SPUTTERING TARGETS AND ASSOCIATED SPUTTERING METHODS FOR FORMING HERMETIC BARRIER LAYERS
    81.
    发明申请
    SPUTTERING TARGETS AND ASSOCIATED SPUTTERING METHODS FOR FORMING HERMETIC BARRIER LAYERS 审中-公开
    溅射目标和相关的溅射方法形成掩蔽层

    公开(公告)号:US20130240351A1

    公开(公告)日:2013-09-19

    申请号:US13799611

    申请日:2013-03-13

    CPC classification number: C23C14/10 C23C14/087 C23C14/3414 H01J37/3426

    Abstract: A sputtering target comprises a low Tg glass or an oxide of copper or tin. Such target materials can be used to form mechanically-stable thin films that exhibit a self-passivating phenomenon and which can be used to seal sensitive workpieces from exposure to air or moisture. Low Tg glass materials may include phosphate glasses such as tin phosphates and tin fluorophosphates, borate glasses, tellurite glasses and chalcogenide glasses, as well as combinations thereof.

    Abstract translation: 溅射靶包括低Tg玻璃或铜或锡的氧化物。 这种目标材料可用于形成机械稳定的薄膜,其表现出自钝化现象,并可用于将敏感工件暴露于空气或湿气中。 低Tg玻璃材料可以包括磷酸盐玻璃,例如磷酸锡和磷酸二氢锡,硼酸盐玻璃,碲酸盐玻璃和硫族化物玻璃,以及它们的组合。

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