Abstract:
Compositions and methods for manufacturing polymers are disclosed. Compositions include novel plastics, including films and shaped forms comprising polymer matrices that are biologically compatible and biodegradable. Such plastics may comprise polymers derived from natural sources. Further, such plastics are useful in biological systems for wound repair, implants, stents, drug encapsulation and delivery, and other applications. The disclosed methods comprise mild manufacturing processes such that various additives, such as biologically active proteins, sugars, lipids, and the like may be incorporated into the polymer matrix without subsequent loss of bioactivity during processing. Additionally, methods of manufacture for controlling mechanical properties, such as elasticity, pliancy, and the porosity of such plastics are disclosed.
Abstract:
A new conductive interconnected porous film, useful as a material for a gas diffusion layer which is used in a solid polymer type fuel cell, which satisfies the requirements of a good conductivity, good gas permeability, surface smoothness, corrosion resistance, and low impurities and which is strong in bending and excellent in handling to an extent not obtainable by existing sheet materials of carbon fiber, that is, a conductive interconnected porous film wherein a resin base material part of a thermoplastic resin has a porous interconnected cell structure which is formed by removal of removable particulate matter and has cells of sizes of 10 µm to 50 µm and wherein the resin base material part is comprised of different particle size particles of first carbon particles of large size carbon particles of a diameter of 5 µm or more and second carbon particles of micro size carbon particles of a diameter of 10 nm or more mixed together, and a method of production of the same.
Abstract:
A new conductive interconnected porous film, useful as a material for a gas diffusion layer which is used in a solid polymer type fuel cell, which satisfies the requirements of a good conductivity, good gas permeability, surface smoothness, corrosion resistance, and low impurities and which is strong in bending and excellent in handling to an extent not obtainable by existing sheet materials of carbon fiber, that is, a conductive interconnected porous film wherein a resin base material part of a thermoplastic resin has a porous interconnected cell structure which is formed by removal of removable particulate matter and has cells of sizes of 10 µm to 50 µm and wherein the resin base material part is comprised of different particle size particles of first carbon particles of large size carbon particles of a diameter of 5 µm or more and second carbon particles of micro size carbon particles of a diameter of 10 nm or more mixed together, and a method of production of the same.
Abstract:
Described herein are open celled foams including a matrix of interconnected spheres. Also described herein are methods of making open celled foams as well as making composite members with open celled foam coatings covering at least a portion of the composite member. The open celled foams described herein are silicone based materials and can be used to coat implants such as breast implants and function to encourage tissue ingrowth and reduce capsular formation.
Abstract:
The present disclosure describes a method for forming microporous and antimicrobial articles. The method comprises preparing an initial composition containing a semicrystalline polylactic acid material, a nonpolymeric aliphatic ester diluent, and a nucleating agent. The initial composition is heated to form a melt blended composition. Upon cooling, the melt blended composition phase separates into a composition having two continuous phases. A network of interconnected micropores may be formed by stretching the composition, by removing at least a portion of the nonpolymeric aliphatic ester diluent from the composition, or a combination thereof.
Abstract:
Compositions useful in the preparation of porous organic polysilica films, particularly for use in the manufacture of integrated circuits, are provided. Methods of forming such compositions and films are also provided.