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公开(公告)号：KR1020120054252A
公开(公告)日：2012-05-30
申请号：KR1020100115537
申请日：2010-11-19
Applicant: 한국전자통신연구원
IPC: H01L21/20
CPC classification number: H01L21/185 , H01L21/324
Abstract: PURPOSE: A wafer bonding method is provided to improve quality of product by pressurizing two semiconductor substrates and forming a bonded substrate and transferring heat from the center of the bonded substrate to edge. CONSTITUTION: A first substrate(10) including a first side and a second side(10b) facing to the first side is provided. An insulating film is formed on the first side and the second side. The insulating film is an oxide film or a nitride film. A second substrate(20) including a third side and a fourth(20b) facing to the third side is provided. Bonding surface of two wafers are activated by using plasma. An initial bonding process is executed by perpendicularly pressurizing the bonding surface of the two wafers. The two wafers are bonded by selectively heating the center of the initially bonded wafers.
Abstract translation: 目的：提供晶片接合方法，通过对两个半导体衬底加压并形成接合衬底并将热量从接合衬底的中心传递到边缘来提高产品质量。 构成：提供包括面向第一侧的第一侧和第二侧（10b）的第一基板（10）。 绝缘膜形成在第一面和第二面上。 绝缘膜是氧化物膜或氮化物膜。 提供了包括面向第三侧的第三侧面和第四（20b）的第二基板（20）。 通过使用等离子体激活两个晶片的结合表面。 通过对两个晶片的粘合表面垂直加压来执行初始粘合工艺。 通过选择性地加热初始结合的晶片的中心来结合两个晶片。
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公开(公告)号：KR101041570B1
公开(公告)日：2011-06-15
申请号：KR1020090078261
申请日：2009-08-24
Applicant: 한국전자통신연구원
IPC: H04B10/2581 , H04B10/00
CPC classification number: G02B6/4246 , H04B10/40
Abstract: 하나의 광섬유를 이용해서 양방향 통신 또는 다중화 통신이 가능한 광통신 모듈을 개시한다. 플랫폼에는 상하로 관통하는 관통 홀이 형성된다. 광수신부는 플랫폼에 실장되는 것으로, 수광소자를 구비한다. 광송신부는 플랫폼에 실장되는 것으로, 발광소자를 구비한다. 광필터부는 플랫폼의 한 면에 관통 홀에 대응되게 실장되는 것으로, 발광소자로부터 출력된 출력광을 광선로로 전달하며, 광선로를 통해 입력된 입력광을 수광소자로 전달한다. 수광소자와 발광소자 중 어느 하나는 플랫폼의 한 면에 광필터부를 사이에 두고 광선로의 반대쪽에 실장되며, 다른 하나는 플랫폼의 다른 면에 관통 홀과 대응되게 실장된다. 이에 따라, 모듈화 비용을 줄이고 광학적 또는 전기적 누화를 최소화할 수 있으며, 광 결합효율을 극대화할 수 있다.
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公开(公告)号：KR1020110003237A
公开(公告)日：2011-01-11
申请号：KR1020090099815
申请日：2009-10-20
Applicant: 한국전자통신연구원
Abstract: PURPOSE: An optical waveguide and a bidirectional optical transceiver are provided to obtain optical transceiving performance by manually arranging an optical system. CONSTITUTION: A single mode optical fiber(110) has a wavelength selecting filter in a core. The wavelength selecting filter separates a bidirectional signal. One side of a hollow optical fiber(120) is combined with the end of the signal mode optical fiber and the other side thereof is inclined. The end of the signal mode optical fiber is fused with one side of the hollow optical fiber.
Abstract translation: 目的：提供光波导和双向光收发器，以通过手动布置光学系统来获得光收发性能。 构成：单模光纤（110）在芯中具有波长选择滤波器。 波长选择滤波器分离双向信号。 中空光纤（120）的一侧与信号模式光纤的端部组合，另一侧倾斜。 信号模式光纤的端部与中空光纤的一侧熔合。
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公开(公告)号：KR1020100061220A
公开(公告)日：2010-06-07
申请号：KR1020080120131
申请日：2008-11-28
Applicant: 한국전자통신연구원
IPC: H01L21/302 , H01L23/12
CPC classification number: H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00
Abstract: PURPOSE: A through via manufacturing method is provided to make possible a signal transmission at a high speed more than 10Gbps by minimizing an input-output signal loss by a polymer filler of a high value resistor. CONSTITUTION: A core via hole is formed on a wafer(101). A suction via hole(104) is formed on the wafer. A via core(111) is formed in the core via hole. A polymer via hole(108) communicated with the suction via hole is formed on the wafer. A polymer solution(109) is filled in the polymer via hole. The wafer is polished to expose the via core to the outside.
