公开(公告)号：US20250067943A1

公开(公告)日：2025-02-27

申请号：US18515002

申请日：2023-11-20

Applicant: CREATIVE SENSOR INC.

Inventor： Yi-Hsuan LIN ,  Chi-Wen CHEN ,  Craig Thomas JOHNSON

IPC: G02B6/42

Abstract: An image sensing module includes: a substrate; an optical sensing element disposed on the substrate; and a light-guide component disposed on the optical sensing element, and including a first light adjusting layer and a second light adjusting layer. The second light adjusting layer is disposed on the first light adjusting layer. The first light adjusting layer has a first light transmitting region, and the second light adjusting layer has a second light transmitting region. The first light transmitting region and the second light transmitting region are disposed corresponding to the optical sensing element.

公开(公告)号：US09780133B2

公开(公告)日：2017-10-03

申请号：US14817294

申请日：2015-08-04

Applicant: Creative Sensor Inc.

Inventor： Ming-Chieh Lin

IPC: H01L27/146

CPC classification number: H01L27/14627 ,  G02B3/005 ,  G02B13/0085

Abstract: A wafer-level lens structure for contact image sensor (CIS) module includes a printed circuit board (PCB) and an image sensor electrically connected to the PCB and comprising a circuit area and a light sensitive area. The light sensitive area comprises an optoelectronic conversion array, a first lens array arranged on the optoelectronic conversion array and comprising a plurality of first cover lens, each of first cover lens having a first curved face to focus the external image light to the optoelectronic conversion array, and an aperture array arranged on the first lens array and comprising a plurality of apertures to expose the first curved face, the aperture array controlling a light amount passing through the cover lens. The first curved face of the cover lens has such a curvature that a predetermined focus point can be achieved by the plurality of first cover lens.

公开(公告)号：US09036220B2

公开(公告)日：2015-05-19

申请号：US14157072

申请日：2014-01-16

Applicant: Creative Sensor Inc.

Inventor： Ting-Pin Lu ,  Ming-Chieh Lin ,  Jia-Lin Lee

IPC: H04N1/04 ,  H04N1/028 ,  H04N1/10

CPC classification number: H04N1/02855 ,  H04N1/0286 ,  H04N1/10

Abstract: A contact image sensing device includes a housing, a light emitting unit, a red lens array, a sensing unit, and a protecting component. The housing includes a top surface, a bottom surface, an accommodating groove, and a slot. The bottom surface is opposite to the top surface. The accommodating groove is formed on the top surface and concave toward to bottom surface. The slot penetrates the top surface and the bottom surface. The light-emitting unit is arrange within the accommodating groove. The rod lens array is arranged within the slot. The sensing unit is arranged below the housing. The protecting component includes a main body, a recess, and a lighting slot communicating with the recess, a top end of the rod lens array is assembled with the recess. The main body of the protecting member forms at least one containing recess. A combining component for combining the rod lens array and the protecting member is disposed within the containing recess.

Abstract translation: 接触图像感测装置包括壳体，发光单元，红色透镜阵列，感测单元和保护部件。 壳体包括顶表面，底表面，容纳槽和槽。 底面与顶面相反。 容纳槽形成在顶面上并朝向底面凹陷。 槽穿过顶面和底面。 发光单元布置在容纳槽内。 棒状透镜阵列布置在槽内。 感测单元布置在外壳下方。 保护部件包括主体，凹部和与凹部连通的照明槽，杆状透镜阵列的顶端与凹部组装。 保护构件的主体形成至少一个容纳凹部。 用于组合棒状透镜阵列和保护构件的组合部件设置在容纳凹部内。

公开(公告)号：US20040264190A1

公开(公告)日：2004-12-30

申请号：US10819431

申请日：2004-04-07

Applicant: Creative Sensor Inc.

