公开(公告)号：US09136161B2

公开(公告)日：2015-09-15

申请号：US13909892

申请日：2013-06-04

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Dariusz Golda

IPC: H01L21/683 ,  H01L23/00 ,  H01L21/768 ,  B81C99/00

CPC classification number: H01L21/6833 ,  B81C99/002 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/76898 ,  H01L24/75 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Micro pick up arrays for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array includes a compliant contact for delivering an operating voltage from a voltage source to an array of electrostatic transfer heads. In an embodiment, the compliant contact is moveable relative to a base substrate of the micro pick up array.

Abstract translation: 公开了用于从载体衬底传送微器件的微拾取阵列。 在一个实施例中，微拾取阵列包括用于将工作电压从电压源传送到静电转印头阵列的柔性接触件。 在一个实施例中，柔性接触件可相对于微拾取阵列的基底基板移动。

公开(公告)号：US20150235121A1

公开(公告)日：2015-08-20

申请号：US14183427

申请日：2014-02-18

Applicant: LuxVue Technology Corporation

Inventor： Vikram Pavate ,  Andreas Bibl

IPC: G06K19/077 ,  H05K3/20 ,  H05K3/14 ,  H05K3/34 ,  H05K3/12

CPC classification number: G06K19/07783 ,  H05K1/0293 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2203/107 ,  H05K2203/175 ,  Y10T29/49144 ,  Y10T29/53174

Abstract: An integrated micro chip, method of integrating a micro chip, and micro chip integration system are described. In an embodiment, a micro chip such as a micro RFID chip or integrated passive device (IPD) is electrostatically transferred and bonded to a conductive pattern including a line break. In an embodiment, the line break is formed by a suitable cutting technique such as laser laser ablation, ion beam etching, or photolithography with chemical etching to accommodate the micro chip.

Abstract translation: 描述了集成微芯片，集成微芯片的方法和微芯片集成系统。 在一个实施例中，诸如微型RFID芯片或集成无源器件（IPD）的微芯片被静电转印并结合到包括断线的导电图案。 在一个实施例中，线断裂通过合适的切割技术形成，例如激光激光烧蚀，离子束蚀刻或具有化学蚀刻的光刻以适应微芯片。

公开(公告)号：US09111464B2

公开(公告)日：2015-08-18

申请号：US13920912

申请日：2013-06-18

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Kelly McGroddy

IPC: H01L33/00 ,  G09F9/00 ,  H01L33/50 ,  H01L25/075 ,  G02F1/1335 ,  G09G3/32

CPC classification number: H01L25/167 ,  G02F1/133603 ,  G02F1/133617 ,  G02F2001/133614 ,  G09F9/00 ,  G09G3/32 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/322 ,  H01L27/3246 ,  H01L33/38 ,  H01L33/50 ,  H01L33/501 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/507 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L51/5281 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display and method of manufacture are described. The display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum. An array of micro LED device pairs are mounted within each subpixel to provide redundancy. An array of wavelength conversion layers comprising phosphor particles are formed over the array of micro LED device pairs for tunable color emission spectrum.

Abstract translation: 描述了显示器和制造方法。 显示器可以包括包括像素阵列的基板，每个像素包括多个子像素，并且像素内的每个子像素被设计用于不同的发色光谱。 每个子像素中安装有一组微型LED器件对，以提供冗余。 包含磷光体粒子的波长转换层阵列形成在微型LED器件对阵列上，用于可调色彩发射光谱。

公开(公告)号：US09087764B2

公开(公告)日：2015-07-21

申请号：US13952450

申请日：2013-07-26

Applicant: LuxVue Technology Corporation

Inventor： Clayton Ka Tsun Chan ,  Andreas Bibl

IPC: H01L29/18 ,  H01L33/00 ,  H01L27/15 ,  H01L33/06

CPC classification number: H01L27/156 ,  H01L24/00 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/06 ,  H01L2224/7598 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. The stabilization layer is bonded to a spacer side of a carrier substrate. The spacer side of the carrier substrate includes raised spacers extending from a spacer-side surface of the carrier substrate.

Abstract translation: 公开了一种用于形成微器件阵列的方法和结构。 在包括在稳定层中的稳定柱的阵列上形成微器件阵列。 稳定层结合到载体基板的间隔侧。 载体基板的间隔件侧包括从载体基板的间隔件侧表面延伸的凸起间隔件。

公开(公告)号：US20150179876A1

公开(公告)日：2015-06-25

申请号：US14137847

申请日：2013-12-20

Applicant: LuxVue Technology Corporation

Inventor： Hsin-Hua Hu ,  Kelly McGroddy

IPC: H01L33/06 ,  H01L33/20 ,  H01L33/60

CPC classification number: H01L33/06 ,  H01L33/0095 ,  H01L33/14 ,  H01L33/20 ,  H01L33/405 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/95 ,  H01L2924/12044 ,  H01L2933/0016 ,  H01L2924/00

Abstract: A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined current injection area, embedded mirror, or sidewall passivation layer, and any combination thereof.

