Abstract:
PROBLEM TO BE SOLVED: To provide a positive resist composition for use in the production process of a semiconductor such as IC, in the production of a circuit substrate of liquid crystal, thermal head and the like or in other photofabrication processes, the positive resist composition being capable of satisfying all of exposure latitude (EL), scum reduction and profile on a higher level, and a pattern forming method using the positive resist composition. SOLUTION: The positive resist composition comprises (A) a resin containing a repeating unit (A1) having a lactone structure and a cyano group, and having solubility in an alkali developer increased by the action of an acid, (B) a compound capable of generating a fluorine substituted 2 or 3C alkanesulfonic acid upon irradiation with an actinic ray or radiation, and (C) a solvent. The pattern forming method using the positive resist composition is also provided. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method and a resist composition from which a pattern having fewer development defects can be formed.SOLUTION: The resist composition is used for a specified pattern forming method and comprises the following resin, a hydrophobic resin having a fluorine atom or a silicon atom, and a solvent comprising a specified component. The resin contains a repeating unit (P) having a group that is decomposed by an action of an acid to generate an alcoholic hydroxyl group, contains neither a fluorine atom nor a silicon atom, and shows decrease in the solubility with a developing solution containing an organic solvent by an action of an acid; and in the resin, the repeating unit (P) contains no lactone structure, and the group that is decomposed by an action of an acid to generate an alcoholic hydroxyl group is a group expressed by at least one of specified general formulae. The compounding rate of the resin showing decrease in the solubility with a developing solution containing an organic solvent by an action of an acid is 60 to 95 mass% in the total solid content.
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition from which a pattern can be formed to satisfy demands for high sensitivity, high resolution (for example, high resolving power, superior pattern features and small line edge roughness (LER)) and good dry etching durability, and to provide an actinic ray-sensitive or radiation-sensitive film using the composition, a mask blank in which the above film is formed, and a pattern forming method.SOLUTION: The resin composition contains a polymeric compound (A) having a repeating unit (Q) expressed by general formula (1). In the formula, Rrepresents a hydrogen atom, a methyl group or a halogen atom; Rand Rrepresent a hydrogen atom, an alkyl group or a cycloalkyl group; L represents a divalent connecting group or a single bond; Y represents a substituent excluding a methylol group; Z represents a hydrogen atom or a substituent; m represents an integer of 0 to 4; and n represents an integer of 1 to 5, where m+n is at most 5.
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray sensitive resin composition which is excellent in exposure latitude and generates little scum, a resist film formed using the composition, and a pattern forming method using the composition, and to provide a method for manufacturing an electronic device and an electronic device.SOLUTION: An actinic ray sensitive resin composition contains (A) a resin having a repeating unit represented by the following general formula (1) and a repeating unit which is decomposed by an action of an acid to generate an alkali-soluble group, and (B) a compound, represented by the following general formula (Z-1), which generates an acid by irradiation with an actinic ray. K represents a cyclic acid anhydride group, and A represents a cyclic organic group.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which has excellent pattern roughness properties such as exposure latitude and LWR and less variation in performance with time, a radiation-sensitive film and a pattern formation method using the same, and an electronic device manufacturing method and an electronic device.SOLUTION: A radiation-sensitive resin composition contains a compound represented by the following general formula (1) which decomposes to generate acid under exposure of radiation and a resin which decomposes under the action of acid so as to increase solubility in alkali developer. In general formula (1), Rand Reach independently represent an aryl, and Rand Rmay be connected. Rand Reach independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group. Rand Rmay be also connected. Rrepresents an alkyl group, a cycloalkyl group, an alkenyl group, an aryl group, an aralkyl group, or an alkyl carbonyl group. Rmay be connected to Ror R.
Abstract:
PROBLEM TO BE SOLVED: To provide a negative pattern forming method for improving removability of a film, reducing scum on a substrate generating after development, reducing scum defects and achieving excellent resolution, in a pattern forming method which includes forming a film having a film thickness of 200 nm or more from a chemically amplified resist composition, and exposing and developing the film, so as to stably form a fine pattern with high accuracy for manufacturing a high-integration and high-accuracy electronic device.SOLUTION: The negative pattern forming method includes steps of: (1) forming a film having a film thickness of 200 nm or more from a chemically amplified resist composition, which contains (A) a resin showing increase in its polarity by an action of an acid to decrease solubility with a developing solution containing an organic solvent, (B) a compound generating an acid by irradiation with actinic rays or radiation, and (C) a solvent; (2) exposing the film; and (3) developing the exposed film with a developing solution containing an organic solvent.
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray-sensitive or radiation-sensitive resin composition which improves resolution such as a pre-bridge size and an exposure latitude, and a resist film and a pattern formation method using the composition.SOLUTION: An actinic ray-sensitive or radiation-sensitive resin composition is provided that includes: a compound (A) which is decomposed upon irradiation with actinic rays or radiation to generate an acid; resin (B) which is decomposed by the action of an acid to change solubility in an developer; and a compound (C) which reacts with, in the presence of an acid, an acid generated by the compound (A) upon irradiation with actinic rays or radiation to form a covalent bond (wherein the resin (B) and the compound (C) may be the same compound). There are also provided a resist film and a pattern formation method using the composition.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming a pattern that has high resolution, allows to reduce LWR and is excellent in pattern shape; a chemically amplified resist composition; and a resist film.SOLUTION: A pattern forming method comprises the steps of: (I) forming a film with a chemically amplified resist composition containing (A) a resin whose solubility in a developer containing an organic solvent decreases due to polarity increased by action of an acid, (B) a compound generating an acid by irradiation of actinic rays or radiation and (C) a solvent; (II) exposing the film; and (III) developing using a developer containing an organic solvent. The resin (A) has a structure where a polar group is protected by a leaving group which is decomposed by action of an acid to leave. The leaving group contains a silicon atom.
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method for forming a pattern having excellent exposure latitude (EL) and a large depth of focus (DOF), and a resist composition.SOLUTION: A pattern forming method of the present invention includes (A) forming a film with a resist composition; (B) exposing the film to light; and (C) developing the exposed film with a developer containing an organic solvent. The resist composition contains (a) a resin which is decomposed by the action of an acid and ΔSP represented by the following equation (1) is equal or more than 2.5(MPa); (b) a compound which generates an acid upon irradiation with actinic rays or radiation; and (c) a solvent.