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公开(公告)号：US10543662B2
公开(公告)日：2020-01-28
申请号：US15302098
申请日：2015-04-07
Applicant: Corning Incorporated
Inventor： Robert Alan Bellman , Prantik Mazumder , Robert George Manley , Kaveh Adib
IPC: B32B3/26 , B32B7/06 , B32B7/12 , B32B9/00 , B32B9/04 , B32B17/00 , B32B17/06 , B32B27/06 , B32B38/00 , C03C15/00 , H01L21/02
Abstract: A method of making a device substrate article having a device modified substrate supported on a glass carrier substrate, including: treating at least a portion of the first surface of a device substrate, at least a portion of a first surface of a glass carrier, or a combination thereof, wherein the treating produces a surface having: silicon; oxygen; carbon; and fluorine amounts; and a metal to fluorine ratio as defined herein; contacting the treated surface with an untreated or like-treated counterpart device substrate or glass carrier substrate to form a laminate comprised of the device substrate bonded to the glass carrier substrate; modifying at least a portion of the non-bonded second surface of the device substrate of the laminate with at least one device surface modification treatment; and separating the device substrate having the device modified second surface from the glass carrier substrate.
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公开(公告)号：US10538452B2
公开(公告)日：2020-01-21
申请号：US15094477
申请日：2016-04-08
Applicant: Corning Incorporated
Inventor： Robert Alan Bellman , Dana Craig Bookbinder , Theresa Chang , Jeffrey John Domey , Robert George Manley , Prantik Mazumder , Alan Thomas Stephens, II
IPC: B32B7/06 , C03B25/02 , B32B17/06 , C03B40/00 , C03B35/14 , C03C1/00 , B05D1/00 , C03C17/32 , G02F1/1333
Abstract: Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.
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公开(公告)号：US10014177B2
公开(公告)日：2018-07-03
申请号：US14047514
申请日：2013-10-07
Applicant: Corning Incorporated
Inventor： Robert Alan Bellman , Dana Craig Bookbinder , Robert George Manley , Prantik Mazumder , Theresa Chang , Jeffrey John Domey , Darwin Gene Enicks , Vasudha Ravichandran , Alan Thomas Stephens, II , John Christopher Thomas
CPC classification number: H01L21/2007 , H01L51/003 , H01L51/0097 , H01L2227/326 , H01L2251/5338 , Y02E10/549 , Y02P70/521 , Y10T156/10 , Y10T156/1052
Abstract: Methods for making electronic devices on thin sheets bonded to carriers. A surface modification layer and associated heat treatments, may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier during the electronic device processing. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, during the electronic device processing. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, during the electronic device processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.
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74.发明申请GLASS ARTICLES HAVING FILMS WITH MODERATE ADHESION, RETAINED STRENGTH AND OPTICAL TRANSMITTANCE 审中-公开具有中等粘度的薄膜的玻璃制品，保持的强度和光学传递公开(公告)号：US20160324016A1
公开(公告)日：2016-11-03
申请号：US15141140
申请日：2016-04-28
Applicant: CORNING INCORPORATED
Inventor： Robert Alan Bellman , Jiangwei Feng , Shandon Dee Hart , Jen-Chieh Lin , Prantik Mazumder , Chandan Kumar Saha
CPC classification number: H05K5/0017 , B32B7/02 , B32B17/06 , B32B2457/20 , C03C17/3417 , C03C17/3452 , C03C17/42 , C03C2217/734 , C23C16/50 , H05K5/03
Abstract: One or more aspects relate to an article that includes a glass substrate having a first average strain-to-failure; and a crack mitigating layer disposed on a first major surface of the substrate forming a first interface. The article also includes a film disposed on the crack mitigating layer forming a second interface and having a second average strain-to-failure that is less than the first average strain-to-failure. Further, at least one of the first and second interfaces exhibits a moderate adhesion such that at least a portion of the crack mitigating layer experiences one or more of a cohesive failure and an adhesive failure at the interfaces when the article is strained to a strain level between the first average strain-to-failure and the second average strain-to-failure. In addition, the refractive index of the crack mitigating layer is between or the same as the refractive indices of the substrate and the film.
Abstract translation: 一个或多个方面涉及包括具有第一平均应变失效的玻璃基板的制品; 以及设置在形成第一界面的基板的第一主表面上的裂纹缓解层。 该制品还包括设置在裂纹缓解层上的膜，其形成第二界面并且具有小于第一平均应变 - 破坏的第二平均应变 - 破坏。 此外，第一和第二界面中的至少一个表现出适度的粘合性，使得当制品应变到应变水平时，裂纹缓解层的至少一部分经历一个或多个界面处的内聚破坏和粘合剂失效 在第一平均应变 - 失效和第二平均应变 - 失效之间。 此外，裂纹缓解层的折射率在基板和膜的折射率之间或相同。
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75.发明申请GLASS ARTICLES AND METHODS FOR CONTROLLED BONDING OF GLASS SHEETS WITH CARRIERS 审中-公开玻璃制品与载体的玻璃板的控制粘合的玻璃制品和方法公开(公告)号：US20150099110A1
公开(公告)日：2015-04-09
申请号：US14504071
申请日：2014-10-01
Applicant: Corning Incorporated
Inventor： Robert Alan Bellman , Dana Craig Bookbinder , Robert George Manley , Prantik Mazumder
CPC classification number: B32B17/10036 , B32B7/06 , B32B17/064 , B32B17/1055 , B32B37/06 , B32B37/1018 , B32B37/187 , B32B2457/20 , B32B2457/206 , C03C27/10 , C03C2218/355 , H01L21/6835 , H01L51/0097 , Y02E10/549 , Y02P70/521 , Y10T428/269 , Y10T428/3154 , Y10T428/31544
Abstract: Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.
