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81.发明专利
公开(公告)号：JP2010247118A
公开(公告)日：2010-11-04
申请号：JP2009101595
申请日：2009-04-20
Inventor： KURITA MICHIO , SHIBUYA EIJI
CPC classification number: Y02W10/15
Abstract: PROBLEM TO BE SOLVED: To provide a method of easily and stably reducing COD Cr in high concentration silicone waste liquid containing COD Cr for 500 mg/l or more to the level of 100 mg/l or less. SOLUTION: To the high concentration silicone waste liquid, pH adjustment, Fenton treatment, deposition and flocculation treatment by making pH high, activated sludge treatment and flocculation treatment are executed in the order. Activated carbon adsorption treatment is executed finally, and COD Cr of the high concentration silicone waste liquid is reduced. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：为了提供一种容易且稳定地将含有COD
Cr 的高浓度有机硅废液中的COD Cr 还原为500mg / l以上的方法， 水平为100mg / l以下。 解决方案：对高浓度硅氧烷废液进行pH调节，Fenton处理，沉淀和絮凝处理，pH值高，活性污泥处理和絮凝处理按顺序执行。 最终进行活性炭吸附处理，降低高浓度硅氧烷废液的COD
Cr 。 版权所有（C）2011，JPO＆INPIT -
公开(公告)号：JP2010084062A
公开(公告)日：2010-04-15
申请号：JP2008256381
申请日：2008-10-01
Inventor： ONO KAZUHISA
IPC: C08L83/06 , C08G77/14 , C08K5/5415 , C08K9/00
Abstract: PROBLEM TO BE SOLVED: To provide a dealcoholization type room temperature-curable organopolysiloxane composition excellent in curability, and giving an adhesive rubber with high strength and high modulus, and excellent in moisture resistance and warm water resistance.
SOLUTION: This room temperature-curable organopolysiloxane composition comprises (A) 100 pts.wt. of polyorganosiloxane with molecular chain terminals blocked by a hydroxy- or alkoxysilyl-group and having 50-100,000 mPa s viscosity at 23°C; (B) 0.1-20 pts.wt. of a specific silane compound containing a long-chain alkyl group with branched structure; (C) 3-500 pts.wt. of an inorganic filler; and (D) 0.001-10 pts.wt. of a curing catalyst.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：提供固化性优异的脱醇型室温可固化的有机基聚硅氧烷组合物，并提供高强度和高模量的粘合橡胶，并且具有优异的耐湿性和耐温水性。 解决方案：该室温可固化的有机聚硅氧烷组合物包含（A）100重量份 分子链末端被羟基或烷氧基甲硅烷基封端并在23℃下具有50-100,000mPa·s粘度的聚有机硅氧烷; （B）0.1-20重量份 的具有支链结构的长链烷基的特定硅烷化合物; （C）3-500重量份 的无机填料; 和（D）0.001-10重量份 的固化催化剂。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2010013495A
公开(公告)日：2010-01-21
申请号：JP2008171971
申请日：2008-07-01
Inventor： TAKAHASHI HIDEO
Abstract: PROBLEM TO BE SOLVED: To provide a curable silicone rubber composition that affords a silicone rubber exhibiting high hardness and excellent tensile strengths and elongation and includes excellent workability before curing.
