Abstract:
PROBLEM TO BE SOLVED: To provide an active-ray sensitive or radiation-sensitive resin composition which is improved in development defects and distance dependence of a pattern, and to provide a method for forming a pattern that uses the composition. SOLUTION: The active-ray sensitive or radiation-sensitive resin composition comprises (A) a resin having a specified repeating unit having a norbornane structure in a side chain, and the solubility of which with an alkali developing solution is increased by an action of an acid; (B) a compound generating an acid by irradiation with active rays or radiation; and (C) a resin containing at least either a fluorine atom or a silicon atom and having a group that is decomposed by an action of an alkali developing solution, to increase the solubility with the alkali developing solution. The method for forming a pattern is carried out by using the composition. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resist composition for forming a resist pattern that has remedied collapse of the resist pattern, line edge roughness and generation of scum and that has little degradation in the profile and good follow-up property to an immersion liquid during immersion exposure, and to provide a pattern forming method using the photosensitive resist composition. SOLUTION: The composition is an active energy ray-sensitive or radiation-sensitive resin composition containing (A) a resin the solubility of which with an alkali developer solution is increased by an effect of an acid, (B) a compound generating an acid by irradiation with active rays or radiation, and (C) a resin having an ether bond and a fluorine atom in the main chain. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of forming pattern which is used for forming a fine pattern in manufacturing a semiconductor, forms a pattern where line with roughness (LWR) is reduced, and attains a wide exposure latitude, and to provide a photosensitive composition to be used for the method. SOLUTION: The method of forming pattern includes: a process for forming a photosensitive film from the photosensitive composition; a process for irradiating the photosensitive film with an active light beam or a radiation; a heating process (a PEB process); a developing process; a rinsing process; and a post-baking process. The method of forming pattern is characterized by allowing the glass-transition temperature of at least one resin contained in the photosensitive composition to be within the range of a formula (1), and the photosensitive composition to be used for the method is provided. The formula (1) is (the heating temperature of the post-baking process plus 20°C)≥(the glass-transition temperature of the resin)>(the heating temperature of the PEB process). COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive composition used for formation of minute patterns in the semiconductor production superior to the conventional products in terms of exposure latitude, LWR, and pattern collapse performance. SOLUTION: The resist composition contains two or more kinds of polymers including a first polymer and a second polymer, and a compound, which generates an acid by irradiation of an active light or a radiation. The composition ratio of at least the first polymer and the second polymer in a dried coating film formed using the resist composition has an inclined type distribution continuously changing in the depth direction from the air interface of the resist film to a supporting member, and the composition ratio of the first polymer is higher than that of the second polymer in the upper part of the resist film and the composition ratio of the second polymer is higher than that of the first polymer in the lower part of the resist film. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a film-forming composition (coating liquid) capable of forming an insulating film having a low permittivity and excellent mechanical strengths and having good surface properties, to provide an insulating film obtained by using the film-forming composition, and to provide an electronic device having the insulating film. SOLUTION: The film-forming composition comprises (A) a polymer that comprises a monomer unit represented by formula (1) and has a weight average of ≥1,500 mol.wt. In the formula (1), X is O, S or CH 2 ; R is alkyl, alkenyl, alkynyl, aryl, alkoxy, acyloxy, aryloxy, hydroxyl, carboxyl, alkoxycarbonyl, aryloxycarbonyl, halogen, trialkylsilyl or triarylsilyl, and R further may have a substituent and may form a ring structure by combining mutually; and n is an integer of 0-4. