Thermoconducting silicone composition, its curing product and installation method, and a heat dissipating structure of a semiconductor device using same
    71.
    发明申请
    Thermoconducting silicone composition, its curing product and installation method, and a heat dissipating structure of a semiconductor device using same 有权
    热固性硅酮组合物,其固化产物和安装方法以及使用其的半导体器件的散热结构

    公开(公告)号:US20030127496A1

    公开(公告)日:2003-07-10

    申请号:US10316078

    申请日:2002-12-11

    Abstract: This invention discloses a thermoconducting silicone composition comprising the following components (A)-(F), whereof the viscosity at 25null C. before curing is 10-1000 Panulls, a method of installing this composition, a heat dissipating structure of a semiconductor device using the same, and a cured material formed by heating this composition in two steps. Component (A): 100 weight parts of an organopolysiloxane having at least two alkenyl groups in the molecule, and a viscosity of 10-100,000 mm2/s at 25null C., Component (B): An organohydrogenpolysiloxane having at least two hydrogen atoms bonded directly to silicon atoms in the molecule, in an amount such that (total number of hydrogen atoms bonded directly to silicon atoms/total number of alkenyl groups in Component (A)) is 0.5-5.0, Component (C): A low melting metal powder having a melting point of 40-250null C., and an average particle size of 0.1-100 micrometers, Component (D): A highly thermoconducting filler having a melting point of more than 250null C., and an average particle size of 0.1-100 micrometers, the total amount of component (C) and Component (D) being 800-2,200 weight parts, and (C)/((C)null(D))null0.05-0.9, Component (E): A catalytic platinum selected from a group comprising platinum and platinum compounds, 0.1-500 ppm relative to Component (A) calculated in terms of platinum atom, Component (F): 0.001-5 weight parts of a controlling agent which suppresses the catalytic activity of Component (E).

    Abstract translation: 本发明公开了一种导热硅氧烷组合物,其包含以下组分(A) - (F),其中在固化前25℃下的粘度为10-1000Pa·s,安装该组合物的方法,散热结构 使用其的半导体装置以及通过两步加热该组合物而形成的固化物。 组分(A):100重量份分子中具有至少两个烯基的有机聚硅氧烷,25℃下的粘度为10-100,000mm 2 / s。组分(B):具有至少两个氢原子的有机氢聚硅氧烷 成分(C):低熔点(C):成分(C):低分子量(C):低分子量的碳原子直接与硅原子直接键合,其数量使得(直接与硅原子键合的氢原子的总数/成分(A)中的烯基的总数)为0.5〜 熔点为40-250℃,平均粒度为0.1-100微米的金属粉末,组分(D):熔点大于250℃的高导热性填料,平均粒子 组分(C)和组分(D)的总量为800-2200重量份,(C)/((C)+(D))= 0.05-0.9,组分(E) :选自铂和铂化合物的催化剂铂,相对于以铂a计算的成分(A)为0.1-500ppm 成分(F):0.001-5重量份抑制成分(E)的催化活性的控制剂。

    Nobel metal and solid-phase lubricant composition and electrically
conductive interconnector
    74.
    发明授权
    Nobel metal and solid-phase lubricant composition and electrically conductive interconnector 失效
    诺贝尔金属和固相润滑剂组合物和导电互连器

    公开(公告)号:US5316507A

    公开(公告)日:1994-05-31

    申请号:US56289

    申请日:1993-04-30

    Inventor: Patrick O. Capp

    Abstract: A noble metal and solid-phase lubricant composition and an an electrically conductive interconductor including the electrically conductive composition are disclosed. The electrically conductive composition includes a noble metal component and a solid-phase lubricant component. The solid-phase lubricant component is present in an amount sufficient to cause the electrically conductive composition to have a coefficient of friction which is significantly lower than the coefficient of friction of the noble metal component without causing the electrically conductive composition to be significantly less malleable than the noble metal component, nor to be significantly less corrosion resistant than the noble metal component. The electrically conductive composition can form a contact layer of the electrically conductive interconnector. The contact layer is bonded to a diffusion barrier which, in turn, is bonded to a bulk electrical conductor of the electrically conductive interconnector.

    Abstract translation: 公开了贵金属和固相润滑剂组合物和包括导电组合物的导电互导体。 导电组合物包括贵金属组分和固相润滑剂组分。 固相润滑剂组分的存在量足以导致导电组合物具有明显低于贵金属组分的摩擦系数的摩擦系数,而不导致导电组合物的韧度比 贵金属组分,也不比贵金属组分显着更少的耐腐蚀性。 导电组合物可以形成导电互连器的接触层。 接触层结合到扩散阻挡层,该扩散阻挡层又接合到导电互连器的体电导体。

    2상 나노포러스 유리질 탄소 물질 및 그 제조방법
    77.
    发明公开
    2상 나노포러스 유리질 탄소 물질 및 그 제조방법 有权
    双相纳米复合碳材料及其制造方法

    公开(公告)号:KR1020080091818A

    公开(公告)日:2008-10-14

    申请号:KR1020087020297

    申请日:2007-01-27

    Abstract: A biphasic nanoporous vitreous carbon material with a cementitious morphology characterized by presence of non-round porosity, having superior hardness and tribological properties, as useful for high wear-force applications. The biphasic nanoporous vitreous carbon material is produced by firing, under inert atmosphere, of particulate vitrified carbon in a composition containing (i) a precursor resin that is curable and pyrolyzable to form vitreous carbon and, optionally, (ii) addition of one or more of the following: solid lubricant, such as graphite, boron nitride, or molybdenum disulfide; a heat-resistant fiber reinforcement, such as copper, bronze, iron alloy, graphite, alumina, silica, or silicon carbide; or one or more substances to improve electrical conductivity, such as dendritic copper powder, copper ''felt'' or graphite flake, to produce a superior vitreous carbon that is useful alone or as a continuous phase in reinforced composites, in relation to conventional glassy carbon materials.

    Abstract translation: 具有水泥质形态的双相纳米孔玻璃碳材料,其特征在于存在非圆形孔隙率,具有优异的硬度和摩擦学性能,对于高磨损应用是有用的。 双相纳米多孔玻璃碳材料是通过在惰性气氛下在含有(i)可固化和可热解以形成玻璃碳的前体树脂的组合物中,在惰性气氛下焙烧,并且任选地(ii)加入一种或多种 如下:固体润滑剂,如石墨,氮化硼或二硫化钼; 铜,青铜,铁合金,石墨,氧化铝,二氧化硅或碳化硅等耐热纤维增强材料; 或一种或多种用于改善导电性的物质,例如树枝状铜粉末,铜“毡”或石墨片,以产生相对于常规玻璃状物单独使用或作为连续相在增强复合材料中有用的优质玻璃碳 碳材料。

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