SOLUTION: The curable silicone rubber composition includes as essential ingredients (A) 100 pts.wt. of a polyorganosiloxane having a polymerization degree of at least 3,000 and containing 0.001-1 wt.% of a vinyl group, (B) 0.5-10 pts.wt. of a polyorganosiloxane copolymer constituted of an R
3 SiO
1/2 unit (wherein, R is a vinyl group or a monovalent hydrocarbon group having no aliphatic unsaturated moiety) and an SiO
2 unit (wherein, R is a vinyl group or a monovalent hydrocarbon group having no aliphatic unsaturated moiety) with a ratio of the R
3 SiO
1/2 unit to the SiO
2 unit within the range of 0.1-2.0 and bearing 0.5-8 wt.% of a vinyl group, (C) 10-100 pts.wt. of surface-treated fine powder silica obtained by treating the surface of fine powder silica (c-1) having a specific surface area of at least 50 m
2 /g with a specific surface-treating agent (c-2) and, (D) a necessary amount of a curing agent.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：提供一种可提供显示高硬度和优异的拉伸强度和伸长率的硅橡胶的可固化硅橡胶组合物，并且在固化前具有优异的加工性。 解决方案：可固化硅橡胶组合物包括作为必需成分（A）100重量份 的聚有机硅氧烷，其聚合度为至少3,000，并且含有0.001-1重量％的乙烯基，（B）为0.5-10重量份。 的由下列组成的聚有机硅氧烷共聚物：其中R为乙烯基或不具有脂肪族不饱和部分的一价烃基）和SiO
2 单元（其中，R是不具有脂肪族不饱和部分的乙烯基或一价烃基），其比例为R SB 3 SiO 2 / / SB>单元在0.1-2.0的范围内，并且含有0.5-8重量％的乙烯基，（C）10-100重量份的SiO 2 SB / 通过用比表面处理剂（c）处理具有至少50m 2 / SP / g的比表面积的细粉末二氧化硅（c-1）的表面而获得的表面处理细粉二氧化硅 -2）和（D）必需量的固化剂。 版权所有（C）2010，JPO＆INPIT -
公开(公告)号：JP2009221310A
公开(公告)日：2009-10-01
申请号：JP2008065864
申请日：2008-03-14
Inventor： KOBAYASHI HIDEKI , HOSHINO CHISATO
IPC: C08L83/06 , C08G77/14 , C08G77/22 , C08G77/38 , C08K3/00 , C08L83/04 , C10M107/50 , C10M125/04 , C10M125/10 , C10M169/04 , C10N10/04 , C10N10/06 , C10N20/00 , C10N20/02 , C10N20/06 , C10N30/00 , C10N40/00 , C10N50/10
Abstract: PROBLEM TO BE SOLVED: To provide a heat-conductive silicone grease composition which can be adapted for loading a large amount of a heat-conductive filler and scarcely generating oil-bleeding trouble.
SOLUTION: The heat-conductive silicone grease composition contains (A) a polyorganosiloxane having a viscosity of 10-10,000 mPa s at 25°C and having a group expressed by formula (1): -COOX on the side chain and/or the molecular chain terminal and (B) a heat-conductive filler. In the formula (1), X is a hydrogen atom, a 1-10C substituted or unsubstituted monovalent hydrocarbon group or a group expressed by formula (2): -SiR
1
a Y
3-a (wherein R
1 is a 1-10C substituted or unsubstituted monovalent hydrocarbon group; Y is a 1-4C alkoxy group; and a is an integer of 0-3).
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：提供一种可适用于加载大量导热填料并且几乎不产生排油困难的导热硅脂组合物。 导热性硅氧烷润滑脂组合物含有（A）25℃粘度为10〜10000mPa·s的聚有机硅氧烷，具有式（1）表示的基团：侧链上的-COOX和/ 或分子链末端和（B）导热填料。 在式（1）中，X是氢原子，1-10C取代或未取代的单价烃基或由式（2）表示的基团：-SiR
1 a 其中R 1是一个1-10C取代或未取代的一价烃基; Y是1-4C的烷氧基，a是整数 0-3）。 版权所有（C）2010，JPO＆INPIT -
85.发明专利Silicone composition for photosemiconductor encapsulation, and photosemiconductor device using it 有权光聚合物封装的硅胶组合物和使用它的光电子器件
公开(公告)号：JP2009173789A
公开(公告)日：2009-08-06
申请号：JP2008014786
申请日：2008-01-25
Inventor： MOCHIZUKI KIKUO , KOBAYASHI HIDEKI
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: PROBLEM TO BE SOLVED: To provide a silicone composition for photosemiconductor encapsulation which can prevent corrosion of metallic electrodes, and a high reliability photosemiconductor device using it.
