기질상에 금-합금층 및 패턴을 제조하는 방법, 제조된 제품 및 이에 사용되는 용액
    77.
    发明授权
    기질상에 금-합금층 및 패턴을 제조하는 방법, 제조된 제품 및 이에 사용되는 용액 失效
    生产金合金层的方法及其使用的解决方案

    公开(公告)号:KR1019880002601B1

    公开(公告)日:1988-12-03

    申请号:KR1019820002904

    申请日:1982-06-29

    CPC classification number: C23C18/44 C23C18/48 H05K3/244

    Abstract: Process comprises contacting catalytic substrate with a soln. of pH 11-14 contg. a gold complex, pref. potassium gold cyanide, a copper complex, pref. using an ethylene diamine tetra-acetic acid tetra sodium salt as the complexing agent, formaldehyde or a formaldehyde producing compound and an alkali metal hydroxide, where the gold complex has a complexing constant 100,000 times that of the copper complex. Process is carried out at normal temps. and does not produce any corrosive or anoxious byprods. Method can be used for producing gold layers or patterns on printed circuit boards non- conducting substrates and esp. semiconductors using a III-V compound as base material.

    Abstract translation: 方法包括使催化底物与溶胶接触。 pH 11-14 一个金复合体,首选 氰化钾金,铜络合物, 使用乙二胺四乙酸四钠盐作为络合剂,甲醛或甲醛生产化合物和碱金属氢氧化物,其中金络合物的络合常数为铜络合物的络合常数的10倍。 工艺在正常温度下进行。 并且不产生任何腐蚀性或有毒物质。 方法可用于在印刷电路板非导电基材上生产金层或图案,尤其是。 使用III-V族化合物作为基材的半导体。

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