公开(公告)号：EP2842975B1

公开(公告)日：2019-12-25

申请号：EP13781398.6

申请日：2013-04-24

Applicant: Osaka Research Institute of Industrial Science and Technology ,  Daihachi Chemical Industry Co., Ltd.

Inventor： MATSUKAWA, Kimihiro ,  WATASE, Seiji ,  HIRATA, Manabu

IPC: C08F30/04 ,  B01F17/14 ,  C01G23/053 ,  C08F2/44 ,  C08F2/46 ,  C08F30/02 ,  G02B1/11

公开(公告)号：EP4333564A1

公开(公告)日：2024-03-06

申请号：EP22795770.1

申请日：2022-04-26

Applicant: EMD Corporation ,  Osaka Research Institute of Industrial Science and Technology ,  Ogawa, Soichi

Inventor： EBE, Akinori ,  KONDO, Yusuke ,  KAKEHI, Yoshiharu ,  SATOH, Kazuo ,  IKUHARA, Shiro ,  IWASAKI, Shinichi ,  OGAWA, Soichi

IPC: H05H1/46 ,  C23C14/34 ,  C23C14/35

Abstract: A sputtering apparatus (10) includes: a first target holder (111) and a second target holder (112) holding a first target (T1) and a second target (T2) respectively such that their surfaces face each other; a substrate holder (16) provided on a side of a plasma generation region (R) which is a region between the first target (T1) and the second target (T2) respectively held by the first target holder (111) and the second target holder (112); a first main magnetic field generation unit (121) and a second main magnetic field generation unit (122) respectively provided on the back surface sides of the first target holder (111) and the second target holder (112), and configured to generate a first main magnetic field and a second main magnetic field respectively on surfaces of the first target (T1) and the second target (T2) held, in which magnets are disposed such that opposite poles face each other; a power supply configured to generate an electric field in a plasma generation region (R) by applying predetermined potentials to the first target holder (111) and the second target holder (112); a radio-frequency electromagnetic field generation unit (17) configured to generate a radio-frequency electromagnetic field in the plasma generation region (R), which is provided on a side of the plasma generation region (R) facing the substrate holder (16) with the plasma generation region (R) between them; and a plasma source gas introduction unit (15) configured to introduce a plasma source gas into the plasma generation region (R), wherein means for generating a magnetic field does not exist at the ends of the first target holder (111) and the second target holder (112) on a side of radio-frequency electromagnetic field generation unit (17).

公开(公告)号：EP4332058A1

公开(公告)日：2024-03-06

申请号：EP22795678.6

申请日：2022-04-22

Applicant: Idemitsu Kosan Co.,Ltd. ,  Osaka Research Institute of Industrial Science and Technology

Inventor： KATO, Atsutaka ,  YAMAMOTO, Mari ,  TAKAHASHI, Masanari ,  UTSUNO, Futoshi ,  HIGUCHI, Hiroyuki

IPC: C01B25/14 ,  C01D3/12 ,  H01M4/13 ,  H01M4/62 ,  H01M10/0562

Abstract: One of the purposes of the present invention is to provide: a compound which can be used as a binder having ion conductivity; and a battery which contains the compound. One aspect of the present invention is a compound comprising P and S as constituent elements, a group comprising one or more elements selected from the group consisting of O, N and halogen, the group bonding to the P, and a disulfide bond.

公开(公告)号：EP3854503A1

公开(公告)日：2021-07-28

申请号：EP21161762.6

申请日：2017-10-25

Applicant: DAIHEN Corporation ,  Osaka Research Institute of Industrial Science and Technology

Inventor： Tsubota, Ryusuke ,  Oka, Yohei ,  Okamoto, Akira ,  Nakamoto, Takayuki ,  Sugahara, Takahiro ,  Shinomiya, Naruaki ,  Takemura, Mamoru ,  Uchida, Sohei

IPC: B22F3/105 ,  C22C1/04 ,  C22C9/00 ,  B33Y70/00 ,  B22F3/24 ,  C22F1/08 ,  B33Y80/00 ,  B22F10/20 ,  C22C9/06 ,  B33Y10/00

Abstract: A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass% and not more than 2.80 mass% of chromium, and a balance of copper.

公开(公告)号：EP3536316A1

公开(公告)日：2019-09-11

申请号：EP17866642.6

申请日：2017-10-30

Applicant: Momotani Juntenkan Co., Ltd. ,  Osaka Research Institute of Industrial Science and Technology

Inventor： UYAMA, Ayaka ,  SUGINO, Teizo ,  NAGAO, Toshihiro ,  TANAKA, Shigemitsu

IPC: A61K31/20 ,  A41B17/00 ,  A61K8/36 ,  A61K8/37 ,  A61K31/201 ,  A61K31/23 ,  A61K31/231 ,  A61K31/575 ,  A61P17/10 ,  A61P31/04 ,  A61Q19/00

Abstract: Provide is a medicinal agent having a strain-selective antibacterial activity for acne bacteria which are indigenous bacteria in the human skin, namely having a stronger bactericidal or growth suppressing activity on an acne bacterium strain enriched in an acne patient group rather than on an acne bacterium strain enriched in a healthy subject group.
An acne strain-selective antibacterial agent, comprising at least one fatty acid selected from the group consisting of saturated fatty acids having 14 to 20 carbon atoms (C14:0 to C20:0) and a monounsaturated fatty acid having 18 carbon atoms (C18:1) in a free form or a salt form, or an ester thereof.

公开(公告)号：EP3482856A1

公开(公告)日：2019-05-15

申请号：EP18205389.2

申请日：2017-10-25

Applicant: Daihen Corporation ,  Osaka Research Institute of Industrial Science and Technology

Inventor： Tsubota, Ryusuke ,  Oka, Yohei ,  Okamoto, Akira ,  Nakamoto, Takayuki ,  Sugahara, Takahiro ,  Shinomiya, Naruaki ,  Takemura, Mamoru ,  Uchida, Sohei

IPC: B22F3/105 ,  C22C1/04 ,  C22C9/00 ,  B33Y70/00 ,  B22F3/24 ,  C22F1/08

Abstract: A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass% and not more than 2.80 mass% of chromium, and a balance of copper.

公开(公告)号：EP3093086B1

公开(公告)日：2018-07-04

申请号：EP16169139.9

申请日：2016-05-11

Applicant: Daihen Corporation ,  Osaka Research Institute of Industrial Science and Technology

Inventor： Tsubota, Ryusuke ,  Tanaka, Jyunichi ,  Oka, Yohei ,  Nakamoto, Takayuki ,  Sugahara, Takahiro ,  Takemura, Mamoru ,  Uchida, Sohei

IPC: B22F3/105 ,  C22C1/04 ,  C22C9/00 ,  C22C9/10 ,  B33Y80/00 ,  B22F1/00 ,  C22C9/06 ,  B22F3/24 ,  B22F9/08

CPC classification number: B22F1/0003 ,  B22F1/0011 ,  B22F3/1055 ,  B22F3/24 ,  B22F9/08 ,  B22F2003/1056 ,  B22F2003/248 ,  B22F2009/0812 ,  B22F2009/0828 ,  B22F2009/0836 ,  B22F2998/10 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C22C1/0425 ,  C22C9/00 ,  C22C9/06 ,  C22C9/10 ,  Y02P10/295

Abstract: A metal powder contains not less than 0.10 mass% and not more than 1.00 mass% of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass%. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.