Positive resist composition and pattern forming method using positive resist composition
    81.
    发明专利
    Positive resist composition and pattern forming method using positive resist composition 审中-公开
    积极抵抗组合物和图案形成方法使用积极抵抗组成

    公开(公告)号:JP2007171820A

    公开(公告)日:2007-07-05

    申请号:JP2005372511

    申请日:2005-12-26

    Abstract: PROBLEM TO BE SOLVED: To provide a positive resist composition for use in the production process of a semiconductor such as IC, in the production of a circuit substrate of liquid crystal, thermal head and the like or in other photofabrication processes, the positive resist composition being capable of satisfying all of exposure latitude (EL), scum reduction and profile on a higher level, and a pattern forming method using the positive resist composition. SOLUTION: The positive resist composition comprises (A) a resin containing a repeating unit (A1) having a lactone structure and a cyano group, and having solubility in an alkali developer increased by the action of an acid, (B) a compound capable of generating a fluorine substituted 2 or 3C alkanesulfonic acid upon irradiation with an actinic ray or radiation, and (C) a solvent. The pattern forming method using the positive resist composition is also provided. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:为了提供用于诸如IC的半导体的制造工艺中的正性抗蚀剂组合物,在制造液晶,热敏头等的电路基板或其它光制造工艺中, 正性抗蚀剂组合物能够满足曝光宽容度(EL),浮渣减少和高分辨率的全部曝光,以及使用正型抗蚀剂组合物的图案形成方法。 解决方案:正型抗蚀剂组合物包含(A)含有具有内酯结构和氰基的重复单元(A1)的树脂,并且在碱性显影剂中的溶解度由酸的作用而增加,(B) 能够在用光化射线或辐射照射时能够产生氟取代的2或3C烷基磺酸的化合物,和(C)溶剂。 还提供了使用正性抗蚀剂组合物的图案形成方法。 版权所有(C)2007,JPO&INPIT

    感活性光線性又は感放射線性樹脂組成物、それを用いたレジスト膜、レジスト塗布マスクブランクス、フォトマスク及びパターン形成方法、並びに、電子デバイスの製造方法及び電子デバイス
    82.
    发明专利
    感活性光線性又は感放射線性樹脂組成物、それを用いたレジスト膜、レジスト塗布マスクブランクス、フォトマスク及びパターン形成方法、並びに、電子デバイスの製造方法及び電子デバイス 审中-公开
    丙烯酸类敏感性或辐射敏感性树脂组合物,使用该抗静电树脂组合物的电阻膜,耐光涂层掩模,光电子图案,图案形成方法,制造电子器件的方法和电子设备

    公开(公告)号:JP2015031850A

    公开(公告)日:2015-02-16

    申请号:JP2013161902

    申请日:2013-08-02

    Abstract: 【課題】極微細領域(例えば、スペース幅50nm以下の領域)の孤立パターンにおける解像性、及び、PED安定性に優れた感活性光線性又は感放射線性樹脂組成物、それを用いたレジスト膜、レジスト塗布マスクブランクス、フォトマスク及びパターン形成方法、並びに、電子デバイスの製造方法及び電子デバイスの提供。【解決手段】(A)フェノール性水酸基を有する高分子化合物、(B)活性光線又は放射線の照射により体積200Å3以上の大きさの酸を発生する化合物、(C)架橋剤、及び、(D)フェノール性水酸基を有する低分子化合物を含有する感活性光線性又は感放射線性樹脂組成物。【選択図】なし

    Abstract translation: 要解决的问题:为了提供在超细区域(例如,空间宽度为50nm以下的区域)中分离图案的分辨率优异的光化射线敏感性或辐射敏感性树脂组合物,并且PED优异( 曝光后延迟)稳定性,并提供使用上述组成的抗蚀剂膜,抗蚀剂涂覆掩模毛坯,光掩模和图案形成方法,以及电子器件的制造方法和电子器件。解决方案:光化学 射线敏感或辐射敏感性树脂组合物包含(A)具有酚羟基的聚合物,(B)通过用光化射线或辐射照射而产生体积为200或更大的体积的酸的化合物,(C) 交联剂和(D)具有酚羟基的低分子量化合物。

