公开(公告)号：US5668733A

公开(公告)日：1997-09-16

申请号：US417800

申请日：1995-04-06

Applicant: Toru Morimoto ,  Kenji Hashinoki ,  Tetsuya Hamada ,  Kenji Kamei

Inventor： Toru Morimoto ,  Kenji Hashinoki ,  Tetsuya Hamada ,  Kenji Kamei

IPC: G02F1/13 ,  H01L21/00 ,  H01L21/02 ,  H01L21/677 ,  G06F19/00

CPC classification number: H01L21/67173 ,  H01L21/67178 ,  H01L21/67276 ,  H01L21/67778

Abstract: Substrates of a precedent lot are transported among first processing parts while being processed by the first processing parts. The circulating transportation for the precedent lot is interrupted after starting of the circulating transportation of the first substrate of the precedent lot before starting of the circulating transportation of the last substrate of the precedent lot. Thereafter, a substrate of a subsequent lot is transported among second processing parts while being processed by the second processing parts. Hence, processing of the substrates of the precedent and subsequent lots are concurrently processed, resulting in improving a through put.

Abstract translation: 先有批次的基板在由第一处理部件处理的同时在第一处理部件之间传送。 在先前批次的最后一个基板的循环运输开始之前，先期批次的循环运输开始循环运送先验批次的第一基板。 此后，随后的批次的基板在被第二处理部件处理的同时在第二处理部件之间传送。 因此，对先行后续批次的基板的处理同时进行处理，从而改善了投入。

公开(公告)号：US5436848A

公开(公告)日：1995-07-25

申请号：US47449

申请日：1993-04-15

Applicant: Masami Nishida ,  Masahiro Himoto ,  Tetsuya Hamada ,  Noriaki Yokono ,  Takeo Okamoto

Inventor： Masami Nishida ,  Masahiro Himoto ,  Tetsuya Hamada ,  Noriaki Yokono ,  Takeo Okamoto

IPC: H01L21/00 ,  H01L21/677 ,  G06F19/00

CPC classification number: H01L21/67103 ,  H01L21/67745

Abstract: A robot (12) takes a wafer (3f) out of an indexer (1) and then transports the same to a heat processing part (41). A wafer (3e), which has already introduced in the heat processing part (41) is took out thereof by the robot (5). The wafer (3f) is introduced in the heat processing part (41) after a waiting time (18a) so that an excess heat processing in the heat processing part (41) can be avoided. The wafer (3e) is transported to a processing part (43) and introduced therein by the robot (5). After the robot (5) repeats the similar processings in processing parts (13, 42, 44), it returns to the wafer transferring robot (12) to receive a next wafer. At that time, the robot (5) waits for a predetermined time thereby a cycle time is adjusted. After the waiting, the robot (5) takes out the wafer (3f), which has been introduced in the heat processing part (41), out thereof. Since the cycle time is set in common for different lots, the waiting times (18a, 18b) are set individually for each lot.

Abstract translation: 机器人（12）将晶片（3f）从分度器（1）中取出，然后将其输送到热处理部分（41）。 已经引入热处理部（41）的晶片（3e）被机器人（5）取出。 在等待时间（18a）之后，将晶片（3f）引入热处理部（41），从而可以避免热处理部（41）中的过度热处理。 将晶片（3e）输送到加工部（43）并由机器人（5）引入。 在机器人（5）重复处理部件（13,42,44）中的类似处理之后，返回到晶片传送机器人（12）以接收下一晶片。 此时，机器人（5）等待预定时间，从而调整循环时间。 在等待之后，机器人（5）将已经引入热处理部分（41）中的晶片（3f）取出。 由于循环时间对于不同的批次是共同设定的，因此为每个批次分别设置等待时间（18a，18b）。

