FLOOR PANEL AND METHODS FOR MANUFACTURING FLOOR PANELS

    公开(公告)号:US20230407648A1

    公开(公告)日:2023-12-21

    申请号:US18037659

    申请日:2021-11-23

    Inventor: Aaron Shaw

    CPC classification number: E04F15/042 E04F15/02038 E04F2201/0552

    Abstract: Floor panel with a substrate (8) and a provided thereon decorative layer (6) of wood veneer (7) with a thickness (T1) of 1 millimeter or less, wherein a lacquer layer (23) including transparent or translucent surface material is provided on the wood veneer (7), wherein the lacquer layer (23) preferably comprises hard particles and extends from the upper surface of the wood veneer (7) at least up to a side edge (28) of the wood veneer (7), such that the side edge (28) is at least partially covered by the lacquer (23).

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