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a film-forming composition excellent in heat resistance and mechanical strength, low-dielectric, and capable of forming a good film surface, as well as an insulating film and an electronic device using the same. SOLUTION: A film-forming composition including a compound represented by the formula (1) and/or a polymer made by using the compound represented by the formula (1) and an insulating film and an electronic device using the same, where A 1 independently represents a group selected from a single bond, -CO-, -NR-, -O-, -SO 2 -, -CH=CH-, or -C≡C-, or a group obtained by combining two or more above groups, A 2 and A 4 independently represent a monovalent organic groups whose carbon numbers are from 1 to 10, A 3 independently represents a hydrogen atom or a monovalent organic group whose carbon number is from 1 to 10 except for phenyl group and X represents a tetravalent organic group whose carbon number is from 1 to 9. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation:要解决的问题:提供耐热性和机械强度,低电介质,并且能够形成良好的膜表面的成膜组合物以及使用其的绝缘膜和电子器件。 解决方案:包含由式(1)表示的化合物和/或通过使用由式(1)表示的化合物制成的聚合物的绝缘膜和使用其的电子器件的成膜组合物,其中 A 1 SP>独立地表示选自单键,-CO - , - NR - , - O - , - SO 2 SBR 2 - , - CH = CH-或 -C≡C-或通过组合两个或更多个上述基团而获得的基团,A 2 SP>和A 4 SP>独立地表示碳数为1〜 在图10中,A 3 SP>独立地表示氢原子或碳数为1至10的除苯基之外的一价有机基团,X表示碳数为1至9的四价有机基团。 P>版权所有(C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming interlayer insulated films, which is used for electronic devices or the like, has good film characteristics such as good dielectric constant and mechanical strength, has good adhesiveness to substrates, and gives coating liquids excellent in stability. SOLUTION: This composition for forming the interlayer insulated films comprises a polymer obtained by polymerizing raw materials containing at least compounds of general formulas (1) and (2), (wherein, R 0 is H or a 1 to 6C hydrocarbon group; Ar is an aryl group or heteroaryl group which may have one or more substituents; R A is H or an organic group; R c is an organic group having a cage type structure to whose bridge head position at least one R A -C≡C- group is directly bound). COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation:要解决的问题:为了提供用于电子器件等的用于形成层间绝缘膜的组合物,具有良好的介电常数和机械强度的膜特性,对基片具有良好的粘合性,并且得到涂层 液体稳定性优良。 解决方案:用于形成层间绝缘膜的组合物包括通过使至少含有通式(1)和(2)的化合物的原料聚合而得到的聚合物,其中R 0 SB>为H 或1〜6C烃基; Ar为可具有一个或多个取代基的芳基或杂芳基; R SB为H或有机基团; R SB为C 具有笼桥型结构的有机基团,其桥头位置至少一个R a-C≡C-基团直接结合)。 版权所有(C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for an interlayer insulating film used for electronic devices and the like that exhibits good film properties such as a dielectric constant or mechanical strengths, good adhesion to a substrate and excellent stability of a coating liquid. SOLUTION: The composition for an interlayer insulating film comprises the following components. (A) A hydrolyzate obtained by hydrolyzing an alkoxysilane or an acyloxysilane having at least one styryl group optionally bearing one or more substituent group in the molecule. (B) A compound having at least two carbon-carbon triple bonds in the molecule. (C) A solvent. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a coating for forming an insulation film which is a composition for forming an insulation film used in electronic devices and the like and gives an insulation film being excellent in film characteristics such as in dielectric constant and mechanical strength, adhesion to substrates and further in the stability of a coating liquid. SOLUTION: The composition for interlayer insulation films comprises the ingredients as described below: (A) an alkoxysilane or a hydrolysate of an acyloxysilane having at least one carbon-carbon double bond, (B) a compound having at least two carbon-carbon double bonds or carbon-carbon triple bonds in the molecule, (C) a ≤16C carboxylic acid and (D) a solvent. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive resist composition which satisfies high sensitivity, high resolution, proper pattern profile and proper density distribution dependence, at the same time, and also ensures proper dissolution contrast, and to provide a pattern forming method that uses the same. SOLUTION: The resist composition comprises (A) a resin containing a repeating unit represented by Formula (I); and (B) a compound, capable of generating an acid upon irradiation with actinic rays or radiation, wherein AR represents a benzene ring or a naphthalene ring; R represents a hydrogen atom, an alkyl group, a cycloalkyl group or an aryl group; Z represents a linking group for forming a ring together with AR; and A represents an atom or group selected from among a hydrogen atom, an alkyl group, a halogen atom, a cyano group and an alkyloxycarbonyl group. The pattern forming method that uses the resist composition is also provided. COPYRIGHT: (C)2008,JPO&INPIT