公开(公告)号：US5311227A

公开(公告)日：1994-05-10

申请号：US1293

申请日：1993-01-06

Applicant: Akio Takayasu ,  Toshihiro Suzuki ,  Takeshi Goto ,  Tetsuya Kobayashi ,  Tetsuya Hamada ,  Yoshinori Tanaka ,  Takashi Kanno ,  Masaru Ishiwa ,  Makoto Goshima ,  Noriyuki Ohashi ,  Hisashi Yamaguchi

Inventor： Akio Takayasu ,  Toshihiro Suzuki ,  Takeshi Goto ,  Tetsuya Kobayashi ,  Tetsuya Hamada ,  Yoshinori Tanaka ,  Takashi Kanno ,  Masaru Ishiwa ,  Makoto Goshima ,  Noriyuki Ohashi ,  Hisashi Yamaguchi

IPC: G02F1/13 ,  G02F1/1335 ,  G02F1/1347 ,  G03B21/14 ,  H04N9/31 ,  H04N17/00 ,  G03B21/28

CPC classification number: H04N9/3105 ,  H04N9/315

Abstract: A projection display device comprising three projection lenses arranged in a row in a side by side relationship and having respective optical axes extending toward a screen, and three liquid crystal display panels forming images of red, green and blue color lights, the liquid crystal display panels and the projection lenses being arranged to form sets individually. A mirror is arranged between the display element and the projection lens of at least one of the sets. Accordingly, one of the display elements is arranged so as to face in a first direction and the adjacent display element so as to face in a second direction. It is thus possible to reduce the distance between the adjacent projection lenses even if the size of the liquid crystal display panels is enlarged.

Abstract translation: 一种投影显示装置，包括：三个投影透镜，并排配置成一排，并具有朝向屏幕延伸的各个光轴;三个液晶显示面板，形成红，绿，蓝三色的图像，液晶显示面板 并且投影透镜被布置成分别形成组。 在至少一个组的显示元件和投影透镜之间布置有反射镜。 因此，一个显示元件被布置为面向第一方向，并且相邻的显示元件以第二方向面对。 因此即使扩大液晶显示面板的尺寸，也可以减小相邻投影透镜之间的距离。

公开(公告)号：USD325726S

公开(公告)日：1992-04-28

申请号：US467233

申请日：1990-01-19

Applicant: Shinji Yamagata ,  Shinsaku Yamasaki ,  Tetsuya Hamada

Designer： Shinji Yamagata ,  Shinsaku Yamasaki ,  Tetsuya Hamada

公开(公告)号：US08932672B2

公开(公告)日：2015-01-13

申请号：US12628120

申请日：2009-11-30

Applicant: Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda ,  Tetsuya Hamada

Inventor： Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda ,  Tetsuya Hamada

IPC: B05D3/12 ,  B08B1/00 ,  B08B1/04 ,  B08B3/04 ,  G11B5/84 ,  G03F7/16 ,  G03F7/20 ,  H01L21/67 ,  G11B7/26

CPC classification number: G03F7/70925 ,  G03F7/168 ,  G03F7/7075 ,  G03F7/70916 ,  G03F7/70991 ,  G11B5/8404 ,  G11B7/261 ,  H01L21/67051 ,  H01L21/67225 ,  Y10S134/902

Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block, and an interface block. An exposure device is arranged adjacent to the interface block in the substrate processing apparatus. The exposure device subjects a substrate to exposure processing by means of an immersion method. In the edge cleaning unit in the cleaning/drying processing block, a brush abuts against an end of the rotating substrate, so that the edge of the substrate before the exposure processing is cleaned. At this time, the position where the substrate is cleaned is corrected.

