Pressure-sensitive adhesive sheet for electro-conductive film and method for production of pressure-sensitive adhesive sheet for electro-conductive film
    72.
    发明专利
    Pressure-sensitive adhesive sheet for electro-conductive film and method for production of pressure-sensitive adhesive sheet for electro-conductive film 有权
    用于电导体膜的压敏粘合片和用于生产用于电导体膜的压敏粘合片的方法

    公开(公告)号:JP2013056994A

    公开(公告)日:2013-03-28

    申请号:JP2011195873

    申请日:2011-09-08

    Abstract: PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet which, by performing polymerization in the presence of a specified reaction initiator, can be reduced in the amounts of monomer and reaction initiator remaining in the acrylic polymer without long-time drying and can thereby reduce ITO corrosion due to the remaining monomer and reaction initiator.SOLUTION: There is provided a pressure-sensitive adhesive sheet for electro-conductive films which is composed of a base sheet and a pressure-sensitive adhesive layer formed on any one of the surfaces of the base sheet, which pressure-sensitive adhesive sheet is characterized in that the pressure-sensitive adhesive from which the pressure-sensitive adhesive layer is formed comprises a cross-linked acrylic pressure-sensitive adhesive prepared by cross-linking an acrylic polymer prepared by copolymerizing a monomer mixture containing 20-99.4 wt.% (a-1) alkoxy (meth)acrylate, 0.5-10 wt.% (a-2) hydroxyl-containing monomer, 0.1-5 wt.% (a-3) nitrogen-containing monomer, and 0-79.4 wt.% (a-4) alkyl (meth)acrylate in the presence of a reaction initiator or reaction initiators added in at least two divided portions, the reaction initiator divided in portions and added last is a peroxide type initiator having a 10-hour half-life temperature falling within the range of 40-80°C, having functional groups other than carboxyl groups, and having a specified molecular weight in the presence of 0.1-5 pts.wt., per 100 pts.wt. acrylic polymer, isocyanate cross-linking agent; the calculated amount of the remaining reaction initiator is 500 ppm or less; and the amount of unreacted monomer contained in the pressure-sensitive adhesive layer is 50 mg/mor less when the thickness of the pressure-sensitive layer on the pressure-sensitive sheet is taken as 50 μm.

    Abstract translation: 要解决的问题:提供一种压敏粘合片,其通过在特定的反应引发剂的存在下进行聚合,可以减少丙烯酸类聚合物中残留的单体和反应引发剂的量,而不需要长时间 干燥,由此可以减少由于剩余的单体和反应引发剂引起的ITO腐蚀。 解决方案:提供一种导电膜用粘合片,其由形成在基片的任一表面上的基片和压敏粘合剂层构成,该压敏粘合剂 其特征在于,形成压敏粘合剂层的压敏粘合剂包括通过交联丙烯酸类聚合物制备的交联丙烯酸类压敏粘合剂,所述丙烯酸类聚合物通过将含有20-99.4重量% %(a-1)烷氧基(甲基)丙烯酸酯,0.5-10重量%(a-2)含羟基单体,0.1-5重量%(a-3)含氮单体和0-79.4重量% %的(甲基)丙烯酸烷基酯在反应引发剂或反应引发剂的存在下加入到至少两个分开的部分,反应引发剂分成多份,最后加入一个具有10小时半衰期的过氧化物型引发剂, 寿命温度在40-80°C范围内,具有功能 在羧基以外的nal基团,并且在0.1-5重量份存在下,每100重量份具有特定的分子量。 丙烯酸聚合物,异氰酸酯交联剂; 剩余反应引发剂的计算量为500ppm以下; 当粘合剂层中的压敏粘合剂层的厚度为压敏粘合剂层中的压敏粘合剂层的厚度为50mg / m 2时,压敏粘合剂层中所含的未反应单体的量为 取为50μm。 版权所有(C)2013,JPO&INPIT

    Adhesive composition for optical component and processed product thereof
    76.
    发明专利
    Adhesive composition for optical component and processed product thereof 有权
    光学组件的胶粘组合物及其加工产品

    公开(公告)号:JP2012242473A

    公开(公告)日:2012-12-10

    申请号:JP2011110187

    申请日:2011-05-17

    Abstract: PROBLEM TO BE SOLVED: To provide an adhesive composition having high resistance to heat, moist heat, and light leakage, and that can significantly reduce its aging period, and a processed product using the same.SOLUTION: The adhesive composition for optical members according to the present invention is formed by mixing, as a curing agent, 0.12 to 1 pts.wt. of an isocyanate curing agent having an isocyanurate skeleton to 100 pts.wt. of an acrylic polymer that contains (a) 80 to 98.7 pts.wt. of monomer comprising an alkyl acrylate monomer having an alkyl group with a carbon number of 1-12 and/or aromatic ring-containing acrylic monomer; (b) 0.2 to 1.5 pts.wt. of an amide group-containing acrylic monomer; and (c) 1 to 5 pts.wt. of hydroxyl group-containing acrylic monomer. The adhesive composition substantially includes no metal chelate curing agent.

