公开(公告)号：US20180359881A1

公开(公告)日：2018-12-13

申请号：US15570692

申请日：2016-01-22

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  Minh H. Nguyen

IPC: H05K7/20

CPC classification number: H05K7/20772 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H05K7/20 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20781

Abstract: Examples herein disclose a system including a board and a cooling member. The board includes a first surface, a second surface, and a midpoint between the first and the surface, the boards supports an electrical component on the first surface. The cooling member is routed along the second surface of the board and delivers cooling liquid to the electrical component by crossing the midpoint of the board from the second surface to the first surface. The cooling member routes heated liquid from the electrical component by crossing the midpoint of the board from the first surface to the second surface.

公开(公告)号：US10143111B2

公开(公告)日：2018-11-27

申请号：US15476937

申请日：2017-03-31

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Matthew Slaby ,  Tuong Q Tran ,  Aaron Michael Childers ,  Tahir Cader

IPC: H05K7/20 ,  F04B49/20 ,  F04B51/00

Abstract: Examples herein disclose a coolant distribution unit (CDU) including a valve, a pump, and a controller. The valve controls a coolant through the CDU and the pump maintains a differential pressure of coolant to data center components. The controller exclusively controls the CDU to determine a position of the valve. In the response to the determined position of the valve, the CDU adjusts a speed of the pump.

公开(公告)号：US09997434B2

公开(公告)日：2018-06-12

申请号：US15311569

申请日：2014-05-19

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Niru Kumari ,  Tahir Cader ,  Sergio Escobar-Vargas ,  Cullen E. Bash

IPC: H05K7/20 ,  H01L23/473 ,  H01L23/427 ,  H01L23/34 ,  H01L25/065 ,  H01L23/02 ,  H01L25/18 ,  H01L23/44 ,  H01L23/467 ,  H01L23/48

CPC classification number: H01L23/427 ,  H01L23/02 ,  H01L23/34 ,  H01L23/44 ,  H01L23/467 ,  H01L23/473 ,  H01L23/4735 ,  H01L23/481 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An example device in accordance with an aspect of the present disclosure includes a substrate that may be disposed in a housing. The substrate includes a sprayer to spray coolant.

公开(公告)号：US20180112656A1

公开(公告)日：2018-04-26

申请号：US15569249

申请日：2015-09-04

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  John Franz ,  Sammy L. Zimmerman

IPC: F04B49/06 ,  F04B49/02

CPC classification number: F04B49/065 ,  F04B37/14 ,  F04B49/02 ,  F04B51/00 ,  G06F1/20 ,  G06F2200/201

Abstract: In one example implementation pump based issue identification includes monitoring a total number of operational cycles of a vacuum pump associated with a cooling device, comparing the total number of operational cycles to an operational cycle threshold, identify an issue based on the comparison of the total number of operational cycles to the operational cycle threshold, and generating a notification in response to identifying the issue.

公开(公告)号：US20180111846A1

公开(公告)日：2018-04-26

申请号：US15569650

申请日：2016-02-19

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  Greg Scott Long ,  John Franz ,  Gardson Githu

IPC: C02F1/00 ,  G01N27/02 ,  A61L2/18 ,  C02F1/66 ,  C02F1/50

CPC classification number: C02F1/008 ,  A61L2/18 ,  A61L2/186 ,  A61L2202/14 ,  C02F1/50 ,  C02F1/66 ,  C02F2103/023 ,  C02F2209/005 ,  C02F2209/06 ,  C02F2303/04 ,  C02F2303/08 ,  G01N27/026 ,  G01N27/4167 ,  G01N33/18

Abstract: In the examples provided herein, a system includes an electrochemical sensor having two electrodes inserted in a fluid to be tested, where an alternative current (AC) voltage is applied across the two electrodes; an electrochemical sensor having two electrodes inserted in a fluid to be tested, wherein an alternative current (AC) voltage across the two electrodes; and a frequency response analyzer to analyze the measured the electrical response across multiple frequencies. The system also includes a memory to store a baseline of the electrical response across multiple frequencies, and a processor to determine from the stored baseline and the measured electrical response whether the electrical response is outside a predetermined range.

