公开(公告)号：JP2002042090A

公开(公告)日：2002-02-08

申请号：JP2000232240

申请日：2000-07-31

Applicant: TOPPAN FORMS CO LTD

Inventor： KODAMA KAZUNARI ,  YAMAGAMI TAKESHI ,  KAGAMI YASUO ,  ENDO YASUHIRO ,  MARUYAMA TORU

IPC: B42D15/10 ,  C08K5/36 ,  C08L63/00 ,  C08L67/00 ,  C08L71/00 ,  C08L101/00 ,  G06K19/07 ,  G06K19/077 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To manufacture a non-contact data transmitting and receiving element at a reduced cost, preventing breakage or separation of an IC chip by enabling a sealant to be deformed at the application of a bending or twisting force to a base material, and allowing the sealant to cure readily. SOLUTION: The IC chip 9 mounted on an antenna 2 located on the base material 1 of the non-contact data transmitting and receiving element is sealed with the sealant 10 whose essential components are a photo-cation curing type crosslinked resin composition and a flexible additive having a fatty acid polyester or a fatty acid polyether structure in a principal chain.

公开(公告)号：JP2001217629A

公开(公告)日：2001-08-10

申请号：JP2000023414

申请日：2000-01-31

Applicant: TOPPAN FORMS CO LTD

Inventor： ENDO YASUHIRO ,  NAKAHARA KOSUKE

IPC: G06K19/07 ,  G06K19/077 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q7/00

Abstract: PROBLEM TO BE SOLVED: To obtain a non contact type data transmitting and receiving body high in quality by obtaining an antenna main body, which has low resistance and bending resistance, improving the reliability of conductive connection with a bump of an IC chip at one continuous land part and an independent land part where the IC chip is mounted, and preventing the distance between the continuous lands part and land part, where the IC chip is mounted, from varying. SOLUTION: On a base material 1, the antenna body 4 and an insulation part 6, are provided, thereafter the jumper 8, continuous land part 2 and independent land part 5 are provided.

公开(公告)号：JP2001217614A

公开(公告)日：2001-08-10

申请号：JP2000023421

申请日：2000-01-31

Applicant: TOPPAN FORMS CO LTD

Inventor： MARUYAMA TORU ,  ENDO YASUHIRO ,  KAGAMI YASUO ,  YAMAGAMI TAKESHI

IPC: G06K19/077 ,  G06K19/07 ,  H01P5/08 ,  H01Q1/38 ,  H01Q7/02

Abstract: PROBLEM TO BE SOLVED: To make proper the connection fixation of an IC chip to an antenna by eliminating the troublesomeness of mounting and preventing the IC chip and antenna from being disconnected electrically. SOLUTION: A connection body 6, which corresponds to one antenna end part and a connection body 6 which corresponds to the other antenna end part, are formed of a conductive adhesives or a conductive elastomer and connected to an antenna end part 3, without being connected to each other, while being put close to each other and insulated from a loop part 2, and the IC chip 7 which is fitted across the connection bodies is connected to the antenna 1 via the connection bodies 6.

公开(公告)号：JP2001217374A

公开(公告)日：2001-08-10

申请号：JP2000023415

申请日：2000-01-31

Applicant: TOPPAN FORMS CO LTD

Inventor： MARUYAMA TORU ,  ENDO YASUHIRO ,  KAGAMI YASUO

IPC: H01L25/00 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To connect and fix an IC chip correctly to an antenna by eliminating intricacy at the time of mounting and preventing electrical disconnection between bumps and a conductive layer. SOLUTION: An IC chip is attached to an antenna by applying a conductive adhesive 7 to a conductive layer 2 in a part for fixing the IC chip at the positions corresponding to bumps.

公开(公告)号：JP2001216483A

公开(公告)日：2001-08-10

申请号：JP2000023416

申请日：2000-01-31

Applicant: TOPPAN FORMS CO LTD

Inventor： MARUYAMA TORU ,  ENDO YASUHIRO ,  KAGAMI YASUO ,  YAMAGAMI TAKESHI

IPC: G06K19/07 ,  B42D15/10 ,  G06K19/077 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q7/00

Abstract: PROBLEM TO BE SOLVED: To make proper the connection and fixture of an IC chip to an antenna by preventing a bump and a conductive layer form being electrically disconnected. SOLUTION: A conductive adhesive agent 6 is provided at a position corresponding to the bump on a conductive layer 2 in an IC chip attaching part, an anisotropic conductive adhering member 4 or insulated adhering member 6 is provided thereon and the IC chip is adhered to the antenna by pressing under the heating state.

