drops from an ejection nozzle provided on a printing head, it is difficult to adapt the ejection frequency of the ink drops to the optical disk rotationally driven at high speed and satisfactory printing quality can not be obtained since rotational speed of a spindle motor is lowered and its rotation is not stabilized when the optical disk is rotationally driven at a speed corresponding to a prescribed ejection frequency. SOLUTION: A print control part 53 is provided, ejecting the ink drops from the printing head 21 with a prescribed ejection frequency and controlling the ink drops so that the ink drop is dropped at prescribed intervals in a peripheral direction in a first rotation (Fig.14A) of an optical disk 101 and the ink drop is dropped on a part left in the first rotation in a second periphery (Fig.14B). COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a recording medium drive apparatus and a method of printing a label surface for printing visible information on the label surface of an optical disk. SOLUTION: The recording medium drive apparatus comprises a recording and/or reproducing part 140 which at least records a data signal onto a recording surface of a recording medium or reproduces the data signal from the recording surface; a printing part 110 which prints the visible information on a main surface different from the recording surface of the recording medium by an ink jet system; a driver 134 which drives the recording medium; and a rotation control part 180 which switches the driving speed of the driver depending on a printing mode for printing the visible information on the main surface or a recording or reproducing mode for recording or reproducing the data signal on the recording surface. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To enable it to sharply reduce the space which is needed for the electrical connection of a head module. SOLUTION: A head module comprises two or more head chips 20 wherein an electrode to be electrically connected with a control substrate is mounted, a nozzle sheet 25 wherein a nozzle has been formed and two pieces of flexible wiring substrate 3 with wiring for electrically connecting the electrode of each head chip 20 with the connector of the control substrate. For each flexible wiring substrate 3, one end of the wiring is electrically connected with the electrode of each head chip 20, and the other end serves as an interposition terminal part 3b for the connector of the control substrate. The interposition terminal part 3b of each flexible wiring substrate 3 is arranged so as to be located at the position shifted mutually between each flexible wiring substrate 3. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To record/play a disk and to perform printing on a print surface of the disk. SOLUTION: This recorder and/or player is provided with a disk tray 3 for rotatably holding an optical disk 10, wherein one surface disposed on the device main body 2 is a recording/reproducing surface 10b and the other surface is the print surface 10c, a tray moving mechanism 4 for moving the disk tray 3 over between the inside and outside of the device main body 2 through an opening part 12 of the device main body 2, a recording/playing part 5 arranged at a side facing the recording/reproducing surface 10b of the optical disk 10 held by the disk tray to perform recording/playing of the optical disk 10 at a recording/playing position at which the disk tray 3 is housed in the device main body 2, and a printing part 6 arranged at a side facing the print surface 10c of the optical disk 10 held by the disk tray 3 at a position going along the opening part 12 in the device main body 2 to print visible data on the print surface 10c of the optical disk 10. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To prevent a head module from coming into contact with a liquid by sealing an exposed part of a wiring substrate by a simple constitution, and also to reduce manufacturing costs. SOLUTION: An electrode 23 of a head chip 20 is exposed from a region not covered by a nozzle sheet 25 of a head chip positioning hole. A flexible wiring substrate 3 is arranged to cover the exposed electrode 23 of the head chip 20 at the side of a face of a module frame 11 where the nozzle sheet 25 is prepared. An electrode (tip of a wiring pattern 3a) of the flexible wiring substrate 3 is electrically connected with the electrode 23 of the head chip 20 via an anisotropic conductive film 28. At the same time, the wiring pattern 3a of the flexible wiring substrate 3 exposed from a gap between the head chip 20 and the module frame 11 is sealed by the anisotropic conductive film 28. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To substantially improve the convenience by making the removing work with a head module unit easier. SOLUTION: The apparatus has a head frame 2 wherein head module arranging holes which hold two or more head modules have been formed. For buffer tanks communicating with the ink liquid chambers of all head chips, the buffer tanks located in series in the module arranging holes are connected each other by a U-tube 13. A control board 4 with a connector 4a for electrically connecting to the head module is arranged so as to cover all buffer tanks, and the substrate has a notch 4b which lets a flexible wiring board 3 for electrically connecting an electrode of the head chip and the connector 4a of the control substrate 4 pass and an opening 4c enabling the U-tube 13 to be removed by an outside handling. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To adopt an ACF connection which connects via an anisotropic conductive film, and to prevent leakage and sealing defects of a sealant from occurring. SOLUTION: Each nozzle sheet 25 is arranged to a head chip stationing hole 11b to have nozzles 25a positioned within the head chip stationing hole 11b, and to cover a part of the region of the head chip stationing hole 11b. At the same time, the nozzle sheet 25 is formed in a size of a necessary minimum to cover a part of the region of the head chip stationing hole 11b. A flexible wiring board 3 has its electrode electrically connected to an electrode of a head chip 20. At the same time, the flexible wiring board 3 is arranged to cover the exposed electrode of the head chip 20 at the face side where the nozzle sheet 25 is set. Moreover, the flexible wiring board 3 has projections 3a overlapped on the nozzle sheet 25 at both ends in a longitudinal direction of the nozzle sheet 25. The overlapped parts are bonded to the nozzle sheet 25. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To let electric charges of a nozzle sheet discharge outside when the nozzle sheet is charged without costs being raised in the case of using a plurality of the nozzle sheets. SOLUTION: The nozzle sheet 25 is arranged to have a nozzle 25a positioned within a head chip stationing hole to each head chip stationing hole at one side face of a module frame 11. The module frame 11 and the nozzle sheet 25 are both formed of an electrically conductive material and bonded with an electrically conductive adhesive 14 so that both can be electrically conductive to each other. Each head chip 20 is arranged at each head chip stationing hole from the other side face of the module frame 11 so that a heating resistor 22 of the head chip 20 and the nozzle 25 are set at opposed positions. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To reduce manufacturing costs and to smooth a nozzle surface. SOLUTION: The manufacturing method comprises a first process of sticking each nozzle sheet 25 so that a nozzle 25a is positioned within a head chip stationing hole and covers a part of the region of the head chip stationing hole at one side face of a module frame 11 under a first temperature environment, a second process of sticking each head chip 20 to each head chip stationing hole from the other side face of the module frame 11 under a second temperature environment lower than the first temperature environment, a third process of attaching a flexible wiring board 3 to the face side of the module frame 11 where the nozzle sheet 25 is fitted so that an electrode of the flexible wiring board 3 and an electrode 23 of the head chip 20 are electrically connected with each other, and a fourth process of coating the nozzle sheet 25 stuck to the module frame 11 and an end part of the flexible wiring board 3 with a protecting cover 30. COPYRIGHT: (C)2007,JPO&INPIT