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    ELECTRICAL CONNECTIONS FOR ANODIZED THIN FILM STRUCTURES
    81.
    发明公开
    ELECTRICAL CONNECTIONS FOR ANODIZED THIN FILM STRUCTURES 审中-公开
    电气连接的阳极氧化薄膜结构

    公开(公告)号：EP2377131A2

    公开(公告)日：2011-10-19

    申请号：EP09835484.8

    申请日：2009-12-03

    Applicant: 3M Innovative Properties Company

    Inventor： THEISS, Steven D. ,  HAASE, Michael A.

    IPC: H01B5/14 ,  H01B1/00

    CPC classification number: H01L21/76802 ,  H01L27/1214 ,  H01L27/124 ,  H01L2224/24137 ,  H05K3/4092 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T428/12396

    Abstract: Approaches for formation of a circuit via which electrically connects a first thin film metallization layer a second thin film metallization layer are described. Via formation involves the use of an anodization barrier and/or supplemental pad disposed in a via connection region prior to anodization of the first metallization layer. The material used to form the barrier is substantially impermeable to the anodization solution during anodization, and disrupts the formation of oxide between the electrically conducting layer and the barrier. The supplemental pad is non-anodizable, and is covered by the barrier to substantially prevent current flow through the pad during anodization. Following anodization, the barrier is removed. If the supplemental pad is sufficiently conductive, it can be left on the first metallization layer after removal of the barrier. The second metallization layer is disposed over the anodized layer, making electrical contact with the first electrically conductive layer in the via connection region.

    PROJECTION AND DISPLAY SYSTEM
    88.
    发明公开
    PROJECTION AND DISPLAY SYSTEM 审中-公开
    投影显示系统

    公开(公告)号：EP2473880A2

    公开(公告)日：2012-07-11

    申请号：EP10812692.1

    申请日：2010-08-30

    Applicant: 3M Innovative Properties Company

    Inventor： WILLETT, Steven J. ,  WOLK, Martin B. ,  SMITH, Terry L. ,  AUERBACH, Roy A. ,  HAASE, Michael A. ,  SAXE, Steven G. ,  KELLEY, Tommie W.

    IPC: G03B21/20 ,  G03B21/28 ,  G03B27/00

    CPC classification number: G03B21/204 ,  H04N9/3129 ,  H04N9/3138

    Abstract: A projection system and a display that incorporates the projection system are provided. The projection system includes at least one electroluminescent device that emits a first wavelength of light, at least one semiconductor multilayer stack that downconverts the first wavelength of light to a second wavelength of light, and a scanning optical element that transmits the light along a scanned direction. The electroluminescent device can be part of an array of electroluminescent devices, and can be monolithic. The semiconductor multilayer stack can be part of an array of semiconductor multilayer stacks, and can also be monolithic. The scanning optical element can be positioned to scan the electroluminescent device across the semiconductor multilayer stack, or it can be positioned to scan the downconverted light after it has left the semiconductor multilayer stack.

    AC POWERED LOGIC CIRCUITRY
    89.
    发明授权
    AC POWERED LOGIC CIRCUITRY 有权
    对于AC逻辑电路

    公开(公告)号：EP1579574B1

    公开(公告)日：2011-07-13

    申请号：EP03814771.6

    申请日：2003-12-15

    Applicant: 3M Innovative Properties Company

    Inventor： BAUDE, Paul F. ,  HAASE, Michael A.

    IPC: H03K19/00 ,  G06K19/077

    CPC classification number: G06K19/0701 ,  G06K19/0723 ,  H03K3/0315 ,  H03K19/094

    Abstract: The use of an alternating current (ac) source to power logic circuitry can support satisfactory device performance for a variety of applications, while enhancing long-term stability of the circuitry. For example, when organic thin film transistor (OTFT)-based logic circuitry is powered by an ac power source, the logic circuitry exhibits stable performance characteristics over an extended period of operation. Enhanced stability may permit the use of OTFT logic circuitry to form a variety of circuit devices, including inverters, oscillators, logic gates, registers and the like. Such circuit devices may find application in a variety of applications, including integrated circuits, printed circuit boards, flat panel displays, smart cards, cell phones, and RFID tags. In some applications, the ac-powered logic circuitry may eliminate the need for ac-dc rectification components, thereby reducing the manufacturing time, expense, cost, complexity, and size of the component carrying the circuitry.

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