公开(公告)号：JP2013105144A

公开(公告)日：2013-05-30

申请号：JP2011250716

申请日：2011-11-16

Applicant: Sony Corp ,  ソニー株式会社

Inventor： TANIGAWA TORU

IPC: G09F9/30 ,  G02B1/10 ,  G02B1/11 ,  G02B1/14 ,  G02F1/1335 ,  G02F1/1343 ,  G09F9/00

CPC classification number: G09G3/00 ,  G02F1/133308 ,  G02F1/133502 ,  G02F1/167 ,  G02F2001/133311 ,  H01L27/32 ,  H01L51/5253

Abstract: PROBLEM TO BE SOLVED: To provide a display device having improved moisture-proof performance and having a picture frame made narrowed.SOLUTION: A display includes: a drive substrate having a display region and a bonding region around the display region; a display layer provided on the display region; a surface film disposed so as to face a display surface of the display layer; and a moisture proof film interposed between the display layer and the surface film while being in contact with the drive substrate in the bonding region, and sealing the display layer from and to the drive substrate.

Abstract translation: 要解决的问题：提供一种具有改善的防潮性能并且使得缩小图片框的显示装置。 解决方案：显示器包括：具有显示区域和显示区域周围的接合区域的驱动基板; 设置在显示区域上的显示层; 以与所述显示层的显示面相对的方式配置的表面膜; 以及在接合区域与驱动基板接触的同时在显示层与表面膜之间插入防潮膜，并且将显示层与驱动基板密封。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2013044860A

公开(公告)日：2013-03-04

申请号：JP2011181360

申请日：2011-08-23

Applicant: Sony Corp ,  ソニー株式会社

Inventor： YONEYA NOBUHIDE ,  NAKAMURA HIROSHI ,  TANIGAWA TORU ,  KUMON TETSUSHI

IPC: G02F1/1339

CPC classification number: G02F1/1333 ,  G02F1/133305 ,  G02F2001/133311 ,  G02F2201/501 ,  G02F2202/28

Abstract: PROBLEM TO BE SOLVED: To provide a display which can prevent intrusion of water to ensure the display performance.SOLUTION: A display includes: a display substrate including liquid crystal; a driving substrate driving the display substrate; and a damp-proof layer continuously provided along the top face and side faces of the display substrate, and the top face of the driving substrate. The damp-proof layer is adhered to the display substrate and the driving substrate through an adhesive layer provided along the top face and side faces of the display substrate, and the top face of the driving substrate.

Abstract translation: 要解决的问题：提供可以防止水侵入以保证显示性能的显示器。 解决方案：显示器包括：包括液晶的显示基板; 驱动显示基板的驱动基板; 以及沿着显示基板的顶面和侧面以及驱动基板的顶面连续设置的防潮层。 防潮层通过沿着显示基板的顶面和侧面以及驱动基板的顶面设置的粘合层粘附到显示基板和驱动基板。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2007196455A

公开(公告)日：2007-08-09

申请号：JP2006015581

申请日：2006-01-24

Applicant: Sony Corp ,  ソニー株式会社

Inventor： ANDO MASATO ,  TANIGAWA TORU

IPC: B41J2/05

Abstract: PROBLEM TO BE SOLVED: To enable it to sharply reduce the space which is needed for the electrical connection of a head module. SOLUTION: A head module comprises two or more head chips 20 wherein an electrode to be electrically connected with a control substrate is mounted, a nozzle sheet 25 wherein a nozzle has been formed and two pieces of flexible wiring substrate 3 with wiring for electrically connecting the electrode of each head chip 20 with the connector of the control substrate. For each flexible wiring substrate 3, one end of the wiring is electrically connected with the electrode of each head chip 20, and the other end serves as an interposition terminal part 3b for the connector of the control substrate. The interposition terminal part 3b of each flexible wiring substrate 3 is arranged so as to be located at the position shifted mutually between each flexible wiring substrate 3. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了使其能够急剧减小头模块的电连接所需的空间。 解决方案：头模块包括两个或更多个头芯片20，其中安装有与控制基板电连接的电极，其中已经形成喷嘴的喷嘴板25和具有布线的两个柔性布线基板3 将每个头芯片20的电极与控制基板的连接器电连接。 对于每个柔性布线基板3，布线的一端与每个头芯片20的电极电连接，另一端用作用于控制基板的连接器的插入端子部分3b。 每个柔性布线基板3的插入端子部分3b布置成位于每个柔性布线基板3之间相互移动的位置。版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2007070668A