Inventor： Ling Ta Su ,  I Wang Wen

IPC: F21V007/04

CPC classification number: H04N1/02845 ,  H04N1/02815 ,  H04N2201/03112 ,  H04N2201/03129 ,  H04N2201/03141 ,  H04N2201/03145

Abstract: A light source module structure for a CIS module of a scanner, a multi-function printer (MFP) or a copy machine is provided. The light source module structure includes a housing having a first circuit board therein; a light-sensing element disposed on the first circuit board and electrically connected to the first circuit board; a lens disposed in the housing and being parallel to the light-sensing element; and at least one organic electro luminescent element integration disposed in the housing to provide a light source.

Abstract translation: 提供了一种用于扫描仪，多功能打印机（MFP）或复印机的CIS模块的光源模块结构。 光源模块结构包括其中具有第一电路板的壳体; 光感测元件，其设置在所述第一电路板上并电连接到所述第一电路板; 透镜，设置在壳体中并且平行于光感测元件; 以及设置在壳体中的至少一个有机电致发光元件集成以提供光源。

公开(公告)号：US12092318B1

公开(公告)日：2024-09-17

申请号：US18200252

申请日：2023-05-22

Applicant: CREATIVE SENSOR INC.

Inventor： Ming-Ju Lee ,  Hung-Ming Chang

IPC: F21Y115/10 ,  F21V7/00

CPC classification number: F21V7/0066 ,  F21V7/005 ,  F21Y2115/10

Abstract: The disclosure discloses a light emitting module, including: a linear light-guiding unit, including a light incident surface located on a side end thereof and a protrusive reflection structure disposed on a bottom side thereof; and a light emitting unit, disposed on the light incident surface. The light emitting unit is configured to emit a light to enter the linear light-guiding unit through the light incident surface, and the light is reflected by the protrusive reflection structure. On a side view, a first included angle is defined between the protrusive reflection structure and the bottom side, and the first included angle is greater than or equal to 15.0 degrees and equal to or less than 35.0 degrees.

公开(公告)号：US20150070735A1

公开(公告)日：2015-03-12

申请号：US14157072

申请日：2014-01-16

Applicant: Creative Sensor Inc.

Inventor： Ting-Pin LU ,  Ming-Chieh LIN ,  Jia-Lin LEE

IPC: H04N1/028 ,  H04N1/10

CPC classification number: H04N1/02855 ,  H04N1/0286 ,  H04N1/10

Abstract: A contact image sensing device includes a housing, a light emitting unit, a red lens array, a sensing unit, and a protecting component. The housing includes a top surface, a bottom surface, an accommodating groove, and a slot. The bottom surface is opposite to the top surface. The accommodating groove is formed on the top surface and concave toward to bottom surface. The slot penetrates the top surface and the bottom surface. The light-emitting unit is arrange within the accommodating groove. The rod lens array is arranged within the slot. The sensing unit is arranged below the housing. The protecting component includes a main body, a recess, and a lighting slot communicating with the recess, a top end of the rod lens array is assembled with the recess.

Abstract translation: 接触图像感测装置包括壳体，发光单元，红色透镜阵列，感测单元和保护部件。 壳体包括顶表面，底表面，容纳槽和槽。 底面与顶面相反。 容纳槽形成在顶面上并朝向底面凹陷。 槽穿过顶面和底面。 发光单元布置在容纳槽内。 棒状透镜阵列布置在槽内。 感测单元布置在外壳下方。 保护部件包括主体，凹部和与凹部连通的照明槽，杆状透镜阵列的顶端与凹部组装。

