公开(公告)号：US11703641B2

公开(公告)日：2023-07-18

申请号：US17510910

申请日：2021-10-26

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Yusheng Bian ,  Francis Afzal

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/293

CPC classification number: G02B6/12007 ,  G02B6/1228 ,  G02B6/13 ,  G02B6/2938

Abstract: Structures for a wavelength division multiplexing filter and methods of fabricating a structure for a wavelength division multiplexing filter. The structure includes a first waveguide core having a first section and a second section. The first section and the second section have a first notched sidewall and a second notched sidewall opposite to the first notched sidewall. The structure further includes a second waveguide core positioned with a first offset in a first direction relative to the first section and the second section of the first waveguide core and with a second offset in a second direction relative to the first section and the second section of the first waveguide core. The second direction is transverse to the first direction.

公开(公告)号：US20230187566A1

公开(公告)日：2023-06-15

申请号：US17551544

申请日：2021-12-15

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian ,  Asif Chowdhury

IPC: H01L31/0232 ,  H01L31/101 ,  H01L31/0203 ,  H01L31/18

CPC classification number: H01L31/02327 ,  H01L31/101 ,  H01L31/0203 ,  H01L31/18

Abstract: Structures for a photodetector and methods of fabricating a structure for a photodetector. The structure includes a first waveguide core having a first taper, a semiconductor layer having a sidewall adjacent to the first taper, and a second waveguide core having a second taper that is positioned to overlap with the first taper and a curved section. The second taper is longitudinally positioned between the sidewall of the semiconductor layer and the curved section. The curved section terminates the second waveguide core.

公开(公告)号：US11579360B2

公开(公告)日：2023-02-14

申请号：US17354408

申请日：2021-06-22

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Yusheng Bian ,  Qizhi Liu

IPC: G02B6/12 ,  G02B6/34 ,  G02B6/124

Abstract: Embodiments of the disclosure provide an optical antenna for a photonic integrated circuit (PIC). The optical antenna includes a vertically oriented semiconductor waveguide with a first end on a semiconductor layer. The vertically oriented semiconductor waveguide includes a first sidewall and a second sidewall opposite the first sidewall. A reflective material is along the second sidewall of the vertically oriented semiconductor waveguide. A first plurality of grating protrusions extends from the first sidewall of the vertically oriented semiconductor waveguide.

公开(公告)号：US20230038887A1

公开(公告)日：2023-02-09

申请号：US17394770

申请日：2021-08-05

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Ryan Sporer ,  George R. Mulfinger ,  Yusheng Bian

IPC: H01L27/12 ,  H01L21/84 ,  H01L29/06 ,  H01L21/762 ,  H01L27/146

Abstract: Structures for a photonics chip that include a fully-depleted silicon-on-insulator field-effect transistor and related methods. A first device region of a substrate includes a first device layer, a first portion of a second device layer, and a buried insulator layer separating the first device layer from the first portion of the second device layer. A second device region of the substrate includes a second portion of the second device layer. The first device layer, which has a thickness in a range of about 4 to about 20 nanometers, transitions in elevation to the second portion of the second device layer with a step height equal to a sum of the thicknesses of the first device layer and the buried insulator layer. A field-effect transistor includes a gate electrode on the top surface of the first device layer. An optical component includes the second portion of the second device layer.

公开(公告)号：US11555963B1

公开(公告)日：2023-01-17

申请号：US17358255

申请日：2021-06-25

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Subramanian Krishnamurthy ,  Yusheng Bian

IPC: G02B6/125 ,  G02B6/13 ,  G02B6/122 ,  G02B6/12

Abstract: Structures for an optical power splitter and methods of forming a structure for an optical power splitter. The structure includes a first waveguide core having a first arm, a second waveguide core including a second arm, and a third waveguide core having a third arm laterally positioned between the first arm and the second arm. The third arm has a longitudinal axis. The first arm is longitudinally offset from the third arm parallel to the longitudinal axis such that the third arm and the first arm are laterally adjacent over a first overlap distance. The second arm is longitudinally offset from the third arm parallel to the longitudinal axis such that the third arm and the second arm are laterally adjacent over a second overlap distance. The first overlap distance is greater than the second overlap distance to provide an overlap offset.

