公开(公告)号：US20150138420A1

公开(公告)日：2015-05-21

申请号：US14086507

申请日：2013-11-21

Applicant: STMicroelectronics Pte Ltd.

Inventor： Hk Looi ,  David Gani ,  Wee Chin Judy Lim ,  Bs Aw ,  Cheng-Hai Cheh

IPC: H04N5/225 ,  G02F1/1341 ,  G02F1/1345 ,  G02F1/1333 ,  G02F1/1343

CPC classification number: H04N5/2257 ,  G02F1/13452 ,  G03B3/10 ,  G03B5/00 ,  G03B17/02 ,  G03B2205/0046 ,  Y10T29/49117

Abstract: Electronics modules and methods of making electronics modules are provided. An electronics module includes a substrate having an electronic circuit mounted thereon, a lens mount affixed to the substrate, the lens mount having a lens assembly mounted therein, and a liquid crystal cell affixed to the lens mount over the lens assembly, the liquid crystal cell having electrical terminals, wherein the lens mount includes adhesive containment pockets that are filled with a conductive adhesive so as to contact the electrical terminals of the liquid crystal cell, wherein the adhesive containment pockets include contacts that are electrically connected to the substrate. In some embodiments, the electronics module is a camera module.

Abstract translation: 提供电子模块和制造电子模块的方法。 电子模块包括其上安装有电子电路的基板，固定到基板的透镜座，安装有透镜组件的透镜座，以及固定在透镜组件上方的透镜座的液晶单元，液晶盒 具有电端子，其中所述透镜座包括粘合剂容纳袋，其填充有导电粘合剂以便接触所述液晶单元的电端子，其中所述粘合剂容纳袋包括电连接到所述基板的触点。 在一些实施例中，电子模块是相机模块。

公开(公告)号：US09021557B2

公开(公告)日：2015-04-28

申请号：US13283381

申请日：2011-10-27

Applicant: Olivier Leneel

Inventor： Olivier Leneel

IPC: G06F21/00 ,  G06F21/34 ,  H04L29/06 ,  H04L9/08 ,  G06F21/44 ,  G06F21/62 ,  G06F21/60 ,  G06F15/16 ,  H04W12/08 ,  H04W12/00

CPC classification number: G06F21/34 ,  G06F15/16 ,  G06F21/44 ,  G06F21/445 ,  G06F21/60 ,  G06F21/606 ,  G06F21/62 ,  G06F21/6245 ,  H04L9/0816 ,  H04L9/0838 ,  H04L9/0861 ,  H04L9/0869 ,  H04L63/068 ,  H04L63/0853 ,  H04W12/00 ,  H04W12/08

Abstract: A system and method for realizing specific security features for a mobile device that may store sensitive and private data by providing secured communications to a paired remote device. In this respect, both the mobile device (which may be a mobile phone, for example) and the paired remote device (which may be a keychain, for example) include a SIM card that may have identification data stored therein. Once paired, the two devices may communicate encrypted security messages back and forth in order to implement various security measures to protect data and wireless communications. Such messages may be generated from initial information known only to each respective device such as a randomly generated offset number and a common time reference.

Abstract translation: 一种用于实现可通过向成对的远程设备提供安全通信来存储敏感和私有数据的移动设备的特定安全特征的系统和方法。 在这方面，移动设备（例如可以是移动电话）和成对的远程设备（可以是例如钥匙串）都包括可以具有存储在其中的识别数据的SIM卡。 一旦配对，两个设备可以来回传递加密的安全消息，以便实现各种安全措施来保护数据和无线通信。 这样的消息可以从仅对每个相应设备已知的初始信息生成，例如随机生成的偏移号和公共时间参考。

公开(公告)号：US09019688B2

公开(公告)日：2015-04-28

申请号：US13310466

申请日：2011-12-02

Applicant: Olivier Le Neel ,  Ravi Shankar

Inventor： Olivier Le Neel ,  Ravi Shankar

IPC: H01G7/04 ,  H01L23/522 ,  H01L49/02 ,  H01L23/34 ,  H01G4/33 ,  H01L27/06

CPC classification number: H01G7/04 ,  H01G4/33 ,  H01L23/345 ,  H01L23/5223 ,  H01L23/5228 ,  H01L27/0688 ,  H01L28/40 ,  H01L28/55 ,  H01L2924/0002 ,  Y10T29/43 ,  H01L2924/00

Abstract: The present disclosure is directed to a device and a method for achieving a precise capacitance of a capacitor. The method includes trimming a first capacitance of the capacitor to a second capacitance, the capacitor having a first conductive layer separated from a second conductive layer by a dielectric layer. Changing a first dielectric constant of the dielectric layer to a second dielectric constant, where the first dielectric constant corresponding to the first capacitance and the second dielectric constant corresponding to the second dielectric constant includes heating the dielectric layer above a threshold temperature for a time period. The heat is provided by either one of the plates of the capacitor or from a separate heater.