公开(公告)日：2007-03-22

申请号：JP2005257131

申请日：2005-09-05

Applicant: Sony Corp ,  ソニー株式会社

Inventor： TANIGAWA TORU ,  MURAKAMI TAKAAKI ,  KAYABA SHINJI ,  NAKAHIRA HIROBUMI ,  UNO MASAYUKI

IPC: C25D1/20 ,  C25D1/08

Abstract: PROBLEM TO BE SOLVED: To easily peel a nozzle sheet of an electrocast product from even a mother die that is not pretreated, without damaging the nozzle sheet in a short period of time. SOLUTION: An apparatus for manufacturing the nozzle sheet having a nozzle for discharging a liquid formed therein comprises: the mother die 30 for producing an electrocast layer 34 having the nozzle formed thereon, on the upper surface through electrocasting treatment; a handle 41 for moving the mother die 30 in a longitudinal direction of the electrocast layer 34; and a bending section 43 for peeling at least one end of the electrocast layer 34 from the mother die 30, while bending the mother die 30 which is moved by the handle 41 in a downward direction. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：即使是未预处理的母模，也能够在短时间内不损坏喷嘴片而容易地剥离静电产品的喷嘴片。 解决方案：一种用于制造具有用于排出其中形成的液体的喷嘴的喷嘴片的设备，包括：母模30，用于通过电铸处理在上表面上形成其上形成有喷嘴的电铸层34; 手柄41，用于沿着电铸层34的长度方向移动母模30; 以及用于从母模30剥离电铸层34的至少一端的弯曲部43，同时沿着向下的方向弯曲由手柄41移动的母模30。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2007062260A

公开(公告)日：2007-03-15

申请号：JP2005253293

申请日：2005-09-01

Applicant: Sony Corp ,  ソニー株式会社

Inventor： TANIGAWA TORU ,  ANDO MASATO

IPC: B41J2/05 ,  B41J2/16

Abstract: PROBLEM TO BE SOLVED: To prevent a head module from coming into contact with a liquid by sealing an exposed part of a wiring substrate by a simple constitution, and also to reduce manufacturing costs.
SOLUTION: An electrode 23 of a head chip 20 is exposed from a region not covered by a nozzle sheet 25 of a head chip positioning hole. A flexible wiring substrate 3 is arranged to cover the exposed electrode 23 of the head chip 20 at the side of a face of a module frame 11 where the nozzle sheet 25 is prepared. An electrode (tip of a wiring pattern 3a) of the flexible wiring substrate 3 is electrically connected with the electrode 23 of the head chip 20 via an anisotropic conductive film 28. At the same time, the wiring pattern 3a of the flexible wiring substrate 3 exposed from a gap between the head chip 20 and the module frame 11 is sealed by the anisotropic conductive film 28.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：通过简单的结构，通过用布线基板的露出部分密封来防止头模块与液体接触，并且还降低制造成本。 解决方案：头芯片20的电极23从未被头芯片定位孔的喷嘴片25覆盖的区域露出。 柔性布线基板3布置成覆盖头芯片20的暴露的电极23的模块框架11的制备喷嘴片25的表面的一侧。 柔性布线基板3的电极（布线图案3a的前端）经由各向异性导电膜28与磁头芯片20的电极23电连接。同时，柔性布线基板3的布线图案3a 从头芯片20和模块框架11之间的间隙露出的各向异性导电膜28被密封。（C）2007，JPO＆INPIT

公开(公告)号：JP2007021909A

公开(公告)日：2007-02-01

申请号：JP2005207584

申请日：2005-07-15

Applicant: Sony Corp ,  ソニー株式会社

Inventor： TANIGAWA TORU ,  ANDO MASATO ,  TAKASHIMA TAKESHI

IPC: B41J2/01 ,  B41J2/175

Abstract: PROBLEM TO BE SOLVED: To substantially improve the convenience by making the removing work with a head module unit easier.
SOLUTION: The apparatus has a head frame 2 wherein head module arranging holes which hold two or more head modules have been formed. For buffer tanks communicating with the ink liquid chambers of all head chips, the buffer tanks located in series in the module arranging holes are connected each other by a U-tube 13. A control board 4 with a connector 4a for electrically connecting to the head module is arranged so as to cover all buffer tanks, and the substrate has a notch 4b which lets a flexible wiring board 3 for electrically connecting an electrode of the head chip and the connector 4a of the control substrate 4 pass and an opening 4c enabling the U-tube 13 to be removed by an outside handling.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：通过使头部模块单元的移除工作更容易，大大提高了方便性。 解决方案：该装置具有头架2，其中已经形成了保持两个或更多个头模块的头模块配置孔。 对于与所有头部芯片的墨水液室连通的缓冲罐，串联在模块配置孔中的缓冲罐通过U形管13彼此连接。具有用于电连接到头部的连接器4a的控制板4 模块布置成覆盖所有缓冲罐，并且基板具有凹口4b，其使用于将头芯片的电极和控制基板4的连接器4a电连接的柔性布线板3通过，并且能够 U型管13由外部处理除去。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2007007948A

