公开(公告)号：EP1608532B1

公开(公告)日：2007-08-15

申请号：EP04722798.8

申请日：2004-03-24

Applicant: Osram Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  GRÖTSCH, Stefan ,  REILL, Joachim

IPC: B60Q1/00 ,  F21S8/10 ,  F21S8/00

CPC classification number: B60Q1/04 ,  F21S41/143 ,  F21S41/24 ,  F21S41/28 ,  F21S41/663 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/60 ,  Y10S362/80

Abstract: The invention relates to a headlight comprising a plurality of headlight elements which respectively comprise at least one semiconductor chip emitting electromagnetic radiation; a primary lens element reducing the divergence of an incident light passing through a light input; at least one headlight element output which is used to radiate part of the light of a headlight from the headlight element. At least one of the headlight element outputs is arranged in at least two groups such that the arrangement of at least one group and/or at least the overall arrangement of the headlight element outputs corresponds essentially to a desired radiation characteristic of the headlight, such that in particular a form arises substantially corresponding to the cross-sectional shape of a desired headlight beam, whereby the semiconductor chips belonging to the headlight element outputs of one group can be respectively operated independently from the other semiconductor chips. The invention relates to a headlight element which is suitable for use with said type of headlight.

Abstract translation: 该装置具有多个头灯元件（2），每个头灯元件具有发射电磁辐射的半导体芯片，主光学元件和至少一个头灯元件输出。 至少一些前灯元件布置在至少两组（7,8）中，使得几组的元件输出的至少一个组和/或至少一个整体布置基本上对应于期望的辐射特性：独立的声明 还包括以下内容：（a）大灯元件。

公开(公告)号：EP1794787A1

公开(公告)日：2007-06-13

申请号：EP05773768.6

申请日：2005-08-08

Applicant: Osram Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  LIM, Huey Ling Rena ,  BOGNER, Georg ,  GRUBER, Stefan ,  SCHNEIDER, Markus

IPC: H01L21/48 ,  H01L23/495

CPC classification number: H01L23/49541 ,  H01L23/495 ,  H01L23/49562 ,  H01L2924/0002 ,  Y10T29/49174 ,  H01L2924/00

Abstract: The invention relates to a conductor frame (1) for at least one electronic component, comprising at least two electric connection parts (2) with respectively at least one electric connection strip (3) and at least one retaining strip (4). The connection frame (1) is characterized in that an indentation is provided between the at least one retaining strip (4) and connection part (2), creating a parallel offset between the retaining strip (4) and adjacent area of the connection part (2), and in that another parallel offset is created between the connection part (2) and electrical connection strip (3) such that the retaining strip (4) and electric connection strip (3) are located on a common plane. The retaining strip (4) can be removed easily through the indentation (8) without having to create a disadvantageous stamping gap between the connection part (2) and the retaining strip (4).

公开(公告)号：EP1516372B1

公开(公告)日：2007-01-03

申请号：EP03761408.8

申请日：2003-06-04

Applicant: Osram Opto Semiconductors GmbH

Inventor： SORG, Jörg ,  BOGNER, Georg ,  WAITL, Günter ,  BRUNNER, Reinhold

IPC: H01L33/00 ,  H01L31/02 ,  H01L23/495

CPC classification number: H01L33/62 ,  H01L31/0203 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/12041 ,  H05K1/0203 ,  H05K3/3442 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a surface-mountable light-emitting diode, comprising a chip housing, which has a lead frame (16) and a semiconductor chip (22). This semiconductor chip is situated on the lead frame (16) while in electrical contact therewith and contains an active radiation-emitting region. According to the invention, the lead frame (16) is formed by a flexible layer (12, 14) consisting of multiple layers.