    Abstract translation: 要解决的问题:提供具有高的耐热,耐湿热和漏光的粘合剂组合物,并且可以显着降低其老化时间,以及使用该粘合剂组合物的加工产品。 解决方案:根据本发明的用于光学构件的粘合剂组合物通过将作为固化剂的0.12至1重量份混合而形成。 的具有异氰脲酸酯骨架的异氰酸酯固化剂至100重量份 的丙烯酸类聚合物,其含有(a)80-98.7重量份 的单体,其包含具有碳数为1-12的烷基的丙烯酸烷基酯单体和/或含芳环的丙烯酸单体; (b)0.2〜1.5重量份 的含酰胺基的丙烯酸单体; 和(c)1〜5重量份 的含羟基的丙烯酸类单体。 粘合剂组合物基本上不包括金属螯合固化剂。 版权所有(C)2013,JPO&INPIT

    Composition for forming insulating layer, and touch panel
    78.
    发明专利
    Composition for forming insulating layer, and touch panel 审中-公开
    用于形成绝缘层和触摸面板的组合物

    公开(公告)号:JP2012208394A

    公开(公告)日:2012-10-25

    申请号:JP2011075158

    申请日:2011-03-30

    Abstract: PROBLEM TO BE SOLVED: To provide a composition for forming an insulating layer, the composition simultaneously having curability, developability and adhesiveness to metal.SOLUTION: The composition for forming an insulating layer contains a polymer, a polyfunctional monomer, a photopolymerization initiator, an epoxy resin and a solvent. The polymer includes: a structural unit (1) having a structure derived from a (meth)acryl monomer; a structural unit (2) having a structure derived from a carboxyl group-containing monomer having a carboxyl group and an unsaturated double bond; a structural unit (3) having a structure obtained by reacting the carboxyl group of the structural unit (2) with an epoxy group-containing compound having an epoxy group and an unsaturated double bond; and a structural unit (4) having a structure obtained by reacting a polybasic acid anhydride with a hydroxyl group which is produced by reacting the carboxyl group included in the structural unit (3) with an epoxy group. The polymer has a weight average molecular weight of 5,000 to 100,000. The composition for forming an insulating layer has an acid value of 150 mgKOH/g or less.

    Abstract translation: 要解决的问题:提供一种用于形成绝缘层的组合物,该组合物同时具有固化性,显影性和与金属的粘合性。 解决方案:用于形成绝缘层的组合物含有聚合物,多官能单体,光聚合引发剂,环氧树脂和溶剂。 聚合物包括:具有衍生自(甲基)丙烯酸单体的结构的结构单元(1); 具有衍生自具有羧基和不饱和双键的含羧基单体的结构的结构单元(2); 具有通过使结构单元(2)的羧基与具有环氧基和不饱和双键的含环氧基的化合物反应得到的结构的结构单元(3) 和具有通过使结构单元(3)中包含的羧基与环氧基反应而制备的多元酸酐与羟基反应而获得的结构的结构单元(4)。 聚合物的重均分子量为5,000〜100,000。 用于形成绝缘层的组合物的酸值为150mgKOH / g以下。 版权所有(C)2013,JPO&INPIT

    Polyamide-imide resin molding resin composition and a molded article thereof

    公开(公告)号:JP5017699B2

    公开(公告)日:2012-09-05

    申请号:JP2006037967

    申请日:2006-02-15

    Abstract: PROBLEM TO BE SOLVED: To provide a resin composition imparting peelability, mold release property, mold pollution resistance to a molded article of heat resistant aromatic polyamideimde resin, and to provide surface modified molded article of the composition by various forming methods. SOLUTION: The invention relates to the resin composition for molding including a modified polyamideimde resin obtained by reacting 1-15 pts.wt. of a primary modifying agent which imparts a carboxyl group to a -NH- position of 100 pts.wt of an aromatic polyamideimde resin, and reacting 0.1-2 equivalent of a fluorinated alcohol and/or a silicone compound with the carboxyl group in the primary modified polyamideimde resin to carry out an esterification reaction with the carboxyl group, wherein the fluorinated alcohol has 10 2 -10 5 of polystyrene conversion number-average molecular weight measured by gel permeation chromatography. COPYRIGHT: (C)2007,JPO&INPIT

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