SOLUTION: This silicone composition contains:(A) 100 pt.wt. of a polyorganosiloxane containing an alkenyl group of the following (A1), wherein the amount of the compounded (A1) comprises 5 pt.wt. of the total ingredient (A), (A1) a polyorganosiloxane with an average of 1 or more alkenyl groups per molecule containing 10% or more SiO
2 unit; (B)polyorganosiloxane or organosiloxane oligomer with viscosity at 25°C of 1,000 mPas or less, having 2 or more Si-H groups per molecule in an amount to provide 0.3 to 4.0 Si-H groups relative to the alkenyl groups in the above ingredient (A); (C) 0.1 to 20 pt.wt. of a thickener; and (D) a catalytic amount of a platinum catalyst, wherein the moisture permeability after curing is 100 g/m
2 ×24h or less.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：提供可以防止金属电极腐蚀的光半导体封装用硅酮组合物，以及使用它的高可靠性光半导体装置。 该聚硅氧烷组合物含有：（A）100重量份 的含有以下（A1）的烯基的聚有机硅氧烷，其中配混的（A1）的量包含5重量份 的总成分（A），（A1）每分子含有1个或更多个烯基的聚有机硅氧烷，其含有10％以上的SiO
2 单元; （B）在25℃下粘度为1,000mPa·s以下的聚有机硅氧烷或有机硅氧烷低聚物，相对于上述成分中的链烯基，可提供0.3〜4.0个Si-H基，每分子具有2个以上的Si-H基 （一个）; （C）0.1〜20重量份 的增稠剂 和（D）催化量的铂催化剂，其中固化后的透湿性为100g / m 2 SPF×24h以下。 版权所有（C）2009，JPO＆INPIT -
Patent Agency Ranking86.发明专利
公开(公告)号：JP2009173345A
公开(公告)日：2009-08-06
申请号：JP2008333373
申请日：2008-12-26
Inventor： IIJIMA HIROYOSHI , KONDO HIDEO
Abstract: PROBLEM TO BE SOLVED: To provide a silicone rubber compound package which restricts temporal changes of plasticity of a silicone rubber composition containing blended ion conductive substance, and retains preferagle moldabilityfor a long time. SOLUTION: The silicone rubber compound package is composed of a silicone rubber compound containing the ion conductive substance, wherein the silicone rubber compound is stored in an airtight container having a moisture permeability of 10g/m 2 per 24 hours or less. This airtight container is formed of a laminate film that contains metallic layers and resin layers. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供限制含有混合离子导电物质的硅橡胶组合物的可塑性的时间变化的硅橡胶复合材料包装，并且长时间保持优选成型性。 解决方案：硅橡胶复合包装由含有离子导电物质的硅橡胶化合物组成，其中硅橡胶化合物储存在透湿度为10g / m 2 SP / 2的气密容器中， 每24小时或更少。 该密闭容器由含有金属层和树脂层的层压膜形成。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2008247034A
公开(公告)日：2008-10-16
申请号：JP2008106149
申请日：2008-04-15
Inventor： SILVI NORBERTO , GIAMMATTEI MARK HOWARD
IPC: B29B7/58 , C08J3/20 , B29B7/00 , B29B7/38 , B29B7/42 , B29B7/74 , B29B7/90 , B29C47/50 , B29K83/00 , B29K105/16 , C08K3/36 , C08L83/04
CPC classification number: B29B7/7466 , B29B7/007 , B29B7/426 , B29B7/90 , B29C47/0009 , B29C47/50 , B29K2083/00
Abstract: PROBLEM TO BE SOLVED: To provide a method and a system for producing a uniform filler-mixed devolatalized silicone composition by efficiently compounding a high-level inorganic filler, a machining fluid, and a silicone polymer at a commercial rate.
SOLUTION: A first dispersion composition is manufactured by compounding the filler, the machining fluid, and the silicone polymer by means of a first compounding device 12; and concurrently, a second dispersion composition is manufactured by compounding the filler, the machining fluid, and the silicone polymer by means of a second compounding device 14 by sharing the same extruder shaft 16 with the first compounding device. An extruder transition section 18 of this system is equipped with a sealed ejection chamber 20 which is defined by a lower wall with a proper contour shifting toward a first partition wall 26, a second partition wall 28 and an ejection port 24; and the shaft 16 passes through the first partition wall 26, extends across the ejection chamber 20, and passes through the second partition wall 28.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 解决问题的方法：提供一种制造均匀的填料混合的发泡硅氧烷组合物的方法和系统，其以商业速率有效地混合高级无机填料，机加工液和硅氧烷聚合物。 解决方案：通过第一配料装置12将填料，加工液和有机硅聚合物混合制成第一分散组合物; 并且同时，通过与第一配混装置共享相同的挤出机轴16，通过第二配料装置14将填料，加工液和硅氧烷聚合物混合来制造第二分散组合物。 该系统的挤出机过渡部分18装备有密封的喷射室20，其由具有适当轮廓的下壁限定，朝向第一分隔壁26，第二分隔壁28和排出口24移动; 并且轴16穿过第一分隔壁26，延伸穿过喷射室20，并穿过第二分隔壁28.版权所有（C）2009，JPO＆INPIT
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88.发明专利Electrode pattern for ohmic-resistance heating elements, and substrate treating device 审中-公开电阻加热元件的电极图案和基板处理装置
公开(公告)号：JP2008016796A
公开(公告)日：2008-01-24
申请号：JP2006323726
申请日：2006-11-30
Inventor： LU ZHONG-HAO
IPC: H01L21/205 , H01L21/3065 , H05B3/10 , H05B3/68
CPC classification number: H05B3/143 , Y10S269/903
Abstract: PROBLEM TO BE SOLVED: To provide a circuit pattern of an ohmic-resistance heating element embedded in a wafer process device used for manufacturing a process.