公开(公告)号：EP1312124A1

公开(公告)日：2003-05-21

申请号：EP01971630.7

申请日：2001-08-22

Applicant: Osram Opto Semiconductors GmbH & Co. OHG

Inventor： BOGNER, Georg ,  BRUNNER, Herbert ,  LEX, Wolfgang ,  WAITL, Günter

IPC: H01L33/00 ,  H01L31/0203 ,  H01L25/13 ,  H01L25/16

CPC classification number: H01L33/486 ,  H01L25/13 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2924/01055 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic component comprising a semiconductor chip (1), which is mounted on a flexible chip support (6). Strip conductors (3, 5) for electrically connecting the semiconductor chip (1) are configured on a first primary surface of said support and the latter also accommodates a housing frame (7), which is filled with a radiation-permeable medium, in particular a filler compound. The invention also relates to a display device, an illumination or backlighting device and to a method for producing components according to the invention.

公开(公告)号：EP1275159A2

公开(公告)日：2003-01-15

申请号：EP01942963.8

申请日：2001-04-19

Applicant: Osram Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  KUGLER, Siegmar ,  NEUMANN, Gerald ,  NIRSCHL, Ernst ,  OBERSCHMID, Raimund ,  SCHLERETH, Karl-Heinz ,  SCHOENFELD, Olaf ,  STATH, Norbert

IPC: H01L33/00 ,  H01L27/15

CPC classification number: H01L33/20 ,  H01L33/02 ,  H01L33/08 ,  H01L33/145 ,  H01L33/44 ,  H01L2224/16225

Abstract: The invention relates to a high-radiance LED chip (1) comprising a radiation-emitting active region (32) and a window layer (2). In order to increase the radiant yield, the cross-sectional surface of the radiation-emitting active region (32) is smaller than the cross-sectional surface of the window layer (2), which is made available for disengaging the light. The invention also relates to a method for producing a lens structure on the surface of a light emitting component.

Abstract translation: 本发明涉及包括发射有辐射的有源区（32）和窗口层（2）的发光二极管芯片（1）。 为了提高发光效率，发射有源区域（32）的横截面面积小于可用于解耦光的窗口层（2）的横截面面积。 本发明还涉及一种用于在发光部件的表面上制造透镜结构的方法。

公开(公告)号：EP1259990A1

公开(公告)日：2002-11-27

申请号：EP01919164.2

申请日：2001-03-02

Applicant: Osram Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  DEBRAY, Alexandra ,  WAITL, Günther

IPC: H01L33/00

CPC classification number: H01L33/501 ,  H01L2933/0041

Abstract: The invention relates to two methods for producing semiconductor elements, wherein a luminescence converter element is directly arranged on a semiconductor body (1). According to the first method, a suspension (4) containing a bonding agent and at least one luminous substance (5) is applied to the semiconductor body (1) in the form of a coating. In the next step, the solvent is removed, whereupon only the luminous substance (5) and the bonding agent remain on the semiconductor body. According to the second method, the semiconductor body (1) is provided with a bonding coating (6) on which the luminous substance is directly deposited.

公开(公告)号：EP1547149B1

公开(公告)日：2018-11-07

申请号：EP03753272.8

申请日：2003-09-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  BREINICH, Herbert ,  LUDEWIG, Bernd ,  MAYER, Ralf ,  NOLL, Heinrich ,  SORG, Jörg, Erich

IPC: G02F1/133 ,  H01L25/075 ,  H01L33/58 ,  H01L33/60

CPC classification number: G02F1/133603 ,  G02F1/133605 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00

公开(公告)号：EP2126982B1

公开(公告)日：2018-08-29

申请号：EP08715444.9

申请日：2008-01-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： GRÖTSCH, Stefan ,  BOGNER, Georg ,  HAHN, Berthold ,  HÄRLE, Volker ,  PETERSEN, Kirstin

IPC: H01L33/50 ,  H01L25/075

CPC classification number: H01L33/508 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014

公开(公告)号：EP1378013B1

公开(公告)日：2015-09-30

申请号：EP02761866.9

申请日：2002-04-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  BRUNNER, Herbert ,  HIEGLER, Michael ,  WAITL, Günter ,  HÄNGGI, Rolf

IPC: H01L33/60 ,  H01L33/64 ,  H01L33/62

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP1588436B1

公开(公告)日：2014-10-01

申请号：EP04706121.3

申请日：2004-01-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  BOGNER, Georg ,  BRAUNE, Bert ,  WAITL, Günter

IPC: H01L33/48 ,  H01L33/52 ,  H01L33/54

CPC classification number: H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00