Abstract translation: 本公开涉及一种用于实现电容器的精确电容的装置和方法。 该方法包括将电容器的第一电容调整为第二电容，该电容器具有通过电介质层与第二导电层分离的第一导电层。 将电介质层的第一介电常数改变到第二介电常数，其中对应于第一电容的第一介电常数和对应于第二介电常数的第二介电常数包括将电介质层加热到阈值温度一段时间。 热量由电容器的任一个板或从单独的加热器提供。

公开(公告)号：US09019636B2

公开(公告)日：2015-04-28

申请号：US12980261

申请日：2010-12-28

Applicant: Jing-En Luan ,  Junyong Chen

Inventor： Jing-En Luan ,  Junyong Chen

IPC: G02B7/02

CPC classification number: G02B7/023 ,  G02B7/025

Abstract: Lens alignment apparatuses, methods and optical devices are disclosed. In accordance with various embodiments, a lens alignment apparatus may include at least one lens element positioned in a lens body. A lens alignment interface coupled to the lens element may be configured to permit the lens element to be angularly deflected relative to an axis of symmetry of the lens body. In other embodiments, a method of improving the resolution of an optical device may include translating a lens along an optical axis to maximize resolution at a first location, and determining a resolution in a second location in the imaging plane. The resolution in the second location may be improved by angularly deflecting the lens, and the position of the lens may then be fixed.

Abstract translation: 公开了透镜对准装置，方法和光学装置。 根据各种实施例，透镜对准装置可以包括定位在透镜体中的至少一个透镜元件。 耦合到透镜元件的透镜对准接口可以被配置为允许透镜元件相对于透镜主体的对称轴线成角度地偏转。 在其他实施例中，改进光学装置的分辨率的方法可以包括沿着光轴平移透镜以使第一位置处的分辨率最大化，以及确定成像平面中的第二位置中的分辨率。 可以通过使透镜成角度地偏转来改善第二位置中的分辨率，然后可以固定透镜的位置。

公开(公告)号：US09013012B2

公开(公告)日：2015-04-21

申请号：US13785938

申请日：2013-03-05

Applicant: STMicroelectronics Pte Ltd.

Inventor： Ravi Shankar ,  Olivier Le Neel ,  Shian Yeu Kam ,  Tien Choy Loh

IPC: H01L29/84 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00293 ,  B81B7/0041 ,  B81C2203/0136

Abstract: Embodiments of the present disclosure are related to MEMS devices having a suspended membrane that are secured to and spaced apart from a substrate with a sealed cavity therebetween. The membrane includes openings with sidewalls that are closed by a dielectric material. In various embodiments, the cavity between the membrane and the substrate is formed by removing a sacrificial layer through the openings. In one or more embodiments, the openings in the membrane are closed by depositing the dielectric material on the sidewalls of the openings and the upper surface of the membrane.

Abstract translation: 本公开的实施例涉及具有悬置膜的MEMS器件，其被固定到衬底上并与衬底间隔开密封腔。 膜包括具有由介电材料封闭的侧壁的开口。 在各种实施例中，通过从开口去除牺牲层来形成膜与衬底之间的空腔。 在一个或多个实施例中，通过将介电材料沉积在开口的侧壁和膜的上表面上来封闭膜中的开口。

公开(公告)号：US08999850B2

公开(公告)日：2015-04-07

申请号：US13339797

申请日：2011-12-29

Applicant: Ying Yu ,  Tien Choy Loh ,  Shian Yeu Kam

Inventor： Ying Yu ,  Tien Choy Loh ,  Shian Yeu Kam

IPC: H01L21/302 ,  H01L21/461 ,  C09K13/00 ,  H01L21/306

CPC classification number: C09K13/00 ,  H01L21/30608

Abstract: Methods and apparatus for etching materials using tetramethylammonium hydroxide (TMAH) are described. The methods may involve including an additive when applying the TMAH to the material to be etched. The additive may be a gas, and in some situations may be clean dry air. The clean dry air may be provided with the TMAH to minimize or prevent the formation of hillocks in the etched structure. Apparatus for performing the methods are also described.

Abstract translation: 描述了使用四甲基氢氧化铵（TMAH）蚀刻材料的方法和设备。 当将TMAH应用于待蚀刻的材料时，该方法可以包括添加剂。 添加剂可以是气体，在某些情况下可以是干净的干燥空气。 清洁的干燥空气可以设置有TMAH以最小化或防止在蚀刻结构中形成小丘。 还描述了用于执行方法的装置。

公开(公告)号：US20150028187A1

公开(公告)日：2015-01-29

申请号：US13948507

申请日：2013-07-23

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang JIN ,  Bin-Hong HUANG

IPC: H01L31/18 ,  H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L2224/16225

Abstract: An image sensor device may include a mounting substrate having an IC-receiving cavity therein and a filter-receiving opening aligned with the IC-receiving cavity, an image sensor integrated circuit (IC) within the IC-receiving cavity and having an image sensing area aligned with the filter-receiving opening, and an adhesive bead on the image sensor IC surrounding the image sensing area. Furthermore, an infrared (IR) filter may be within the filter-receiving opening and have peripheral portions contacting the adhesive bead.

