Method for isolating semiconductor device
    81.
    发明授权
    Method for isolating semiconductor device 失效
    隔离半导体器件的方法

    公开(公告)号:US5702975A

    公开(公告)日:1997-12-30

    申请号:US719876

    申请日:1996-09-25

    CPC classification number: H01L29/66462 H01L21/28587 H01L21/7605

    Abstract: A method for isolating a semiconductor device is disclosed including the steps of sequentially growing a plurality of material layers on a semiconductor substrate, etching the material layers down to a predetermined depth of the substrate to thereby define an active region, forming a semi-insulating film on the exposed semiconductor substrate in order to planarize the step-difference of the active region and the isolation region, and then, forming an ohmic metal layer on a space where the semi-insulating film is regrown.

    Abstract translation: 公开了一种用于隔离半导体器件的方法,包括以下步骤:在半导体衬底上顺序生长多个材料层,将材料层蚀刻到衬底的预定深度,从而限定有源区,形成半绝缘膜 在露出的半导体衬底上,以平坦化有源区和隔离区的阶梯差,然后在再次生长半绝缘膜的空间上形成欧姆金属层。

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