公开(公告)号：JP2001102837A

公开(公告)日：2001-04-13

申请号：JP28072699

申请日：1999-09-30

Applicant: TOPPAN FORMS CO LTD

Inventor： MARUYAMA TORU ,  ENDO YASUHIRO ,  KAGAMI YASUO

IPC: G06K19/077 ,  H01Q1/38 ,  H01Q7/00

Abstract: PROBLEM TO BE SOLVED: To easily provide a non-contact data transmitter/receiver, which improves the capacitance of an antenna and controls the capacitance without newly designing the antenna. SOLUTION: A capacitance control means 3 having a conductor 8 of the same pattern as an antenna pattern in a part of an antenna 6 is adhered on an insulator 7 being overlapped on a substrate 4, a conductor 5 in a part of the antenna 6 and the conductor 8 of the capacitance control means 3 are arranged correspondently through an insulating material A, and the conductor 8 of the capacitance control means 3 and the antenna 6 are conducted.

公开(公告)号：JP2001034732A

公开(公告)日：2001-02-09

申请号：JP20329999

申请日：1999-07-16

Applicant: TOPPAN FORMS CO LTD

Inventor： MARUYAMA TORU ,  ENDO YASUHIRO ,  KAGAMI YASUO

IPC: G06K19/077 ,  B42D15/10 ,  G06K19/07 ,  H01Q1/38

Abstract: PROBLEM TO BE SOLVED: To obtain an antenna which is formed by transferring a metal evaporated layer and is at a low cost and has high sensitivity. SOLUTION: This antenna forming method applies an adhesive 9 with an antenna-shaped pattern on a holding base substance 2, sticks a metal evaporated transfer sheet 6 to the substance 2 through the adhesive 9, strips the sheet 6 after the adhesive cures and transfers the metal evaporated layer of the sheet 6 on the substance 2 with the antenna-shaped pattern.

公开(公告)号：JP2001015555A

公开(公告)日：2001-01-19

申请号：JP18687399

申请日：1999-06-30

Applicant: TOPPAN FORMS CO LTD

Inventor： ENDO YASUHIRO

IPC: H05K3/32 ,  C09J5/00 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To make simple the manufacturing process of mechanical equipment or a wiring board constituted by mounting a bare IC chip on a circuit, by emitting electromagnetic waves upon the bare IC chip from the side opposite to the arranging side of the chip while the chip is press-contacted with a base material. SOLUTION: A circuit 1 is formed on a base material 2, and an insulating adhering section 5 for the terminals 3 of a bare IC chip 3 is formed by printing an insulating adhesive substance B. Then terminal adhering sections 6 are formed in the circuit 1 so that the sections 6 may necessarily come into contact with the terminals 4 of the chip 3, by printing a conductive adhesive substance A until thicknesses of the sections 6 become thicker than that of the section 5. Thereafter, the chip 3 is placed on the base material 2 by aligning the chip 3 with the insulating adhering section 4 and terminal adhering sections 6 and press-contacted with the material 2. While the chip 3 is press-contacted with the material 3, electromagnetic waves are emitted upon the chip 3 from the side opposite to the arranging side of the chip 3. Thus, the chi 3 is mounted on the circuit 1.

公开(公告)号：JP2000319593A

公开(公告)日：2000-11-21

申请号：JP12531299

申请日：1999-04-30

Applicant: TOPPAN FORMS CO LTD

Inventor： ENDO YASUHIRO ,  KAGAMI YASUO ,  MARUYAMA TORU

IPC: C09D201/00 ,  C09D5/24

Abstract: PROBLEM TO BE SOLVED: To provide a curing method effectively curing a conductive ink used in printing a circuit or the like on a substrate. SOLUTION: The curing is carried out by using an ultraviolet irradiation lamp which accompanies emission of infrared rays, for example, a metal halide lamp, high-pressure mercury-vapor lamp or xenon lamp, as the light source and curing is carried out by the light source irradiating the conductive ink.

公开(公告)号：JP2000234075A

公开(公告)日：2000-08-29

申请号：JP3741599

申请日：1999-02-16

Applicant: TOPPAN FORMS CO LTD

Inventor： ENDO YASUHIRO ,  KAGAMI YASUO ,  MARUYAMA TORU

IPC: H05K3/12 ,  C09D11/033 ,  C09D11/10 ,  C09D11/101 ,  C09D11/103 ,  C09D11/104 ,  C09D11/52

Abstract: PROBLEM TO BE SOLVED: To efficiently fix a thermosetting conductive ink onto a paper substrate without discoloring the substrate by applying the ink onto the substrate in a certain pattern and thermally curing the ink by the irradiation with near- infrared rays. SOLUTION: A thermosetting conductive ink 2 is applied in a certain pattern to a paper substrate 1 by using a printing technique, The side 3 of the substrate 1 with the ink 2 applied thereto is irradiated with near-infrared rays 5 from a light source 4, a near-infrared lamp, to cure the ink 2. The surface resistance of a thermosetting conductive ink equivalent to that obtained by thermal curing by heating at 150 deg.C for 30 min is achieved by setting the irradiation time with near-infrared rays to about 10 sec. Therefore, paper, easily discolorable by heat, can be used as a substrate. Intermittent irradiation with near-infrared rays 5 is preferable to control the reachable temperature of the ink. Preferably, the irradiation is stopped when the temperature of the ink reaches 200 deg.C.