Abstract translation: 基板处理装置包括分度器块，抗反射膜处理块，抗蚀剂膜处理块，显影处理块，抗蚀剂覆盖膜处理块，抗蚀剂覆盖膜去除块，清洁/干燥处理块，以及 一个接口块。 曝光装置被布置成与基板处理装置中的界面块相邻。 曝光装置通过浸渍方法使基板进行曝光处理。 在清洁/干燥处理块的边缘清洁单元中，刷子抵靠旋转基板的一端，从而清洁曝光处理之前的基板的边缘。 此时，校正基板被清洁的位置。

公开(公告)号：US08631809B2

公开(公告)日：2014-01-21

申请号：US12725981

申请日：2010-03-17

Applicant: Tetsuya Hamada ,  Takashi Taguchi

Inventor： Tetsuya Hamada ,  Takashi Taguchi

IPC: B08B3/00

CPC classification number: G03F7/20 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67303 ,  H01L21/67742 ,  H01L21/67748 ,  Y10S134/902

Abstract: An interface block is constituted by a cleaning/drying processing block and a carry-in/carry-out block. The cleaning/drying processing block includes cleaning/drying processing sections and a transport section. The transport section is provided with a transport mechanism. The carry-in/carry-out block is provided with a transport mechanism. The transport mechanism carries substrates in and out of an exposure device.

Abstract translation: 接口块由清洁/干燥处理块和进/出块组成。 清洁/干燥处理块包括清洁/干燥处理部分和传送部分。 运输部分设有运输机构。 输入/输出块具有传送机构。 输送机构将基板输入和移出曝光装置。

公开(公告)号：US08531621B2

公开(公告)日：2013-09-10

申请号：US12522768

申请日：2007-09-11

Applicant: Tetsuya Hamada

Inventor： Tetsuya Hamada

IPC: G02F1/1333 ,  G02F1/1335

CPC classification number: G02F1/133603 ,  G02F2001/133628

Abstract: A backlight device (100) includes: a case (1); a plurality of LED modules (2) provided in series on a bottom portion (1a) of the case (1); a reflective sheet (3); a diffusing plate (4); and an optical sheet (5). At the bottom portion (1a) of the case (1), four recessed portions (10) are formed in a horizontal direction of a display screen, and each of the LED modules 2 is fixed thereon with screws (11). At opposite ends of the recessed portion (10), opening portions (10a) and (10b) each having a lid member (13) are formed, thus making it possible to remove the LED modules (2) without disassembling the backlight device (100).

Abstract translation: 背光装置（100）包括：壳体（1）; 多个LED模块（2）串联设置在所述壳体（1）的底部（1a）上; 反射片（3）; 漫射板（4）; 和光学片（5）。 在壳体（1）的底部（1a）处，在显示屏的水平方向上形成四个凹部（10），并且每个LED模块2都用螺钉（11）固定在其上。 在凹部（10）的相对端形成有各自具有盖部件（13）的开口部（10a）和（10b），从而能够在不拆卸背光装置（100）的情况下取出LED模块 ）。

公开(公告)号：US20130197270A1

公开(公告)日：2013-08-01

申请号：US13878090

申请日：2011-10-05

Applicant: Naritoshi Yoshimura ,  Shinji Kiyono ,  Tetsuya Hamada ,  Eiji Watanabe ,  Saiko Sawada

Inventor： Naritoshi Yoshimura ,  Shinji Kiyono ,  Tetsuya Hamada ,  Eiji Watanabe ,  Saiko Sawada

IPC: C07C209/48

CPC classification number: C07C209/48 ,  B01J23/44 ,  B01J25/00 ,  B01J25/02 ,  C07B2200/09 ,  C07C253/22 ,  C07C253/34 ,  C07C2601/14 ,  C07C255/46 ,  C07C211/18

Abstract: A method for producing trans-1,4-bis(aminomethyl)cyclohexane includes a nuclear hydrogenation step of producing a hydrogenated terephthalic acid or terephthalic acid derivative by nuclear hydrogenation of a terephthalic acid or terephthalic acid derivative, the terephthalic acid or terephthalic acid derivative being at least one selected from the group consisting of terephthalic acid, terephthalic acid ester, and terephthalic acid amide; a cyanation step of treating the hydrogenated terephthalic acid or terephthalic acid derivative with ammonia, thereby producing 1,4-dicyanocyclohexane, and producing trans-1,4-dicyanocyclohexane from the obtained 1,4-dicyanocyclohexane; and an aminomethylation step of treating the trans-1,4-dicyanocyclohexane with hydrogen, thereby producing trans-1,4-bis(aminomethyl)cyclohexane.Metal oxide is used as a catalyst in the cyanation step, and the obtained trans-1,4-dicyanocyclohexane has a metal content of 3000 ppm or less.

