Abstract:
The present invention provides an optical device that is miniature, is highly sensitive and has a simplified package, and a manufacturing method thereof with high production efficiency and high reliability. The present invention is an optical device comprising: a photoelectric conversion element (50) having at least one photoelectric conversion portion (1) which is formed on a substrate (10); a sealing material (14); and a connection terminal (3). The optical device comprises an optical window which is an interface between the photoelectric conversion element (50) and an outside of the optical device; and an aperture (6) formed in the sealing material 14, and whose bottom face is the optical window. An entire face of the optical window is exposed to the outside. An optical adjustment element (13) may be formed on the interface. In this case, the interface between the optical adjustment element (13) and the outside is the optical window.
Abstract:
The present invention provides a current measuring apparatus having an improved structure to inhibit the possible adverse effect of a current in a different phase and the possible generation of an induced electromotive force caused by a measurement target current, enabling the measurement target current to be accurately detected even with the small size of the apparatus. The current measuring apparatus includes a printed circuit board 1 having Hall elements 2a, 2b and a signal processing integrated circuit 3 mounted thereon, the Hall elements 2a, 2b sensing a magnetic field generated by a current flowing through a current measurement target bus bar 4a, the signal processing integrated circuit 3 processing sensing outputs from the Hall elements 2a, 2b to calculate a value for the current flowing through the bus bar 4a. Magnetic sensing surfaces of the Hall elements 2a, 2b are arranged substantially perpendicularly to the direction of the magnetic field generated by the current flowing through the bus bar 4a. Further, the printed circuit board 1 is fixed to the bus bar 4a so that a circuit board surface of the printed circuit board 1 having a wire electrically connecting the Hall elements 2a, 2b to the signal processing integrated circuit 3 is positioned substantially parallel to the direction of the magnetic field.
Abstract:
A nonaqueous battery which comprises unit battery layers in a battery jar, each unit battery layer composed of a positive electrode plate having a positive electrode active material only on one side of a collector foil, a negative electrode plate having a negative electrode active material only on one side of a collector foil and a separator, and in which a surface of the positive electrode plate having thereon the positive electrode active material and a surface of the negative electrode plate having thereon the negative electrode active material face each other through the separator, and a surface of the positive electrode plate not having thereon the positive electrode active material and a surface of the negative electrode plate not having thereon the negative electrode active material face each other through an insulating film. According to the invention, safety of the battery is ensured since rapid temperature rise is suppressed inside even in the event of abnormal heating from outside, crushing of the battery in a direction of lamination, or short circuit between the positive electrode active material and the negative electrode due to nailing and the like.
Abstract:
There are provided an azimuth measurement device and its method for realizing an update of an offset calculated from the data acquired by azimuth measurement. A geomagnetism output measured by a 3-axis magnetic sensor (10) is amplified by an amplification section (13) and input to an A/D conversion section (14). A chopper section (11) is arranged for switching the terminals for driving an X-axis magnetic sensor (2), a Y-axis magnetic sensor (3), and a Z-axis magnetic sensor (4) and applies drive voltage output from a drive power source section (12) to the X-axis magnetic sensor (2), the Y-axis magnetic sensor (3), and the Z-axis magnetic sensor (4). The output amplified value amplified by the amplification section (13) is converted from an analog signal to a digital signal by the A/D conversion section (14) and then is input to a sensitivity/offset correction calculation section (16). Output data from this sensitivity/offset correction calculation section (16) is input to an azimuth calculation section (20) and the corresponding azimuth information is output. A reliability information calculation section (19) outputs reliability information.
Abstract:
A low-cost current sensor suitable for mass production and a manufacturing method thereof are provided. The current sensor is small with high sensitivity and can be packaged in a standard assembly line which is normally used when an integrated circuit is manufactured. Further, it is possible to obtain a sufficient shielding effect against a disturbance flux without degrading the detecting sensitivity of a flux. A first magnetic material 50 is bonded to the lower part of a current conductor 22C. The first magnetic material 50 has the function of converging and amplifying a flux 3 generated by thecurrent to be measured. A second magnetic material 51 is bonded above a magnetic sensor chip 20. The second magnetic material 51 has a shielding function against a disturbance flux entering from the outside.
Abstract:
A configuration of a lateral transistor suited for the hybrid-integration (BiCMOS) of a high-performance lateral transistor (HCBT) and a CMOS transistor, and a method for manufacturing the lateral transistor are provided. A semiconductor device includes a HCBT 100 and a CMOS transistor 200 hybrid-integrated therein. The HCBT 100 has an open region 21 opened by etching a device isolating oxide film 6 surrounding an n-hill layer 11, an emitter electrode 31A and a collector electrode 31B each of which is formed in the open region 21 and is composed of a polysilicon film having such a thickness as to expose the n-hill layer 11 exposed by etching the device isolating oxide film, and an ultrathin oxide film 24 covering at least a part of the n-hill layer 11. The ultrathin oxide film 24 functions as a protective film for protecting the n-hill layer 11 from being etched when the polysilicon film is etched to form the emitter 20 electrode 31A and the collector electrode 31B.
Abstract:
The present invention relates to a compound semiconductor substrate having a reduced dislocation (defect) density at an interface between a Si substrate and a compound semiconductor layer, and a method for producing the compound semiconductor substrate. Contaminants, such as organic matter and metal, on a surface of a Si substrate were removed by subjecting the Si substrate sequentially to organic washing, acid washing and alkaline washing, whereby a flat oxide film (not shown) was formed (S31). The oxide film on the surface was removed by using an aqueous hydrogen fluoride solution having a concentration of 1.0% by weight, whereby hydrogen termination treatment was performed (S32). The Si substrate immediately after being subjected to the hydrogen termination treatment was placed in a vacuum apparatus, and then the temperature of the Si substrate was raised in a vacuum apparatus (S33). If the substrate temperature is raised without any operation, the termination hydrogen is released. Before the hydrogen was released, pre-irradiation with As was performed (S34). Thus, an interface between the Si substrate and the compound semiconductor layer was prepared. Several minutes later, irradiation with Ga and As was performed (S35). Thereby, the compound semiconductor was formed (S36).
Abstract:
The present invention relates to a magnetic sensor with which magnetic characteristics are made extremely stable by consideration of an area of contact of a base layer of a magnetic substance and a semiconductor substrate. On a semiconductor substrate (111) a plurality of Hall elements (112a, 112b) are embedded so as to be coplanar to a top surface of the semiconductor substrate while being mutually spaced apart by a predetermined distance, and above the Hall elements and the semiconductor substrate, a base layer (114), having coefficient of thermal expansion differing from that of the Hall elements and partially covers a region of each Hall elements, is formed via a protective layer (113), and a magnetic flux concentrator (115), having an area larger than the base layer and with magnetic amplification, is formed on the base layer. An area of contact of the base layer of the magnetic substance and the semiconductor substrate is made small to lessen the generation of an offset voltage.
Abstract:
An infrared sensor IC and an infrared sensor, which are extremely small and are not easily affected by electromagnetic noise and thermal fluctuation, and a manufacturing method thereof are provided. A compound semiconductor that has a small device resistance and a large electron mobility is used for a sensor (2), and then, the compound semiconductor sensor (2) and an integrated circuit (3), which processes an electrical signal output by the compound semiconductor sensor (2) and performs an operation, are arranged in a single package using hybrid formation. In this manner, an infrared sensor IC that can be operated at room temperature can be provided by a microminiature and simple package that is not conventionally produced.