Abstract translation: 目的：提供通孔制造方法，通过使高值电阻器的聚合物填料的输入输出信号损失最小化，使得可能以高于10Gbps的高速度传输信号。 构成：芯片通孔形成在晶片（101）上。 在晶片上形成抽吸通孔（104）。 通孔芯（111）形成在芯通孔中。 在晶片上形成与吸入通孔连通的聚合物通孔（108）。 聚合物溶液（109）填充在聚合物通孔中。 将晶片抛光以将通孔芯暴露于外部。
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Patent Agency Ranking
公开(公告)号：KR1020100061211A
公开(公告)日：2010-06-07
申请号：KR1020080120117
申请日：2008-11-28
Applicant: 한국전자통신연구원
CPC classification number: G02B6/4246 , G02B6/29316 , G02B6/4214
Abstract: PURPOSE: An optical waveguide and a bidirectional optical transceiver are provided to separate bi-direction signal inside the core of an optical waveguide by using a wavelength selective filter. CONSTITUTION: An optical waveguide(110) comprises a core(111), a cladding(112), and a wavelength selective filter(113). The core transmits light. The cladding protects the core. The cladding maintains light inside the core with the total reflection effect. The wavelength selective filter is formed inside the core and separates the bidirectional signal. The wavelength selective filter changes a transmission light(200) of a cladding mode(210) transmitted through the cladding into a core mode(220) or the cladding mode. The light transformed through the wavelength selective filter passes through the wave length selective filter.
Abstract translation: 目的：提供光波导和双向光收发器，通过使用波长选择滤波器分离光波导核心内的双向信号。 构造：光波导（110）包括芯（111），包层（112）和波长选择滤光器（113）。 核心传输光。 包层保护核心。 包层保持核心内部的光具有全反射效应。 波长选择滤波器形成在核心内部并分离双向信号。 波长选择滤波器将通过包层传输的包层模（210）的透射光（200）改变为芯模（220）或包层模式。 通过波长选择滤光器转换的光通过波长选择滤光片。
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公开(公告)号：KR1020100022690A
公开(公告)日：2010-03-03
申请号：KR1020080081330
申请日：2008-08-20
Applicant: 한국전자통신연구원
IPC: H01L23/12
CPC classification number: H01L21/76898 , H01L23/481 , H01L25/50 , H01L2223/6616 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/0557 , H01L2224/056 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/09701 , H01L2924/3011 , H01L2224/05099
Abstract: PURPOSE: A manufacturing method of a stacked semiconductor package with an improved through via forming technology are provided to minimize electric leakage between a transmission line and a via hole. CONSTITUTION: A seed layer(2) is formed on the bottom of a wafer(1). The seed layer is formed in order to form a via-core. The wafer comprises at least one via hole(5). The via hole passes through the wafer up and down. The via-core(10) is formed within the via hole. The via hole and via-core are insulated with each other. The seed layer is removed.
Abstract translation: 目的：提供一种具有改进的通孔形成技术的堆叠半导体封装的制造方法，以使传输线和通孔之间的漏电最小化。 构成：在晶片（1）的底部形成种子层（2）。 形成种子层以形成通孔。 晶片包括至少一个通孔（5）。 通孔上下穿过晶片。 通孔（10）形成在通孔内。 通孔和通孔相互绝缘。 种子层被去除。
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公开(公告)号：KR100933367B1
公开(公告)日：2009-12-22
申请号：KR1020070130172
申请日：2007-12-13
Applicant: 한국전자통신연구원
IPC: G02B6/38
Abstract: An optical connector is provided, which uniformly maintains mounting and dismounting force between the ferrule and the stub or between the ferrules. An optical connector(100) comprises the first ferrule(110), the second ferrule(112), the sleeve(120), and the sleeve clip(130). The first ferrule supports the end part of optical fibers(111,113) arranged in one side. The second ferrule supports the end part contacting with each other with the first ferrule of the optical fiber arranged in the other side. Sleeve comprises the contact unit, and the extension part. The contact unit is formed in order to surround ferrules through the first ferrule and the second ferrule. The extension part is curve-cut from the aperture of the contact unit and is extended. The sleeve clip pressurizes sleeve from the outer side.