公开(公告)号：DE102024101739A1

公开(公告)日：2025-05-15

申请号：DE102024101739

申请日：2024-01-22

Applicant: CREATIVE SENSOR INC

Inventor： SUNG YU-HUAN ,  WU SHAO-YANG

IPC: H04N7/01 ,  H04N23/23

Abstract: Es ist eine Kamera (300, 800) offenbart, die einen Infrarot-Wärmesensor (310), einen Prozessor (320) und ein Schnittstellenmodul (330) einschließt. Der Infrarot-Wärmesensor (310) ist konfiguriert, um ursprüngliche Abtastdaten (510) zu erzeugen. Der Prozessor (320) ist konfiguriert, um die ursprünglichen Abtastdaten (510) zu verarbeiten und ein unsichtbares Lichtbild (530, 710), dessen Pixeldatengröße ein Byte ist, und mehrere Temperaturdaten (520, 720), deren Einheitsdatengröße zwei Byte ist, zu erzeugen. Das Schnittstellenmodul (330) schließt mehrere Übertragungsschnittstellen ein und ist konfiguriert, um ein heterogenes Bild (730, 805), dessen Pixeldatengröße drei Bytes ist, über eine der mehreren Übertragungsschnittstellen zu übertragen, wobei ein Bitwert der drei Bytes eine Linearkombination aus einem Bitwert des einen Bytes und einem Bitwert der zwei Bytes ist. Der Prozessor (320) ist konfiguriert, um das unsichtbare Lichtbild (530, 710) und die mehreren Temperaturdaten (520, 720) gemäß einem RGB-Farbmodellkanal zusammenzuführen, um das heterogene Bild (730, 805) eines sichtbaren Lichtbildformats zu erhalten.

公开(公告)号：EP2992815A1

公开(公告)日：2016-03-09

申请号：EP14196955.0

申请日：2014-12-09

Applicant: Creative Sensor Inc.

Inventor： Hsiao, Pin-Huang ,  Weng, Jen-Chun ,  Chen, Chih-Yang

IPC: A61B5/00 ,  A61B5/01 ,  G01K1/14

CPC classification number: A61B5/015 ,  A61B5/01 ,  A61B5/026 ,  A61B5/447 ,  A61B5/702 ,  A61B5/7282 ,  A61B5/746 ,  G01K13/002

Abstract: An early detection electronic device (1, 5) of diabetic foot for lesion in the blood circulation detects foot temperatures and includes a base (10, 50), a first temperature detector (12, 12', 52, 52'), a second temperature detector (14, 54, 54'), and a microprocessor (16, 56). The base (10, 50) includes a platform part (100, 500), a first arranging part (102, 502), and a second arranging part (104, 504). The first arranging part (102, 502) is connected to the platform part (100, 500) and the second arranging part (104, 504). The first temperature detector (12, 12', 52, 52') is arranged on the first arranging part (102, 502) and detects foot temperature along a first axis (A1). The second temperature detector (14, 54, 54') is arranged on the second arranging part (104, 504) and detects foot temperature along a second axis (A2). There is an included angle between the first axis (A1) and the second axis (A2). The microprocessor (16, 56) receives the temperatures detected by the first temperature detector (12, 12', 52, 52') and the second temperature detector (14, 54, 54'), and generates a warning signal when the first temperature is lower than the second temperature.

Abstract translation: 用于血液循环中的损伤的糖尿病足的早期检测电子装置（1,5）检测足部温度，并且包括基部（10,50），第一温度检测器（12,12'，52,52'），第二温度检测器 温度检测器（14,54,54'）和微处理器（16,56）。 基座（10,50）包括平台部分（100,500），第一布置部分（102,502）和第二布置部分（104,504）。 第一布置部分（102,502）连接到平台部分（100,500）和第二布置部分（104,504）。 第一温度检测器（12,12'，52,52'）布置在第一布置部分（102,502）上并且沿着第一轴线（A1）检测脚部温度。 第二温度检测器（14,54,54'）布置在第二布置部分（104,504）上，并且沿着第二轴线（A2）检测脚部温度。 在第一轴线（A1）和第二轴线（A2）之间存在夹角。 微处理器（16,56）接收由第一温度检测器（12,12'，52,52'）和第二温度检测器（14,54,54'）检测的温度，并且当第一温度 低于第二温度。