公开(公告)号：US11531164B2

公开(公告)日：2022-12-20

申请号：US17169971

申请日：2021-02-08

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Kevin K. Dezfulian ,  Yusheng Bian ,  Kenneth J. Giewont ,  Karen Nummy

IPC: G02B6/30 ,  G02B6/124 ,  G02B6/122 ,  G02B6/14 ,  G02B6/136 ,  G02B6/125

Abstract: Structures including an edge coupler and methods of fabricating a structure including an edge coupler. The structure includes a dielectric layer including an edge, a waveguide core region on the dielectric layer, and multiple segments on the dielectric layer. The waveguide core region has an end surface, and the waveguide core region is lengthwise tapered toward the end surface. The segments are positioned between the waveguide core region and the edge of the dielectric layer. A waveguide core has a section positioned over the waveguide core region in an overlapping arrangement. The waveguide core has an end surface, and the section of the waveguide core is lengthwise tapered toward the end surface.

公开(公告)号：US11502214B2

公开(公告)日：2022-11-15

申请号：US17196756

申请日：2021-03-09

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Siva P. Adusumilli ,  Mark D. Levy ,  Yusheng Bian

IPC: H01L31/105 ,  H01L31/18 ,  H01L31/0352 ,  H01L27/146

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to photodetectors used with a broadband signal and methods of manufacture. The structure includes: a first photodetector; a second photodetector adjacent to the first photodetector; a first airgap of a first size under the first photodetector structured to detect a first wavelength of light; and a second airgap of a second size under the second photodetector structured to detect a second wavelength of light.

公开(公告)号：US11500198B2

公开(公告)日：2022-11-15

申请号：US17146509

申请日：2021-01-12

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Won Suk Lee ,  Thomas G. Weeks, III ,  Michal Rakowski ,  Yusheng Bian ,  Roderick A. Augur ,  Alexander L. Martin ,  Petar I. Todorov

IPC: G02B27/00 ,  G02B6/125

Abstract: Disclosed are a system, method, software tool, etc. for generating a layout indicating the paths for balanced optical waveguides (WGs) of a WG bus. A grid is used to route paths, which extend between corresponding first and second input/output nodes, respectively, and which are within boundaries of a defined area. The paths are automatically rerouted to balance for length and number of bends without overly increasing the lengths of or number of bends in those paths and further without moving the input/output nodes or falling outside the established boundaries. Automatic rerouting of the paths is performed iteratively based on results of various intersection operations related to different path-specific sets of points on the grid to determine when and where to insert additional linear segments and bends into the paths. Then, a layout indicating the balanced paths is generated. Also disclosed is a WG bus structure with balanced optical WGs.

公开(公告)号：US20220357530A1

公开(公告)日：2022-11-10

申请号：US17313472

申请日：2021-05-06

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Brett Cucci ,  Yusheng Bian ,  Abdelsalam Aboketaf ,  Edward Kiewra ,  Robert K. Leidy

IPC: G02B6/42

Abstract: Structures for an edge coupler of a photonics chip and methods of forming an edge coupler for a photonics chip. The structure includes a waveguide core on a dielectric layer, as well as an interconnect structure including a interlayer dielectric layer positioned over the dielectric layer and an opening penetrating through the interlayer dielectric layer to the waveguide core. A region of the interlayer dielectric layer is positioned to overlap with a portion of the waveguide core. The region of the interlayer dielectric layer has a surface that is rounded with a curvature.

公开(公告)号：US11493686B2

公开(公告)日：2022-11-08

申请号：US17227843

申请日：2021-04-12

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Yusheng Bian

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/13

Abstract: Structures for an optical component of a photonics chip and methods of forming a structure for an optical component of a photonics chip. The structure includes a slotted waveguide component having a first and second waveguide cores over a dielectric layer. The first waveguide core separated from the second waveguide core by a slot. The structure further includes a third waveguide core over the dielectric layer. The third waveguide core is positioned in a different level relative to the dielectric layer than the slotted waveguide component, and the third waveguide core and the first slot have an overlapping arrangement.