公开(公告)号：US20180027702A1

公开(公告)日：2018-01-25

申请号：US15547534

申请日：2015-02-17

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  John P. Franz

IPC: H05K7/20

Abstract: An example fluid manifold is provided herein. The fluid manifold includes a first set of perimeter walls, a second set of perimeter walls, a first aperture, and a second aperture. The first set of perimeter walls to form a supply channel. The second set of perimeter walls to form a return channel. The second set of perimeter walls are adjacent to the first set of perimeter walls. The first aperture formed in the first set of perimeter walls is to transport fluid between a fluid component and the supply channel. The second aperture formed in the second set of perimeter walls is to transport fluid between the fluid component and the return channel. The first aperture and the second aperture are positioned adjacent to an electronic module.

公开(公告)号：US20180027698A1

公开(公告)日：2018-01-25

申请号：US15547554

申请日：2015-02-13

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  John Franz

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20781 ,  H05K7/20836

Abstract: An example device comprises a coolant distribution unit configured to be contained within a housing configured to house a plurality of liquid cooled computing units, the coolant distribution unit configured to fluidly couple to a rear door heat exchanger of the housing and to fluidly couple to the plurality of liquid cooled computing units, the coolant distribution unit to: receive coolant from the rear door heat exchanger via a first fluid line; pump the coolant toward the liquid cooled computing units using at least one pump coupled to the first fluid line; and supply the coolant to the liquid cooled computing units via a second fluid line coupled to the plurality of liquid cooled computing units.

公开(公告)号：US20180018001A1

公开(公告)日：2018-01-18

申请号：US15546070

申请日：2015-01-31

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Thomas R. Bowden ,  Richard A. Bargerhuff ,  Sammy L. Zimmerman ,  Tahir Cader

IPC: G06F1/20 ,  H05K7/20

Abstract: In one implementation, a system for a memory cooling pad includes a first thermal interface material coupled to a second thermal interface material by a liner material configured to position the first thermal interface material on a first side of a memory unit and to position the second thermal interface material on a second side of the memory unit.

公开(公告)号：US20180017538A1

公开(公告)日：2018-01-18

申请号：US15546090

申请日：2015-01-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Anita Rogacs ,  Greg Scott Long ,  Tahir Cader ,  Keith Mathew McAuliffe ,  John Franz

IPC: G01N33/18 ,  F01P11/18 ,  G01N27/02 ,  H05K7/20 ,  G01N27/07 ,  G01N27/407

CPC classification number: G01N33/1886 ,  F01P11/14 ,  F01P11/18 ,  F01P2003/001 ,  F01P2025/80 ,  G01N27/026 ,  G01N27/07 ,  G01N27/4071 ,  H05K7/20672

Abstract: An example device in accordance with an aspect of the present disclosure includes a sensor, a controller, and an injector. The sensor is to provide sensor output regarding fluid chemistry of a fluid of a cooling system. The controller is to identify attributes of the fluid. The injector is to inject at least one additive into the fluid to bring at least one attribute into a threshold range.

公开(公告)号：US20170084514A1

公开(公告)日：2017-03-23

申请号：US15311569

申请日：2014-05-19

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Niru Kumari ,  Tahir Cader ,  Sergio Escobar-Vargas ,  Cullen E. Bash

IPC: H01L23/427 ,  H01L25/065 ,  H01L25/18 ,  H01L23/473 ,  H01L23/02

CPC classification number: H01L23/427 ,  H01L23/02 ,  H01L23/34 ,  H01L23/44 ,  H01L23/467 ,  H01L23/473 ,  H01L23/4735 ,  H01L23/481 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An example device in accordance with an aspect of the present disclosure includes a substrate that may be disposed in a housing. The substrate includes a sprayer to spray coolant.