Patent search cpc:"C08K2201/002" Page 7

61.

发明申请
PRECIPITATED SILICA USED AS REINFORCING FILLER FOR ELASTOMERS 审中-公开
Title translation: 用于弹性体的增强填料的预处理二氧化硅

公开(公告)号：US20150010757A1

公开(公告)日：2015-01-08

申请号：US14470098

申请日：2014-08-27

Applicant: RHODIA CHIMIE

Inventor： Yvonick CHEVALLIER , Philippe COCHET , Patrick FOURRE

IPC: C08K7/26 , C08K7/18

CPC classification number: C08K7/26 , B82Y30/00 , C01B33/193 , C01P2004/32 , C01P2004/50 , C01P2004/51 , C01P2004/61 , C01P2004/62 , C01P2004/64 , C01P2006/11 , C01P2006/12 , C01P2006/14 , C01P2006/16 , C01P2006/17 , C01P2006/19 , C01P2006/22 , C08K3/36 , C08K7/18 , C08K2201/002 , C08K2201/003 , C08K2201/005 , C08K2201/006 , C09C1/30 , Y10T428/2982 , C08L21/00

Abstract: The invention relates to a novel process for the preparation of precipitated silica which can be used as a reinforcing filler for elastomers. The invention also relates to novel precipitated silicas in the form of powder, granules or, preferably, substantially spherical beads, these silicas being characterized in that they have a BET specific surface of between 185 and 250 m2/g, a CTAB specific surface of between 180 and 240 m2/g, and a pore distribution such that the pore volume V2 made up of the pores with a diameter of between 175 and 275 Å represents less than 50% of the pore volume V1 made up of the pores with diameters of less than or equal to 400 Å, a pore volume (Vd1), made up of the pores with a diameter of less than 1 μm, of greater than 1.65 cm3/g, a fineness value (F.V.) of between 70 and 100 Å, and a content of fines (τf), after deagglomerability with ultrasound, of at least 50%.

Abstract translation: 本发明涉及可用作弹性体增强填料的沉淀二氧化硅的制备方法。本发明还涉及粉末，颗粒或优选基本上为球形珠形式的新型沉淀二氧化硅，其特征在于它们的BET比表面积为185-250m2 / g，CTAB比表面积介于 180和240m 2 / g，并且孔分布使得由直径在175和275之间的孔构成的孔体积V2小于由具有较小直径的孔组成的孔体积V1的50％由直径小于1μm的孔，大于1.65cm 3 / g，细度值（FV）在70和100之间的孔组成的孔体积（Vd1），以及在超声消解后的细粉（τf）含量至少为50％。

62.

发明申请
COMPOSITIONS AND METHODS FOR SELF-ASSEMBLY OF POLYMERS WITH COMPLEMENTARY MACROSCOPIC AND MICROSCOPIC SCALE UNITS 有权
Title translation: 具有完全宏观和微观尺度单位的聚合物自组装的组合物和方法

公开(公告)号：US20140303320A1

公开(公告)日：2014-10-09

申请号：US14131701

申请日：2012-07-10

Applicant: Thomas E. Schaus , Peng Yin , Wei Sun , David Yu Zhang

Inventor： Thomas E. Schaus , Peng Yin , Wei Sun , David Yu Zhang

IPC: C08G77/38 , C08G77/388

CPC classification number: C08G83/008 , C08G85/002 , C08G85/004 , C08K2201/002 , C08K2201/01 , H01F1/01 , H01F1/40 , H01F1/42

Abstract: The invention provides compositions and methods relating to self-assembly of structures of various size and shape completxity. The composition include synthetic single-stranded polymers having a backbone and pre-determined linear arrangement of monomers.

Abstract translation: 本发明提供了与各种尺寸和形状完整性的结构的自组装有关的组合物和方法。该组合物包括具有骨架和单体预定线性排列的合成单链聚合物。

63.

发明申请
HIGHLY THERMALLY CONDUCTIVE RESIN MOLDED ARTICLE, AND MANUFACTURING METHOD FOR SAME 审中-公开
Title translation: 高导热树脂模制品及其制造方法

公开(公告)号：US20130202882A1

公开(公告)日：2013-08-08

申请号：US13878714

申请日：2011-10-11

Applicant: Soichi Uchida , Kazuaki Matsumoto , Masashi Sakaguchi , Yasushi Noda , Syoji Ubukata

Inventor： Soichi Uchida , Kazuaki Matsumoto , Masashi Sakaguchi , Yasushi Noda , Syoji Ubukata