Abstract translation: 反式-1,4-双（氨基甲基）环己烷的制造方法包括通过对苯二甲酸或对苯二甲酸衍生物的核氢化制造氢化对苯二甲酸或对苯二甲酸衍生物的核氢化工序，对苯二甲酸或对苯二甲酸衍生物为 选自对苯二甲酸，对苯二甲酸酯和对苯二甲酸酰胺中的至少一种; 用氨处理氢化对苯二甲酸或对苯二甲酸衍生物的氰化步骤，从而得到1,4-二氰基环己烷，由所得的1,4-二氰基环己烷生产反式-1,4-二氰基环己烷; 和用氢处理反式-1,4-二氰基环己烷的氨基甲基化步骤，从而产生反式-1,4-双（氨基甲基）环己烷。 在氰化步骤中使用金属氧化物作为催化剂，得到的反式-1,4-二氰基环己烷的金属含量为3000ppm以下。

公开(公告)号：US08460476B2

公开(公告)日：2013-06-11

申请号：US12698888

申请日：2010-02-02

Applicant: Tetsuya Hamada

Inventor： Tetsuya Hamada

IPC: B08B7/04

CPC classification number: G03F7/38 ,  G03F7/70991

Abstract: A method of processing a substrate subjected to an exposure process includes the steps of: transporting a substrate subjected to the exposure process to a cleaning processing part and performing a cleaning process in said cleaning processing part on said substrate subjected to the exposure process. The method also includes the steps of transporting said substrate subjected to the cleaning process from said cleaning processing part to a heating processing part and performing a heating process in said heating processing part on said substrate subjected to the cleaning process. A first interprocess time interval between the instant at which the exposure process of a substrate is completed and the instant at which the heating process of the substrate is started is made approximately constant, and a second interprocess time interval between the instant at which the cleaning process of the substrate is completed and the instant at which the heating process of the substrate is started is made approximately constant.

Abstract translation: 处理经受曝光处理的基板的方法包括以下步骤：将经过曝光处理的基板输送到清洁处理部分，并在经过曝光处理的所述基板上的所述清洁处理部分中进行清洁处理。 该方法还包括以下步骤：将经过清洁处理的所述基板从所述清洁处理部分运送到加热处理部分，并在经过清洁处理的所述基板上的所述加热处理部分中进行加热处理。 在完成基板的曝光处理的瞬间与开始基板的加热处理的时刻之间的第一进程间隔大致恒定，并且在清洁处理之间的第二进程间隔 并且基板的加热处理开始的时刻大致恒定。

公开(公告)号：US08368843B2

公开(公告)日：2013-02-05

申请号：US12867000

申请日：2008-11-04

Applicant: Tetsuya Hamada

Inventor： Tetsuya Hamada

IPC: G02F1/13357

CPC classification number: G02B6/0091 ,  G02B6/0046 ,  G02B6/0085 ,  G02F1/133308 ,  G02F1/133615 ,  G02F2001/133322

Abstract: A housing (HG) for a backlight unit (49) includes a bottom section (22), a wall section (23) and a side section (VP), and the side section (VP) is at least a part of a first groove (DH1) which sandwiches a mounting substrate (11).

Abstract translation: 用于背光单元（49）的壳体（HG）包括底部部分（22），壁部分（23）和侧部分（VP），并且侧部分（VP）是第一凹槽 （DH1），其夹持安装基板（11）。