SOLUTION: The wafer process device comprising an optimum electrode pattern for an ohmic-resistance heating element is disclosed. The optimum electrode pattern is so designed as to compensate heat loss in the vicinity by generating more heat near or around a contact area, an electric connection part, and a district such as through hole, to bring about uniformity in maximum temperature. In another embodyment of the optimum design, the resistance of the heating element is closely matched with the impedance of a power supply, for higher efficiency in particular when a higher operation temperature of higher electric output is required.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：提供嵌入在用于制造工艺的晶片工艺装置中的欧姆电阻加热元件的电路图案。 公开了包括用于欧姆电阻加热元件的最佳电极图案的晶片工艺装置。 最佳电极图案被设计成通过在接触区域，电连接部分和诸如通孔的区域附近或周围产生更多的热量来补偿附近的热损失，以实现最大温度的均匀性。 在最佳设计的另一个体现中，加热元件的电阻与电源的阻抗紧密匹配，为了更高的效率，特别是当需要较高电输出的较高工作温度时。 版权所有（C）2008，JPO＆INPIT
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89.发明专利Wear resistant low friction coating composition, coated component, and method for coating thereof 审中-公开耐磨低摩擦涂料组合物，涂布组分及其涂料方法
公开(公告)号：JP2007211339A
公开(公告)日：2007-08-23
申请号：JP2006345092
申请日：2006-12-22
Inventor： LEIST JON , MARCHIANDO ROBERT
IPC: C23C26/00 , C10M103/00 , C10M103/06 , C10M125/04 , C10M149/18 , C10M169/04 , C10N10/02 , C10N10/06 , C10N10/08 , C10N10/10 , C10N10/12 , C10N10/16 , C10N20/00 , C10N20/06 , C10N30/06 , C10N40/02 , C10N40/25 , C10N50/08
CPC classification number: C04B38/067 , B22F3/115 , B22F5/008 , B22F5/009 , B22F7/08 , B22F8/00 , B22F2009/001 , B22F2998/10 , C04B35/5607 , C04B35/5611 , C04B35/565 , C04B35/58 , C04B35/58042 , C04B35/5805 , C04B35/58064 , C04B35/58071 , C04B35/58078 , C04B35/581 , C04B35/583 , C04B35/632 , C22C1/05 , C22C1/051 , C22C29/14 , C22C29/16 , C22C32/0047 , C23C4/04 , C23C4/06 , C23C4/10 , C23C24/08 , Y02P10/24 , Y02W30/541 , C04B38/0054 , C04B38/065 , B22F9/04 , B22F1/0059 , B22F1/0096 , B22F1/0003 , B22F9/22 , B22F3/02 , B22F3/04 , B22F3/10 , B22F3/15 , B22F3/14 , B22F3/24
Abstract: PROBLEM TO BE SOLVED: To provide a wear resistant low friction coating composition, to provide a coated component, and to provide a method for coating thereof.
SOLUTION: A composition for coating sliding or rolling or fretting or impacting members is formed by preparing a composite powder of TiB
2 and BN, with a TiB
2 to BN ratio ranging from 1:7 to 20:1, and a metallic matrix selected from the group consisting of nickel, chromium, iron, cobalt, aluminum, tungsten, carbon and alloys thereof. The matrix-forming metal alloy is an alloy selected from the group consisting of W, Co, Cr, Fe, Ni, Mo, Al, Si, Cu, Y, Ag, P, Zr, Hf, B, Ta, V, Nb, and alloys thereof.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：提供耐磨低摩擦涂料组合物，以提供涂布组分，并提供其涂布方法。 解决方案：用于涂覆滑动或滚动或微动或冲击构件的组合物是通过将TiB
2 和BN的复合粉末与TiB 2 比例范围为1：7至20：1，以及选自镍，铬，铁，钴，铝，钨，碳及其合金的金属基体。 基体形成金属合金是选自W，Co，Cr，Fe，Ni，Mo，Al，Si，Cu，Y，Ag，P，Zr，Hf，B，Ta，V，Nb ，及其合金。 版权所有（C）2007，JPO＆INPIT -
公开(公告)号：JP2021533560A
公开(公告)日：2021-12-02
申请号：JP2021504763
申请日：2019-07-26
Inventor： ナタラジャン,スンダルシャン , ファン,ウェイ , リュー,シャン , シェイファー,グレゴリー
IPC: C01B32/20 , H01L21/683
Abstract: プロセスチャンバーまたは他の用途で基板を支持し、所望の熱レベリングプロファイルを提供するのに適した装置が、本明細書に示され、説明されている。装置は、装置から取り外し可能なサーマルレベラーを提供するように構成されている。 【選択図】図1
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