IPC: C08L67/00 , C08K7/00

CPC classification number: C08L67/00 , B29C45/0013 , B29K2995/0013 , C08K3/346 , C08K3/38 , C08K7/00 , C08K7/02 , C08K7/14 , C08K7/26 , C08K2003/382 , C08K2201/002 , C08K2201/005 , C08K2201/016 , Y10T428/249921 , Y10T428/268 , C08L67/02

Abstract: The present invention provides a highly thermally conductive resin molded article that satisfies all demands of a high thermal conductivity, an insulation property, a low density, a mechanical strength, a high flowability of a thin-walled molded article, less abrasion on a die used for manufacturing, and high whiteness. The highly thermally conductive resin molded article at least includes (A) thermoplastic polyester resin, (B) platy talc particles, and (C) a fiber reinforcement, and (B) platy talc particle content falls within a range between 10% by volume and 60% by volume, where the entire composition is 100% by volume, a number average particle size of the platy talc particles falls within a range between 20 μm and 80 μm, and the (B) platy talc particles are oriented in a surface direction of the highly thermally conductive resin molded article.

Abstract translation: 本发明提供一种高导热性树脂成型体，其满足薄壁成形品的高导热性，绝缘性，低密度，机械强度，高流动性等所有要求，对所使用的模具的磨损少用于制造和高白度。高导热性树脂成型体至少包含（A）热塑性聚酯树脂，（B）板状滑石粒子和（C）纤维增强体，（B）片状滑石粒子含量在10体积％以下的范围内， 60体积％，其中整个组成为100体积％，片状滑石颗粒的数均粒径落在20μm和80μm之间的范围内，（B）片状滑石颗粒在表面方向上取向的高导热性树脂成形体。

64.

发明授权
Semi-conductive silicone rubber composition 失效
Title translation: 半导电硅橡胶组合物

公开(公告)号：US06444323B1

公开(公告)日：2002-09-03

申请号：US09662040

申请日：2000-09-14

Applicant: Wataru Matsumoto , Tetsuya Nakamura , Koji Sawada

Inventor： Wataru Matsumoto , Tetsuya Nakamura , Koji Sawada

IPC: B32B2520

CPC classification number: C08K3/04 , C08K2201/002 , C08K2201/005 , C08K2201/006 , C08L83/04 , Y10T428/31663 , C08L2666/54

Abstract: A semi-conductive silicone rubber composition contains carbon black. The carbon black contains thermal black obtained by thermally cracking a natural gas and having a specific surface area—nitrogen absorption method of 8.0 to 10.0 m2/g, a dibutyl phthalate absorption number (dibutyl phthalate absorption number) of 30 to 40 cm3/100 g and an averaged particle size of 200 to 330 nm.

Abstract translation: 半导电硅橡胶组合物含有炭黑。炭黑含有热天然气热裂化，比表面积 - 氮吸收法为8.0〜10.0m2 / g，邻苯二甲酸二丁酯吸附值（邻苯二甲酸二丁酯吸收值）为30〜40cm 3 / 100g 平均粒径为200〜330nm。

65.

发明公开
MIXED FUNCTIONALIZED GRAPHENE STRUCTURE AND CORRESPONDING FIELD-EFFECT TRANSISTOR BIOSENSOR 审中-公开

公开(公告)号：US20240182669A1

公开(公告)日：2024-06-06

申请号：US18285867

申请日：2022-04-08

Applicant: Attenbio S.L.

Inventor： Amaia REBOLLO PIÑEIRO , María ARRASTUA CEBERIO

IPC: C08K3/04 , G01N27/414

CPC classification number: C08K3/042 , G01N27/4145 , G01N27/4146 , C08K2201/002

Abstract: The present invention relates a mixed functionalized graphene structure comprising a graphene surface; 1-pyrenebutanoic acid succinimidyl ester (PBASE) molecules; molecules of at least one type of polycyclic aromatic hydrocarbon (PAH) compounds; and biomolecules; wherein both the molecules of PBASE and the molecules of at least one type of PAH compounds are non-covalently linked to the graphene surface, wherein the biomolecules are linked to the PBASE molecules, and wherein the mixed functionalized graphene structure has a surface roughness (Rms) between around 0.01±1.00 μm and around 0.25±1.00 μm respect to the surface roughness (Rms) of non-functionalized graphene, wherein Rms is measured by atomic force microscopy (AFM). The present invention relates also to a method for preparing said mixed functionalized graphene structure, to a functionalized graphene structure obtainable by said method. Finally, the present invention relates to a Field-Effect Transistor (FET) chip comprising said mixed functionalized graphene structure, to an electronic device for biological sample analysis comprising said chip, to a method for electronic biological sample analysis by using said device and to the use of the mixed functionalized graphene structure in FET biosensors.