    Pattern forming method and a resist composition
    83.
    发明专利
    Pattern forming method and a resist composition 有权
    图案形成方法和阻力组成

    公开(公告)号:JP2014167628A

    公开(公告)日:2014-09-11

    申请号:JP2014060928

    申请日:2014-03-24

    Abstract: PROBLEM TO BE SOLVED: To provide a pattern forming method and a resist composition from which a pattern having fewer development defects can be formed.SOLUTION: The resist composition is used for a specified pattern forming method and comprises the following resin, a hydrophobic resin having a fluorine atom or a silicon atom, and a solvent comprising a specified component. The resin contains a repeating unit (P) having a group that is decomposed by an action of an acid to generate an alcoholic hydroxyl group, contains neither a fluorine atom nor a silicon atom, and shows decrease in the solubility with a developing solution containing an organic solvent by an action of an acid; and in the resin, the repeating unit (P) contains no lactone structure, and the group that is decomposed by an action of an acid to generate an alcoholic hydroxyl group is a group expressed by at least one of specified general formulae. The compounding rate of the resin showing decrease in the solubility with a developing solution containing an organic solvent by an action of an acid is 60 to 95 mass% in the total solid content.

    Abstract translation: 要解决的问题:提供一种能够形成具有较少显影缺陷的图案的图案形成方法和抗蚀剂组合物。解决方案:抗蚀剂组合物用于指定的图案形成方法,并且包括以下树脂,疏水性树脂具有 氟原子或硅原子,以及包含特定成分的溶剂。 树脂含有具有通过酸作用而分解以产生醇羟基的基团的重复单元(P),既不含氟原子也不含硅原子,并且显示出与含有 有机溶剂通过酸的作用; 并且在树脂中,重复单元(P)不含有内酯结构,通过酸的作用而分解以产生醇羟基的基团是由至少一个指定的通式表示的基团。 与通过酸作用而含有有机溶剂的显影溶液的溶解性显示出降低的树脂的配合比率,在总固体成分中为60〜95质量%。

    Resin composition and pattern forming method using the same
    84.
    发明专利
    Resin composition and pattern forming method using the same 有权
    树脂组合物和形成图案的方法

    公开(公告)号:JP2014024999A

    公开(公告)日:2014-02-06

    申请号:JP2012167509

    申请日:2012-07-27

    Abstract: PROBLEM TO BE SOLVED: To provide a resin composition from which a pattern can be formed to satisfy demands for high sensitivity, high resolution (for example, high resolving power, superior pattern features and small line edge roughness (LER)) and good dry etching durability, and to provide an actinic ray-sensitive or radiation-sensitive film using the composition, a mask blank in which the above film is formed, and a pattern forming method.SOLUTION: The resin composition contains a polymeric compound (A) having a repeating unit (Q) expressed by general formula (1). In the formula, Rrepresents a hydrogen atom, a methyl group or a halogen atom; Rand Rrepresent a hydrogen atom, an alkyl group or a cycloalkyl group; L represents a divalent connecting group or a single bond; Y represents a substituent excluding a methylol group; Z represents a hydrogen atom or a substituent; m represents an integer of 0 to 4; and n represents an integer of 1 to 5, where m+n is at most 5.

