Abstract:
PROBLEM TO BE SOLVED: To provide an active light-sensitive or radiation-sensitive resin composition that simultaneously satisfies sensitivity, resolution, a pattern form, line edge roughness, resist temporal stability, and dry etching resistance, especially in lithography using electron beam, X-ray, or EUV light as a source of exposure light; and also to provide a pattern forming method using the same. SOLUTION: The active light-sensitive or radiation-sensitive resin composition contains a resin (P) including: a repeating unit (A) which generates an acid when decomposed by application of active light or radiation and which includes an acid dissociation group; and a repeating unit (B) having at least an aromatic ring group. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive resin composition superior in development residue and outgassing performance, and to provide a method of forming a pattern using the positive resist composition. SOLUTION: The positive resin composition comprises (A) any of compounds expressed by General Formula (I) and (B) a resin that contains a residue (c) of a compound having an ionization potential value lower than that of phenol and when acted on by an acid, exhibits an increased solubility in alkali. In Formula (I): Ar represents an aromatic ring having Cy groups and optionally further other substituents; n is an integer of 2 or greater; Cy represents a group having a substituted or unsubstituted alkyl group or a group having a substituted or unsubstituted cycloaliphatic group, provided that a plurality of Cy groups may be identical with or different from each other; and M + represents an organic onium ion. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive type resist composition for new freezing processing made in the light of the above circumstances, not conducting special chemical processing to a first resist pattern in the freezing process, and capable of forming the first pattern having favorable line edge roughness without being substantially dissolved in a solvent of a second resist and a liquid developer without deteriorating the shape even when a second resist pattern is formed, and to provide a pattern forming method using the positive type resist composition. SOLUTION: This positive type resist composition contains (A) resin, whose solubility to an alkaline liquid developer is increased by the action of acid, (B) a compound to which active light rays or radiation is applied to generate acid, and (C) a compound having a functional group which bridges between resins by heating. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive resist composition which is applicable even to a multiple exposure process in which exposure is performed two or more times on the same resist film, and which ensures a fine pattern profile, and to provide a pattern forming method. SOLUTION: The positive resist composition includes: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer increases under an action of an acid; (C) a compound capable of decomposing under an action of an acid to generate an acid; and (D) a compound which itself acts as a base for the acids generated from the component (A) and the component (C) but decomposes upon irradiation with actinic rays or radiation to lose a basicity for the acids generated from the component (A) and the component (C). The pattern forming method uses the positive resist composition. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method using a positive resist composition with a favorable pattern resolution property and line width roughness, and suiting multiple exposure, in a multiple exposure process carrying out exposure a plurality of times on the same resist film. SOLUTION: The positive resist composition contains (A) a compound generating acid by irradiation of an active light ray or radiation, and (B) 80 mol.% or more of a copolymerization component not having an aromatic base. It contains resin with solubility with respect to an alkali developing solution increased by action of the acid, and (C) a compound decomposed by the action of the acid and generating an acid. An absolute value of a difference of pKa of the acid generated from the (A) component and the acid generated from the (C) component is 2 or less, and an absolute value of a difference of molecular weights is 50 or less. In the pattern forming method, by using the composition, exposure is carried out plural times with respect to the same resist film, and it has a process of heating the resist film at least once between exposure and exposure. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a surface treating agent for a freezing process and a method for forming a pattern using the surface treating agent, wherein the freezing process comprises, after a first resist pattern is formed on a first resist film, chemically treating the first resist pattern to change properties of the pattern not to be dissolved in a second resist liquid so as to form a second resist film on the first resist pattern to form a second resist pattern, and the surface treating agent for the freezing process is used for the chemical treatment on the first resist pattern to satisfy such requirements that the first resist pattern is not dissolved in the second resist liquid, that the first resist pattern shows no dimensional change, and further, that the first resist pattern and the second resist pattern have the same dry etching durability. SOLUTION: The surface treating agent for pattern formation contains a specified compound having an amino group and an aromatic ring. The method for forming a pattern is carried out using the above surface treating agent. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method for forming a pattern with high sensitivity, excellent resolution of a trench pattern and good density distribution dependency, in order to stably form a high-precision fine pattern for producing a high-integration and high-precision electronic device. SOLUTION: The pattern forming method includes (1) applying a resist composition for negative development comprising a resin of which the polarity increases by the action of an acid to thereby reduce its solubility in a negative developer, (2) exposing the composition, and (3) performing development with a negative developer comprising an organic solvent having a metal impurity content of ≤100 ppb. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for stably forming a high-accuracy fine pattern to be used in the production process of a semiconductor such as IC, in the production of a circuit board of liquid crystal, thermal head and the like or in other photofabrication processes, a resist composition to be used in the method, a developing solution to be used in the method and a rinsing solution to be used in the method. SOLUTION: The pattern forming method includes: (1) coating a resist composition including a resin that includes a specific repeating unit and increases the polarity by the action of an acid, wherein the composition decreases the solubility in a negative developing solution upon irradiation with actinic rays or radiation; (2) exposing; and (3) developing with a negative developing solution. There are also provided the resist composition to be used in the method, the developing solution to be used in the method and the rinsing solution to be used in the method. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a surface-treating agent for a freezing process, the freezing process comprising forming a first resist pattern on a first resist film, and then forming a second resist film on the first resist pattern to form a second resist pattern thereon, and subjecting the first resist pattern to chemical treatment to thereby change the property of the first resist pattern so as not to dissolve in a second resist solution, to provide the surface-treating agent for the chemical treatment of the first resist pattern in the freezing process so as to satisfy requirements that the first resist pattern does not dissolve in the second resist solution, that the dimension of the first resist pattern does not vary, and further, that the dry etching resistances of the first resist pattern and the second resist pattern are the same, and to provide a pattern-forming method using the surface-treating agent. SOLUTION: The surface-treating agent for pattern formation contains a specific compound having a cyclic structure having a hetero atom in the skeleton. The pattern-forming method uses the above surface-treating agent. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a resin by removing a low molecular eight component giving bad effects to its resist performance effectively and simply, the resin and further a positive type photosensitive composition improved with resist performance [light exposure latitude, LER (line edge roughness), development defects and preservation stability], and a method for forming a pattern by using the same. SOLUTION: This method for producing the resin increasing dissolving rate to an alkaline developing liquid by an action of an acid is provided by comprising a process of adding a solvent (b) containing a poor solvent to a solution (a) containing the resin of which dissolving rate to the alkaline development liquid is increased by the action of the acid to prepare a solution (c), and a process of precipitating the resin of which dissolving rate to the alkaline development liquid is increased by the action of the acid by adding the solution (c) to a solvent (d) containing the poor solvent. The resin produced by such the method of production, the positive type photosensitive composition containing the above resin and the method for forming the pattern by using the same are also provided. COPYRIGHT: (C)2008,JPO&INPIT