Abstract:
[Technical Problem] A dielectric waveguide filter comprising resonators coupled via a coupling window is likely to cause, at the time of arranging the resonators, an error in the position or dimension of the coupling window due to positional displacement, or leakage of electromagnetic field from the coupling window due to a gap generated between the resonators, leading to degradation of frequency characteristic. A dielectric filter provided with constricted portions has the drawback of being difficult to be applied to a filter in which connection between resonators is complicated. [Solution to the Problem] A dielectric waveguide filter is provided, which comprises a plurality of resonator groups disposed on a substrate, wherein each of the resonator groups comprises one or more integrally-formed resonators, each obtained by coating a dielectric body with a conductor film, wherein each resonator group in at least a set of resonator groups of the plurality of resonator groups comprises waveguide-side slot exposing the dielectric body in a bottom surface thereof, wherein the substrate comprises a cavity surrounded by conductor patterns formed in the upper and lower surfaces, and by a via hole connecting the conductor patterns in the upper and lower surfaces, wherein the cavity comprises a set of substrate-side slots exposing the core material, the set of substrate-side slots being provided at a position to which waveguide-side slots of the set of resonator groups are opposed, and wherein resonator groups in the set of resonator groups are coupled together via the cavity.
Abstract:
The present invention relates to a waveguide E-plane filter component comprising a first and second main part (2) with a corresponding first and second waveguide section part (3). The main parts (2) are mounted to each other, such that a waveguide arrangement is formed. The waveguide arrangement has a height and a width. The waveguide E-plane filter component further comprises at least one electrically conducting foil (10, 11) that is placed between the main parts (3), said foil comprising a filter part (25) with apertures (12a, 12b, 12c, 12d). Each pair of adjacent apertures is separated by a corresponding foil conductor (13a, 13b, 13c) of which at least one is constituted by a tuning foil conductor (13a) that has a first, second and third part (14, 16, 18) with a corresponding first, second and third width (15, 17, 19).
Abstract:
Electromagnetic Filter, composed of at least one lossy mismatched electrical line element (or another lossy distributed wave propagating structure), having at one or both of its interfaces other distributed constant line structures or lumped components, chosen so as to introduce characteristic impedance discontinuities, characterized by: a/ these interfaces represent lines with characteristic impedances different from the electrical line element, b/ these interfaces represent lumped components with impedances different from the electrical line element, c/ these interfaces represent mixed impedances a/ and b:
Abstract:
A high-frequency module (10) includes a semiconductor chip device (20) that is mounted on an external circuit substrate (300) by wire bonding. A switch forming section (101), a power amplifier forming section (102) and a low noise amplifier forming section (103), realized by a group of FETs, which are active elements, are formed in the semiconductor chip device (20). In addition, flat plate electrodes, which form capacitors (121, 122, 123) are formed in the semiconductor chip device (20). Conductor wires (211, 212, 213) that connect the external circuit substrate (300) and the semiconductor chip device 20 function as inductors. Thus, a group of passive elements that includes inductors and capacitors is formed. As a result, a high-frequency module that can be reduced in size while still obtaining the required transmission characteristic can be provided.
Abstract:
A transverse magnetic (TM) mode dielectric filter includes an enclosure, a dielectric resonator, a main cover, and an elastic component, where the dielectric resonator is disposed in a resonant cavity of the enclosure; the main cover is secured between the elastic component and an open end of the enclosure; the elastic component includes multiple elastic flaps; the multiple elastic flaps are evenly distributed around an axial direction of the dielectric resonator; one end of each of the elastic flaps is fixedly connected to the main cover, and free ends of the elastic flaps elastically act on a central part of an outer surface of the main cover, to provide an elastic force towards the dielectric resonator. The evenly distributed multiple elastic flaps produce a pressure towards the dielectric resonator so that a uniform and stable pressure is produced around the dielectric resonator, to ensure a uniform current density inside the resonant cavity. In this way, intermodulation performance can be greatly improved and kept stable in a long term; the main cover fits with the enclosure and the dielectric resonator in an adhering manner; and the elastic component is disposed on the outer surface of the main cover, the elastic component does not need to be electroplated, and high precision is not required, thereby reducing processing costs.
Abstract:
The present invention provides a method for implementing a TM dielectric resonator, and the method includes: a dielectric resonant column component with a metal connecting plate is machined; a metal cavity with an opening at one end is machined; the metal connection plate of the dielectric resonant column component is fastened to the inner wall of the metal cavity by a screw; the opening of the metal cavity is covered with a prefabricated cover plate; and a prefabricated tuning screw is screwed from the cover plate into the metal cavity. According to the method for implementing the TM dielectric resonator, the machining process is simple, and the machined TM dielectric resonator is small in volume, excellent in performance and high in operational reliability. An embodiment of the present invention further provides a TM dielectric resonator machined by the method above and a dielectric filter formed by one or more TM dielectric resonators.
Abstract:
A high-frequency module (10) includes a semiconductor chip device (20) that is mounted on an external circuit substrate (300) by wire bonding. A switch forming section (101), a power amplifier forming section (102) and a low noise amplifier forming section (103), realized by a group of FETs, which are active elements, are formed in the semiconductor chip device (20). In addition, flat plate electrodes, which form capacitors (121, 122, 123) are formed in the semiconductor chip device (20). Conductor wires (211, 212, 213) that connect the external circuit substrate (300) and the semiconductor chip device 20 function as inductors. Thus, a group of passive elements that includes inductors and capacitors is formed. As a result, a high-frequency module that can be reduced in size while still obtaining the required transmission characteristic can be provided.