SILICON PHOTONIC COMPONENTS FABRICATED USING A BULK SUBSTRATE

    公开(公告)号:US20210132461A1

    公开(公告)日:2021-05-06

    申请号:US16674711

    申请日:2019-11-05

    Abstract: Structures including a photodetector and methods of fabricating such structures. A substrate, which is composed of a semiconductor material, includes a first trench, a second trench, and a pillar of the semiconductor material that is laterally positioned between the first trench and the second trench. A first portion of a dielectric layer is located in the first trench and a second portion of the dielectric layer is located in the second trench. A waveguide core is coupled to the pillar at a top surface of the substrate.

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