66.

发明授权
Resin spacer for chip stacking and packaging and preparation method thereof 有权

公开(公告)号：US11952487B2

公开(公告)日：2024-04-09

申请号：US17043736

申请日：2018-10-22

Applicant: SU ZHOU DREAM TECHNOLOGY CO., LTD.

Inventor： Guohong Yang

IPC: C08L63/00 , C08G59/40 , C08J5/24 , C08K3/04 , C08K3/22 , C08K3/36 , C08K7/14 , C08K13/04 , H01L23/29

CPC classification number: C08L63/00 , C08G59/4014 , C08J5/244 , C08J5/249 , C08K3/04 , C08K3/22 , C08K3/36 , C08K7/14 , C08K13/04 , H01L23/293 , C08K2003/2206 , C08K2003/2227 , C08K2201/002

Abstract: A resin spacer for chip stacking and packaging includes a fiber glass fabric used as a base material, a weight percent of the fiber glass fabric is 10-60 wt %; and the following components are attached to the fiber glass fabric as a percentage by the total weight of the resin spacer: 8-40 wt % of epoxy resin, 10-30 wt % of quartz powder, 2-10 wt % of aluminum oxide, 1-8 wt % of calcium oxide, and 1-8 wt % of curing agent. The resin spacer further includes a pigment. The pigment has a weight percent of 1-3 wt %, and the pigment is preferably at least one selected from white carbon black and pearl powder. The resin spacer is formed by mixing, impregnating, partially curing, stacking and pressing the resin material. The thickness of the resin spacer is 0.07-0.13 mm.

67.

发明公开
POLYAMIDE COMPOSITION AND ARTICLE MADE THEREFROM WITH IMPROVED MOLD SHRINKAGE 审中-公开

公开(公告)号：US20240052101A1

公开(公告)日：2024-02-15

申请号：US18264442

申请日：2022-02-25

Applicant: Solvay Specialty Polymers USA, LLC

Inventor： Lindsey ANDERSON , Vijay GOPALAKRISHNAN , Lee CARVELL

IPC: C08G69/26 , C08K3/40 , C08L77/06 , C08G69/10

CPC classification number: C08G69/265 , C08K3/40 , C08L77/06 , C08G69/10 , C08K2201/002 , C08G2120/00 , C08L2205/025 , C08K7/14

Abstract: Described herein is a polyamide composition comprising two polyamides and glass fiber, wherein one of the polyamides is a polyphthalamide formed by polycondensation from various monomers: dicarboxylic acid(s) with diamine(s) and/or amino acid(s), wherein at least one monomer contains a cyclohexyl group. It was surprisingly discovered that the polyamide composition has improved warpage and/or mold shrinkage properties, excellent mechanical performance and high Tg and/or Tm. Due to the excellent performance, the polyamide composition is suitable for molding and can be desirably incorporated into mobile electronic device applications.

68.

发明公开
THERMALLY CONDUCTIVE FILLER, THERMALLY-CONDUCTIVE COMPOSITE MATERIAL, WIRE HARNESS, AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE FILLER 审中-公开

公开(公告)号：US20230365852A1

公开(公告)日：2023-11-16

申请号：US18029870

申请日：2021-10-08

Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD. , KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION

Inventor： Naoyuki OSHIUMI , Takehiro HOSOKAWA , Kazuo NAKASHIMA , Hironobu RACHI , Takashi KAWAKAMI , Yusaku MAEDA , Makoto MIZOGUCHI

IPC: C09K5/14 , C08K9/02 , C08K7/28 , C08K7/06 , C03C17/32 , C03C17/00

CPC classification number: C09K5/14 , C08K9/02 , C08K7/28 , C08K7/06 , C03C17/32 , C03C17/007 , C08K2201/001 , C08K2201/002 , C03C2217/445 , C03C2217/475 , C03C2217/48 , C03C2218/113

Abstract: A thermally conductive filler can exhibit high thermal conductive properties with a reduced specific gravity, a thermally-conductive composite material and a wire harness contains such a thermally conductive filler, and a method manufactures a thermally conductive filler. A thermally conductive filler contains base particles and a coating layer coating the particles, the coating layer contains a gel-like substance that is bonded to the surfaces of the base particles through chemical bonding and coats the surfaces of the base particles, and a thermally-conductive substance that is dispersed in the layer of the gel-like substance and has a higher thermal conductivity and a larger specific gravity than the base particles and the gel-like substance. Also, a thermally-conductive composite material is obtained by dispersing the thermally conductive filler in a matrix material. Furthermore, a wire harness contains the thermally-conductive composite material.