Abstract translation: 提供了一种光学连接器，其均匀地保持套圈和短截线之间或套圈之间的安装和卸载力。 光学连接器（100）包括第一套箍（110），第二套箍（112），套筒（120）和套筒夹（130）。 第一套圈支撑布置在一侧的光纤（111,113）的端部。 第二套箍通过配置在另一侧的光纤的第一套箍支承端部彼此接触。 套筒包括接触单元和延伸部分。 接触单元形成为通过第一套圈和第二套圈包围套圈。 延伸部分从接触单元的孔口弯曲切割并延伸。 套筒夹从外侧对套筒加压。
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公开(公告)号：KR1020090062744A
公开(公告)日：2009-06-17
申请号：KR1020070130172
申请日：2007-12-13
Applicant: 한국전자통신연구원
IPC: G02B6/38
Abstract: An optical connector is provided, which uniformly maintains mounting and dismounting force between the ferrule and the stub or between the ferrules. An optical connector(100) comprises the first ferrule(110), the second ferrule(112), the sleeve(120), and the sleeve clip(130). The first ferrule supports the end part of optical fibers(111,113) arranged in one side. The second ferrule supports the end part contacting with each other with the first ferrule of the optical fiber arranged in the other side. Sleeve comprises the contact unit, and the extension part. The contact unit is formed in order to surround ferrules through the first ferrule and the second ferrule. The extension part is curve-cut from the aperture of the contact unit and is extended. The sleeve clip pressurizes sleeve from the outer side.
Abstract translation: 提供了一种光学连接器，其均匀地保持套圈和短截线之间或套圈之间的安装和拆卸力。 光连接器（100）包括第一套圈（110），第二套圈（112），套筒（120）和套筒夹（130）。 第一套圈支撑设置在一侧的光纤（111,113）的端部。 第二套圈支撑端部彼此接触，并且光纤的第一套圈布置在另一侧。 套筒包括接触单元和延伸部分。 接触单元形成为通过第一套圈和第二套圈环绕套圈。 延伸部分从接触单元的孔径曲线切割并延伸。 套筒夹套从外侧加压套筒。
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公开(公告)号：KR1020090058948A
公开(公告)日：2009-06-10
申请号：KR1020070125763
申请日：2007-12-05
Applicant: 한국전자통신연구원
IPC: H04B10/2581 , H04B10/00 , H04J14/00
CPC classification number: H04J14/0226 , H04B10/25751 , H04J14/0232 , H04J14/0247 , H04J14/0252 , H04J14/0282
Abstract: An optical diplexer module using a mixed-signal multiplexer and a method using the same are provided to realize an optical diplexer module which enables an MPS(Multiple-Play Service) and a TPS(Triple-play service) by using only two optical wavelength for an uplink and downlink signals. A multiplexing unit(210) multiplexes a wideband digital signal and an analog signal, and then outputs those signals in one multiplexing signal. A multiplexer(213) mixes an output signal of each mixer with a baseband signal and outputs the mixed signal as a multiplexing signal. An optical converter outputs converts the multiplexing signal into an optical signal and outputs the optical signal. A photoelectric converter(240) converts the optical signal received from the outside into an electric signal. An amplifier(250) performs an amplification function that amplifies the output signal of the photoelectric converter.
Abstract translation: 提供一种使用混合信号多路复用器的光双工器模块及其使用方法，以实现通过仅使用两个光波长来实现MPS（多播服务）和TPS（三重播放业务）的光双工器模块 上行链路和下行链路信号。 多路复用单元（210）对宽带数字信号和模拟信号进行复用，然后在一个复用信号中输出这些信号。 多路复用器（213）将每个混频器的输出信号与基带信号进行混频，并输出混合信号作为复用信号。 光转换器输出将复用信号转换为光信号并输出光信号。 光电转换器（240）将从外部接收的光信号转换为电信号。 放大器（250）执行放大光电转换器的输出信号的放大功能。
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