Abstract:
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet which, by performing polymerization in the presence of a specified reaction initiator, can be reduced in the amounts of monomer and reaction initiator remaining in the acrylic polymer without long-time drying and can thereby reduce ITO corrosion due to the remaining monomer and reaction initiator.SOLUTION: There is provided a pressure-sensitive adhesive sheet for electro-conductive films which is composed of a base sheet and a pressure-sensitive adhesive layer formed on any one of the surfaces of the base sheet, which pressure-sensitive adhesive sheet is characterized in that the pressure-sensitive adhesive from which the pressure-sensitive adhesive layer is formed comprises a cross-linked acrylic pressure-sensitive adhesive prepared by cross-linking an acrylic polymer prepared by copolymerizing a monomer mixture containing 20-99.4 wt.% (a-1) alkoxy (meth)acrylate, 0.5-10 wt.% (a-2) hydroxyl-containing monomer, 0.1-5 wt.% (a-3) nitrogen-containing monomer, and 0-79.4 wt.% (a-4) alkyl (meth)acrylate in the presence of a reaction initiator or reaction initiators added in at least two divided portions, the reaction initiator divided in portions and added last is a peroxide type initiator having a 10-hour half-life temperature falling within the range of 40-80°C, having functional groups other than carboxyl groups, and having a specified molecular weight in the presence of 0.1-5 pts.wt., per 100 pts.wt. acrylic polymer, isocyanate cross-linking agent; the calculated amount of the remaining reaction initiator is 500 ppm or less; and the amount of unreacted monomer contained in the pressure-sensitive adhesive layer is 50 mg/mor less when the thickness of the pressure-sensitive layer on the pressure-sensitive sheet is taken as 50 μm.
Abstract:
Pressure sensitive adhesives for optical films include an acrylic copolymer (A) obtained by copolymerizing 95.0 to 98.0 parts by weight of n-butyl acrylate (a), 2.0 to 5.0 parts by weight of a hydroxyl group-containing (meth)acrylate (b) represented by Formula (1) below, and not more than 2.0 parts by weight of (meth)acrylic acid (c) (the total of (a) to (c) is 100 parts by weight), and satisfy specific requirements.
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive composition having high resistance to heat, moist heat, and light leakage, and that can significantly reduce its aging period, and a processed product using the same.SOLUTION: The adhesive composition for optical members according to the present invention is formed by mixing, as a curing agent, 0.12 to 1 pts.wt. of an isocyanate curing agent having an isocyanurate skeleton to 100 pts.wt. of an acrylic polymer that contains (a) 80 to 98.7 pts.wt. of monomer comprising an alkyl acrylate monomer having an alkyl group with a carbon number of 1-12 and/or aromatic ring-containing acrylic monomer; (b) 0.2 to 1.5 pts.wt. of an amide group-containing acrylic monomer; and (c) 1 to 5 pts.wt. of hydroxyl group-containing acrylic monomer. The adhesive composition substantially includes no metal chelate curing agent.
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming an insulating layer, the composition simultaneously having curability, developability and adhesiveness to metal.SOLUTION: The composition for forming an insulating layer contains a polymer, a polyfunctional monomer, a photopolymerization initiator, an epoxy resin and a solvent. The polymer includes: a structural unit (1) having a structure derived from a (meth)acryl monomer; a structural unit (2) having a structure derived from a carboxyl group-containing monomer having a carboxyl group and an unsaturated double bond; a structural unit (3) having a structure obtained by reacting the carboxyl group of the structural unit (2) with an epoxy group-containing compound having an epoxy group and an unsaturated double bond; and a structural unit (4) having a structure obtained by reacting a polybasic acid anhydride with a hydroxyl group which is produced by reacting the carboxyl group included in the structural unit (3) with an epoxy group. The polymer has a weight average molecular weight of 5,000 to 100,000. The composition for forming an insulating layer has an acid value of 150 mgKOH/g or less.
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition imparting peelability, mold release property, mold pollution resistance to a molded article of heat resistant aromatic polyamideimde resin, and to provide surface modified molded article of the composition by various forming methods. SOLUTION: The invention relates to the resin composition for molding including a modified polyamideimde resin obtained by reacting 1-15 pts.wt. of a primary modifying agent which imparts a carboxyl group to a -NH- position of 100 pts.wt of an aromatic polyamideimde resin, and reacting 0.1-2 equivalent of a fluorinated alcohol and/or a silicone compound with the carboxyl group in the primary modified polyamideimde resin to carry out an esterification reaction with the carboxyl group, wherein the fluorinated alcohol has 10 2 -10 5 of polystyrene conversion number-average molecular weight measured by gel permeation chromatography. COPYRIGHT: (C)2007,JPO&INPIT