Abstract translation: 图像传感器装置可以包括其中具有IC接收腔的安装基板和与IC接收腔对准的滤光器接收开口，IC接收腔内的图像传感器集成电路（IC），并且具有图像感测区域 与过滤器接收开口对准，以及围绕图像感测区域的图像传感器IC上的粘合剂珠粒。 此外，红外（IR）滤光器可以在过滤器接收开口内，并且具有与粘合剂珠接触的周边部分。

公开(公告)号：US08937008B2

公开(公告)日：2015-01-20

申请号：US13340275

申请日：2011-12-29

Applicant: Yonggang Jin

Inventor： Yonggang Jin

IPC: H01L21/44 ,  H01L23/00

CPC classification number: H01L24/11 ,  B23K3/0623 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A system and process for forming a ball grid array on a substrate includes defining a plurality of openings in a resist layer on the substrate, and forming a plurality of openings in the resist layer, each positioned over a contact pad of the substrate. Flux is then deposited in the openings, and solder balls are positioned in each opening with the flux. Solder bumps are formed by reflowing the solder balls in the respective openings. The resist layer is then removed, leaving an array of solder bumps on the substrate. The flux can be deposited by depositing a layer of flux, then removing the flux, except a portion that remains in each opening. Solder balls can be positioned by moving a ball feeder across the resist layer and dropping a solder ball each time an aperture in the ball feeder aligns with an opening in the resist layer.

Abstract translation: 用于在衬底上形成球栅阵列的系统和方法包括在衬底上的抗蚀剂层中限定多个开口，并且在抗蚀剂层中形成多个开口，每个位于衬底的接触焊盘上方。 然后将焊剂沉积在开口中，并且焊剂球通过焊剂位于每个开口中。 通过在相应的开口中回流焊球来形成焊料凸点。 然后去除抗蚀剂层，留下衬底上的焊料凸块阵列。 可以通过沉积一层焊剂，然后除去焊剂，除了保留在每个开口中的部分之外，可以沉积焊剂。 焊球可以通过使球进料器横过抗蚀剂层移动而定位，并且每当球进料器中的孔与抗蚀剂层中的开口对准时，下降焊球。

公开(公告)号：US08922013B2

公开(公告)日：2014-12-30

申请号：US13291788

申请日：2011-11-08

Applicant: How Yuan Hwang ,  Kah Wee Gan

Inventor： How Yuan Hwang ,  Kah Wee Gan

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L23/538

CPC classification number: H01L24/14 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/023 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side.

Abstract translation: 集成电路封装包括在复原衬底中的集成电路管芯。 然后将活性侧加工成模塑料，同时处理非活性侧。 然后部分地去除活性侧上的模塑料，并且在活性侧上放置焊球。

公开(公告)号：US08916481B2

公开(公告)日：2014-12-23

申请号：US13312562

申请日：2011-12-06

Applicant: Kah Wee Gan ,  Yaohuang Huang ,  Yonggang Jin

Inventor： Kah Wee Gan ,  Yaohuang Huang ,  Yonggang Jin

IPC: H01L21/31 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L21/48 ,  H01L25/10 ,  H05K1/18

CPC classification number: H01L24/97 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H05K1/186 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A process for manufacturing a 3D or PoP semiconductor package includes forming a redistribution layer on a reconstituted wafer, then laser drilling a plurality of apertures in the reconstituted wafer, extending from an outer surface of the reconstituted wafer to intersect electrical traces in the first redistribution layer. A solder ball is then positioned adjacent to an opening of each of the apertures. The solder balls are melted and allowed to fill the apertures, making contact with the respective electrical traces and forming a plurality of solder columns. The outer surface of the reconstituted wafer is then planarized, and a second redistribution layer is formed on the planarized surface. The solder columns serve as through-vias, electrically coupling the first and second redistribution layers on opposite sides of the reconstituted wafer.

Abstract translation: 一种用于制造3D或PoP半导体封装的工艺包括在再构成的晶片上形成再分配层，然后激光钻出重建的晶片中的多个孔，从再构成的晶片的外表面延伸，以与第一再分配层 。 然后将焊球定位成与每个孔的开口相邻。 焊球熔化并允许填充孔，与相应的电迹线接触并形成多个焊料柱。 然后将重构的晶片的外表面平坦化，并且在平坦化表面上形成第二再分布层。 焊料柱用作通孔，将重新构成的晶片的相对侧上的第一和第二再分配层电耦合。