公开(公告)日：2007-01-18

申请号：JP2005190059

申请日：2005-06-29

Applicant: Sony Corp ,  ソニー株式会社

Inventor： ANDO MASATO ,  TANIGAWA TORU

IPC: B41J2/05

Abstract: PROBLEM TO BE SOLVED: To adopt an ACF connection which connects via an anisotropic conductive film, and to prevent leakage and sealing defects of a sealant from occurring.
SOLUTION: Each nozzle sheet 25 is arranged to a head chip stationing hole 11b to have nozzles 25a positioned within the head chip stationing hole 11b, and to cover a part of the region of the head chip stationing hole 11b. At the same time, the nozzle sheet 25 is formed in a size of a necessary minimum to cover a part of the region of the head chip stationing hole 11b. A flexible wiring board 3 has its electrode electrically connected to an electrode of a head chip 20. At the same time, the flexible wiring board 3 is arranged to cover the exposed electrode of the head chip 20 at the face side where the nozzle sheet 25 is set. Moreover, the flexible wiring board 3 has projections 3a overlapped on the nozzle sheet 25 at both ends in a longitudinal direction of the nozzle sheet 25. The overlapped parts are bonded to the nozzle sheet 25.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：采用通过各向异性导电膜连接的ACF连接，并防止密封剂的泄漏和密封缺陷发生。

解决方案：每个喷嘴片25布置在头部芯片固定孔11b上，以便具有位于头部芯片固定孔11b内的喷嘴25a，并且覆盖头部芯片固定孔11b的一部分区域。 同时，喷嘴片25形成为必要的最小尺寸以覆盖头部芯片固定孔11b的一部分区域。 柔性布线板3的电极与头芯片20的电极电连接。同时，柔性布线板3布置成在喷嘴片25的表面侧覆盖头部芯片20的暴露电极 被设置。 此外，柔性布线基板3在喷嘴片25的长度方向上的两端具有与喷嘴片25重叠的突起部3a。重叠部分与喷嘴片25接合。（C）2007， JPO＆INPIT

公开(公告)号：JP2007001193A

公开(公告)日：2007-01-11

申请号：JP2005185285

申请日：2005-06-24

Applicant: SONY CORP

Inventor： TANIGAWA TORU ,  ANDO MASATO

IPC: B41J2/05

Abstract: PROBLEM TO BE SOLVED: To let electric charges of a nozzle sheet discharge outside when the nozzle sheet is charged without costs being raised in the case of using a plurality of the nozzle sheets. SOLUTION: The nozzle sheet 25 is arranged to have a nozzle 25a positioned within a head chip stationing hole to each head chip stationing hole at one side face of a module frame 11. The module frame 11 and the nozzle sheet 25 are both formed of an electrically conductive material and bonded with an electrically conductive adhesive 14 so that both can be electrically conductive to each other. Each head chip 20 is arranged at each head chip stationing hole from the other side face of the module frame 11 so that a heating resistor 22 of the head chip 20 and the nozzle 25 are set at opposed positions. COPYRIGHT: (C)2007,JPO&INPIT

公开(公告)号：JP2007001192A

公开(公告)日：2007-01-11

申请号：JP2005185284

申请日：2005-06-24

Applicant: SONY CORP

Inventor： TANIGAWA TORU ,  ANDO MASATO ,  MATSUO YOSHIYUKI

IPC: B41J2/16

Abstract: PROBLEM TO BE SOLVED: To reduce manufacturing costs and to smooth a nozzle surface. SOLUTION: The manufacturing method comprises a first process of sticking each nozzle sheet 25 so that a nozzle 25a is positioned within a head chip stationing hole and covers a part of the region of the head chip stationing hole at one side face of a module frame 11 under a first temperature environment, a second process of sticking each head chip 20 to each head chip stationing hole from the other side face of the module frame 11 under a second temperature environment lower than the first temperature environment, a third process of attaching a flexible wiring board 3 to the face side of the module frame 11 where the nozzle sheet 25 is fitted so that an electrode of the flexible wiring board 3 and an electrode 23 of the head chip 20 are electrically connected with each other, and a fourth process of coating the nozzle sheet 25 stuck to the module frame 11 and an end part of the flexible wiring board 3 with a protecting cover 30. COPYRIGHT: (C)2007,JPO&INPIT

公开(公告)号：JP2007001191A

公开(公告)日：2007-01-11

申请号：JP2005185283

申请日：2005-06-24

Applicant: SONY CORP

Inventor： TANIGAWA TORU ,  ANDO MASATO

IPC: B41J2/05 ,  B41J2/16

Abstract: PROBLEM TO BE SOLVED: To uniform a distance between a module frame and a nozzle sheet. SOLUTION: The nozzle sheet 25 is arranged to have a nozzle 25a positioned within a head chip stationing hole to each head chip stationing hole at one side face of the module frame 11. At the same time, the nozzle sheet 25 is bonded to make a layer thickness a thickness of one particle 14a with an adhesive 14 which contains a plurality of particles 14a formed uniform in their particle sizes. Each head chip 20 is arranged at each head chip stationing hole from the other side face of the module frame 11 so that a heating resistor 22 of the head chip 20 and the nozzle 25a are set at opposed positions. COPYRIGHT: (C)2007,JPO&INPIT