Abstract translation: 公开了一种用于形成LED器件阵列的方法和结构。 根据本发明的实施例的LED器件可以包括有限电流注入区域，嵌入式反射镜或侧壁钝化层及其任何组合。

公开(公告)号：US20140339495A1

公开(公告)日：2014-11-20

申请号：US13894255

申请日：2013-05-14

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Kelly McGroddy

IPC: H01L33/50 ,  H01L33/06

CPC classification number: H01L33/504 ,  H01L27/156 ,  H01L33/06 ,  H01L33/502 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/82

Abstract: A light emitting device and method of manufacture are described. In an embodiment, the light emitting device includes a micro LED device bonded to a bottom electrode, a top electrode in electrical contact with the micro LED device, and a wavelength conversion layer around the micro LED device. The wavelength conversion layer includes phosphor particles. Exemplary phosphor particles include quantum dots that exhibit luminescence due to their size, or particles that exhibit luminescence due to their composition.

Abstract translation: 描述了一种发光器件及其制造方法。 在一个实施例中，发光器件包括结合到底部电极的微型LED器件，与微型LED器件电接触的顶部电极以及围绕微型LED器件的波长转换层。 波长转换层包括磷光体颗粒。 示例性荧光体颗粒包括由于其尺寸而显示发光的量子点或由于其组成而显示发光的颗粒。

公开(公告)号：US20140299837A1

公开(公告)日：2014-10-09

申请号：US14312554

申请日：2014-06-23

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L33/06 ,  H01L33/30 ,  H01L33/28 ,  H01L27/15

CPC classification number: H01L33/06 ,  F21V7/00 ,  H01L25/0753 ,  H01L27/15 ,  H01L29/0684 ,  H01L33/0079 ,  H01L33/04 ,  H01L33/20 ,  H01L33/28 ,  H01L33/30 ,  H01L2224/95

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Abstract translation: 描述了微型发光二极管（LED）和形成用于传送到接收基板的微型LED阵列的方法。 微型LED结构可以包括微型p-n二极管和金属化层，金属化层位于微型p-n二极管和结合层之间。 保形介质阻挡层可以跨越微型p-n二极管的侧壁。 微型LED结构和微型LED阵列可以被拾取并转移到接收衬底。

公开(公告)号：US20140299572A1

公开(公告)日：2014-10-09

申请号：US14312551

申请日：2014-06-23

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Dariusz Golda

IPC: B81C1/00

CPC classification number: B81C1/0015 ,  B81B2203/0118 ,  B81C99/002 ,  H01L33/0095

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring arm having integrated electrode leads that is deflectable into a space between a base substrate and the spring arm.

公开(公告)号：US20140241843A1

公开(公告)日：2014-08-28

申请号：US13776158

申请日：2013-02-25

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl ,  Paul Argus Parks ,  Stephen Paul Bathurst

IPC: B25J15/00 ,  B25J11/00

CPC classification number: B25J9/1015 ,  B25J7/00 ,  B25J9/0015 ,  B25J15/0052 ,  B25J15/0085 ,  B25J17/0208 ,  H01L21/67144 ,  H01L21/67721 ,  H01L21/68 ,  H01L21/6833 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75282 ,  H01L2224/7565 ,  H01L2224/75723 ,  H01L2224/75725 ,  H01L2224/75823 ,  H01L2224/759 ,  H01L2224/75901 ,  H01L2224/7592 ,  H01L2224/7598 ,  H01L2224/75984 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。

公开(公告)号：US20140196851A1

公开(公告)日：2014-07-17

申请号：US14173693

申请日：2014-02-05

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: B32B38/18

CPC classification number: B32B38/18 ,  B81C99/002 ,  H01L21/6835 ,  H01L23/5384 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/0002 ,  Y10T156/17 ,  H01L2924/00

Abstract: A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure.

Abstract translation: 描述了一种兼容的单极微器件传输头阵列和从SOI衬底形成兼容单极微器件传输阵列的方法。 在一个实施例中，微器件转移头阵列包括基底衬底和在基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括在硅互连上方突出的台面结构，并且每个硅电极可偏转到基底基板和硅电极之间的空腔中。 介电层覆盖每个台面结构的顶面。