    Abstract translation: 要解决的问题:为了提供可以形成图案以满足高灵敏度,高分辨率(例如,高分辨率,优异的图案特征和小线边缘粗糙度(LER))的需要的树脂组合物和良好的干蚀刻 耐久性,并且使用该组合物提供光化学敏感或辐射敏感的膜,其中形成上述膜的掩模板和图案形成方法。溶液:树脂组合物含有具有 由通式(1)表示的重复单元(Q)。 在该式中,R表示氢原子,甲基或卤原子; 兰德R代表氢原子,烷基或环烷基; L表示二价连接基团或单键; Y表示除羟甲基之外的取代基; Z表示氢原子或取代基; m表示0〜4的整数, n表示1〜5的整数,m + n为5以下。

    Negative pattern forming method and resist pattern
    87.
    发明专利
    Negative pattern forming method and resist pattern 有权
    负面图案形成方法和阻力图

    公开(公告)号:JP2012133329A

    公开(公告)日:2012-07-12

    申请号:JP2011243961

    申请日:2011-11-07

    CPC classification number: G03F7/20 G03F7/0397 G03F7/325 G03F7/40 Y10T428/24802

    Abstract: PROBLEM TO BE SOLVED: To provide a negative pattern forming method for improving removability of a film, reducing scum on a substrate generating after development, reducing scum defects and achieving excellent resolution, in a pattern forming method which includes forming a film having a film thickness of 200 nm or more from a chemically amplified resist composition, and exposing and developing the film, so as to stably form a fine pattern with high accuracy for manufacturing a high-integration and high-accuracy electronic device.SOLUTION: The negative pattern forming method includes steps of: (1) forming a film having a film thickness of 200 nm or more from a chemically amplified resist composition, which contains (A) a resin showing increase in its polarity by an action of an acid to decrease solubility with a developing solution containing an organic solvent, (B) a compound generating an acid by irradiation with actinic rays or radiation, and (C) a solvent; (2) exposing the film; and (3) developing the exposed film with a developing solution containing an organic solvent.

    Abstract translation: 要解决的问题:为了提供一种用于提高膜的可除去性的负型图案形成方法,减少在显影后产生的底物上的浮渣,减少浮渣缺陷并获得优异的分辨率,在图案形成方法中,包括形成具有 从化学放大型抗蚀剂组合物的膜厚度为200nm以上,曝光和显影膜,以便高精度地稳定地形成精细图案以制造高集成度和高​​精度的电子器件。 阴性图案形成方法包括以下步骤:(1)从化学放大型抗蚀剂组合物形成膜厚度为200nm以上的膜,其含有(A)显示出极性增加的树脂, 使用含有有机溶剂的显影液降低溶解度的作用,(B)通过用光化射线或辐射照射产生酸的化合物和(C)溶剂; (2)曝光胶片; 和(3)用含有机溶剂的显影液显影曝光的薄膜。 版权所有(C)2012,JPO&INPIT

    Actinic ray-sensitive or radiation-sensitive resin composition, and resist film and pattern formation method using the same
    88.
    发明专利
    Actinic ray-sensitive or radiation-sensitive resin composition, and resist film and pattern formation method using the same 有权
    丙烯酸类敏感性或辐射敏感性树脂组合物,以及使用其的耐蚀膜和图案形成方法

    公开(公告)号:JP2012073401A

    公开(公告)日:2012-04-12

    申请号:JP2010217965

    申请日:2010-09-28

    Abstract: PROBLEM TO BE SOLVED: To provide an actinic ray-sensitive or radiation-sensitive resin composition which improves resolution such as a pre-bridge size and an exposure latitude, and a resist film and a pattern formation method using the composition.SOLUTION: An actinic ray-sensitive or radiation-sensitive resin composition is provided that includes: a compound (A) which is decomposed upon irradiation with actinic rays or radiation to generate an acid; resin (B) which is decomposed by the action of an acid to change solubility in an developer; and a compound (C) which reacts with, in the presence of an acid, an acid generated by the compound (A) upon irradiation with actinic rays or radiation to form a covalent bond (wherein the resin (B) and the compound (C) may be the same compound). There are also provided a resist film and a pattern formation method using the composition.