Abstract translation: 可以在片材，载体或两者上提供表面改性层和相关的热处理，以控制薄板和载体之间的室温范德华（和/或氢）键合和高温共价键合。 例如，在真空处理，湿法处理和/或超声波清洗处理中，室温粘合被控制为足以将薄片和载体保持在一起。 同时控制高温共价键，以防止在高温加工过程中薄片和载体之间的永久性结合，并且保持足够的粘结以防止在高温加工过程中的分层。
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Patent Agency Ranking
公开(公告)号：US12122138B2
公开(公告)日：2024-10-22
申请号：US17392384
申请日：2021-08-03
Applicant: CORNING INCORPORATED
Inventor： Robert Alan Bellman , Jiangwei Feng , Prantik Mazumder
IPC: B32B7/12 , B32B7/06 , B32B9/00 , B32B9/04 , B32B15/04 , B32B17/06 , B32B27/28 , B32B37/24 , C08G77/04 , C08G77/26 , C09D183/00 , C09D183/04 , C09D183/08 , C09J5/04 , C09J183/04
CPC classification number: B32B7/12 , B32B7/06 , B32B9/005 , B32B9/04 , B32B9/041 , B32B15/04 , B32B17/06 , B32B17/061 , B32B27/283 , B32B37/24 , C09D183/00 , C09D183/04 , C09D183/08 , C09J5/04 , C09J183/04 , B32B2037/246 , B32B2255/00 , B32B2255/06 , B32B2255/26 , B32B2255/28 , B32B2307/712 , B32B2307/732 , B32B2307/748 , B32B2309/105 , B32B2383/00 , B32B2457/14 , B32B2457/20 , C08G77/04 , C08G77/26
Abstract: Described herein are glass articles and methods of making glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier or bonded together using a coating layer, which is preferably an organosiloxane polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on the thin sheet, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The coating layer bonds the thin sheet and carrier together to prevent a permanent bond at high temperature processing while at the same time maintaining a sufficient bond to prevent delamination during high temperature processing.
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公开(公告)号：US20240208198A1
公开(公告)日：2024-06-27
申请号：US18389252
申请日：2023-11-14
Applicant: CORNING INCORPORATED
Inventor： Julia Anne Dorothee Brueckner , Ya-Huei Chang , Kuan-Ting Kuo , Prantik Mazumder , Jian-Zhi Jay Zhang
CPC classification number: B32B43/006 , B32B7/12 , B32B17/06 , H01L21/6835
Abstract: Articles and methods for temporary bonding of substrates are described. The articles include a photo-release layer to enable reversal of the temporary bonding upon exposure of the photo-release layer to light to separate the substrates. The method includes plasma treatment of the photo-release layer to increase the bonding energy. Higher bonding energy allows for processing of the article with greater mechanical force before separation. Plasma treatment also allows for temporary bonding with a thinner photo-release layer and a photo-release layer with low total thickness variation (TTV). Once separated from the article, a processed substrate can be bonded to other substrates.
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公开(公告)号：US12006221B2
公开(公告)日：2024-06-11
申请号：US17546488
申请日：2021-12-09
Applicant: CORNING INCORPORATED , Fundació Institut de Ciències Fotòniques (ICFO) , Institució Catalana de Recerca i Estudis Avançats
Inventor： Therese Francoise Arliguie , Theresa Chang , Miriam Marchena Martin-Francés , Prantik Mazumder , Valerio Pruneri , Frederic Christian Wagner
IPC: C01B32/194 , B05D1/00 , B05D3/12
CPC classification number: C01B32/194 , B05D1/005 , B05D3/12 , B05D2350/60 , B05D2505/50 , C01B2204/22
Abstract: A method of forming a functionalized device substrate is provided that includes the steps of: forming a conductive layer on a growth substrate; applying a polymeric layer to a device substrate, wherein a coupling agent couples the polymeric layer to the device substrate; coupling the polymeric layer to the conductive layer on the growth substrate; and peeling the growth substrate from the conductive layer.
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公开(公告)号：US11885998B2
公开(公告)日：2024-01-30
申请号：US17759938
申请日：2021-02-01
Applicant: Corning Incorporated
Inventor： Joy Banerjee , Indrani Bhattacharyya , Prantik Mazumder , Wanda Janina Walczak
CPC classification number: G02B6/0043 , C03C17/3405 , G02B6/0061 , G02B6/0065 , C03C2218/32
Abstract: A display backlight unit is disclosed including a glass substrate with a first major surface and a second major surface opposite the first major surface, the first major surface coated with at least one of 3-mercaptopropyl trimethoxysilane, aminopropyl triethoxysilane, or silanated PMMA, and a plurality of PMMA-containing light extraction dots deposited on the coated first major surface.
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公开(公告)号：US20230091841A1
公开(公告)日：2023-03-23
申请号：US17989075
申请日：2022-11-17
Applicant: Corning Incorporated
Inventor： Kaveh Adib , Robert Alan Bellman , Jiangwei Feng , Georgiy M Guryanov , Jhih-Wei Liang , Shiwen Liu , Prantik Mazumder
Abstract: Described herein are articles and methods of making articles, including a first sheet and a second sheet, wherein the thin sheet and carrier are bonded together using a coating layer, preferably a hydrocarbon polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on either sheet, or both, to control van der Waals, hydrogen and covalent bonding between the sheets. The coating layer bonds the sheets together to prevent formation of a permanent bond at high temperature processing while at the same time maintaining a sufficient bond to prevent delamination during high temperature processing.
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