    Abstract translation: 要解决的问题:提供一种提高诸如预桥尺寸和曝光宽容度之类的分辨率的光化射线敏感或辐射敏感性树脂组合物,以及使用该组合物的抗蚀剂膜和图案形成方法。 解决方案:提供光化射线敏感或辐射敏感性树脂组合物,其包括:化合物(A),其在用光化射线或辐射照射时分解以产生酸; 树脂(B),其通过酸的作用而分解,以改变显影剂中的溶解度; 和在化合物(A)中产生的酸与光化射线或辐射反应形成共价键的化合物(C)(其中树脂(B)和化合物(C) )可以是相同的化合物)。 还提供了使用该组合物的抗蚀剂膜和图案形成方法。 版权所有(C)2012,JPO&INPIT

    Pattern forming method, chemically amplified resist composition, and resist film
    89.
    发明专利
    Pattern forming method, chemically amplified resist composition, and resist film 有权
    图案形成方法,化学放大电阻组合物和电阻膜

    公开(公告)号:JP2012013812A

    公开(公告)日:2012-01-19

    申请号:JP2010148387

    申请日:2010-06-29

    Abstract: PROBLEM TO BE SOLVED: To provide a method for forming a pattern that has high resolution, allows to reduce LWR and is excellent in pattern shape; a chemically amplified resist composition; and a resist film.SOLUTION: A pattern forming method comprises the steps of: (I) forming a film with a chemically amplified resist composition containing (A) a resin whose solubility in a developer containing an organic solvent decreases due to polarity increased by action of an acid, (B) a compound generating an acid by irradiation of actinic rays or radiation and (C) a solvent; (II) exposing the film; and (III) developing using a developer containing an organic solvent. The resin (A) has a structure where a polar group is protected by a leaving group which is decomposed by action of an acid to leave. The leaving group contains a silicon atom.

    Abstract translation: 要解决的问题:为了提供一种形成具有高分辨率的图案的方法,可以减少LWR并且图案形状优异; 化学放大抗蚀剂组合物; 和抗蚀膜。 解决方案:图案形成方法包括以下步骤:(I)用化学放大抗蚀剂组合物形成膜,该组合物含有(A)树脂,其在含有有机溶剂的显影剂中的溶解度由于通过 酸,(B)通过光化射线或辐射的照射产生酸的化合物和(C)溶剂; (II)曝光胶片; 和(III)使用含有有机溶剂的显影剂显影。 树脂(A)具有极性基团被离去基团保护的结构,其通过酸的作用而分解离开。 离去基团含有硅原子。 版权所有(C)2012,JPO&INPIT

    Pattern forming method and resist composition
    90.
    发明专利
    Pattern forming method and resist composition 有权
    图案形成方法和阻力组成

    公开(公告)号:JP2011221509A

    公开(公告)日:2011-11-04

    申请号:JP2011056712

    申请日:2011-03-15

    Abstract: PROBLEM TO BE SOLVED: To provide a pattern forming method for forming a pattern having excellent exposure latitude (EL) and a large depth of focus (DOF), and a resist composition.SOLUTION: A pattern forming method of the present invention includes (A) forming a film with a resist composition; (B) exposing the film to light; and (C) developing the exposed film with a developer containing an organic solvent. The resist composition contains (a) a resin which is decomposed by the action of an acid and ΔSP represented by the following equation (1) is equal or more than 2.5(MPa); (b) a compound which generates an acid upon irradiation with actinic rays or radiation; and (c) a solvent.

    Abstract translation: 要解决的问题:提供一种用于形成具有优异的曝光宽容度(EL)和大的聚焦深度(DOF)的图案的图案形成方法和抗蚀剂组合物。 解决方案:本发明的图案形成方法包括(A)用抗蚀剂组合物形成膜; (B)将薄膜曝光; 和(C)用含有机溶剂的显影剂显影曝光的薄膜。 抗蚀剂组合物含有(a)通过酸的作用而分解的树脂和下述式(1)表示的ΔSP等于或大于2.5(MPa) 1/2 < SP>; (b)在用光化射线或辐射照射时产生酸的化合物; 和(c)溶剂。 版权所有(C)2012,JPO&INPIT

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