公开(公告)号：EP1259990B1

公开(公告)日：2013-12-25

申请号：EP01919164.2

申请日：2001-03-02

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  DEBRAY, Alexandra ,  WAITL, Günther

IPC: H01L33/50

CPC classification number: H01L33/501 ,  H01L2933/0041

公开(公告)号：EP1794787B1

公开(公告)日：2009-11-04

申请号：EP05773768.6

申请日：2005-08-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  LIM, Huey Ling Rena ,  BOGNER, Georg ,  GRUBER, Stefan ,  SCHNEIDER, Markus

IPC: H01L21/48 ,  H01L23/495

CPC classification number: H01L23/49541 ,  H01L23/495 ,  H01L23/49562 ,  H01L2924/0002 ,  Y10T29/49174 ,  H01L2924/00

Abstract: The invention relates to a conductor frame (1) for at least one electronic component, comprising at least two electric connection parts (2) with respectively at least one electric connection strip (3) and at least one retaining strip (4). The connection frame (1) is characterized in that an indentation is provided between the at least one retaining strip (4) and connection part (2), creating a parallel offset between the retaining strip (4) and adjacent area of the connection part (2), and in that another parallel offset is created between the connection part (2) and electrical connection strip (3) such that the retaining strip (4) and electric connection strip (3) are located on a common plane. The retaining strip (4) can be removed easily through the indentation (8) without having to create a disadvantageous stamping gap between the connection part (2) and the retaining strip (4).

公开(公告)号：EP1834355A1

公开(公告)日：2007-09-19

申请号：EP05822975.8

申请日：2005-12-01

Applicant: Osram Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  BRUNNER, Herbert ,  GRÖTSCH, Stefan ,  LEFRANC, Guy

IPC: H01L23/473 ,  H01L23/467 ,  H01L23/427

CPC classification number: H01L23/427 ,  H01L33/648 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

Abstract: The invention relates to a cooling device for cooling a semiconductor component (1), in particular an optoelectronic semiconductor component, comprising at least partially first and second layers and a heat dissipation device (4), wherein said first and second layers are flatly placed on top of each other and one layer is provided, at least partially, with a structure for receiving said heat dissipation device (4).

公开(公告)号：EP1771891A2

公开(公告)日：2007-04-11

申请号：EP05770747.3

申请日：2005-07-21

Applicant: Osram Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  ENGL, Moritz ,  GRÖTSCH, Stefan ,  KROMOTIS, Patrick

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/60 ,  F21S41/143 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic component that emits electromagnetic radiation. Said component comprises a housing body with a cavity that is configured as a trench, a plurality of semiconductor chips being arranged in a line in the cavity. Two neighbouring semiconductor chips are spaced at a distance from one another, which is less than or equal to one and a half lateral edge lengths of the semiconductor chip and greater than or equal to 0 νm. The invention also relates to an illumination module comprising a component of this type.

公开(公告)号：EP1565948A2

公开(公告)日：2005-08-24

申请号：EP03767463.7

申请日：2003-11-27

Applicant: Osram Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  BOGNER, Georg ,  WAITL, Günter ,  WINTER, Matthias

IPC: H01L33/00 ,  H01L31/0203

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic component containing an optoelectronic chip (1), a chip carrier (2) with a central region (3), on which the chip is fixed and terminals (41, 42, 43, 44), which run from the central region of the chip carrier (2) to the exterior of said chip. The chip and sections of the chip carrier are surrounded by a body (5). The respective projection of the body, in addition to that of the longitudinal axes of the terminals on the contact plane between the chip and the chip carrier are essentially point-symmetrical in relation to the central point of the chip. The invention also relates to an assembly comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced malfunctions of the components is reduced.

Abstract translation: 本发明涉及一种包含光电芯片（1）的光电子器件，具有芯片固定在其上的中心区域（3）的芯片载体（2）以及从其延伸的端子（41,42,43,44） 芯片载体（2）的中心区域延伸到所述芯片的外部。 芯片载体的芯片和部分被本体（5）包围。 除了芯片和芯片载体之间的接触平面上的端子的纵向轴线之外，本体的相应投影相对于芯片的中心点基本上是点对称的。 本发明还涉及一种包括所述部件的组件。 组件对称配置的优点是减少了组件热机械引起的故障的风险。

公开(公告)号：EP1547163A2

公开(公告)日：2005-06-29

申请号：EP03753330.4

申请日：2003-09-29

Applicant: Osram Opto Semiconductors GmbH ,  Siemens AG

Inventor： BOGNER, Georg ,  KROMOTIS, Patrick ,  MAYER, Ralf ,  NOLL, Heinrich ,  WINTER, Matthias

IPC: H01L33/00 ,  H01L31/0203

CPC classification number: H01L33/64 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic component (1) comprising a semiconducting assembly (4) which emits and receives electromagnetic radiation and is arranged on a support (22) connecting a thermocunductor to a heat sink (12). The inventive optoelectronic component also comprises external electrical connections (9) which are connected to the semiconducting assembly (4) and disposed in an electrically insulated manner on the heat sink (12) at a distance from the support (22). Said invention makes it possible to produce an optimised component for evacuating waste heat and light emission and providing an electrical contact and components density in modules.

公开(公告)号：EP1546796A1

公开(公告)日：2005-06-29

申请号：EP03753271.0

申请日：2003-09-01

Applicant: Siemens Aktiengesellschaft ,  Osram Opto Semiconductors GmbH

Inventor： NOLL, Heinrich ,  MAYER, Ralf ,  KROMOTIS, Patrick ,  BOGNER, Georg

IPC: G02F1/13357

CPC classification number: H05B33/0803 ,  G02F1/133603 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/8592 ,  H05B33/0821 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An illumination device for backlighting an image reproduction device containing light valves, the illumination device including a plurality of luminous spots arranged in grid format on a flat thermally conductive carrier. Each luminous spot having a plurality of light emitting diodes electrically insulated from one another, and a submount exhibiting good thermal conductivity and being connected to the carrier.

公开(公告)号：EP1525619A1

公开(公告)日：2005-04-27

申请号：EP03787632.3

申请日：2003-07-07

Applicant: Osram Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  SORG, Jörg, Erich ,  WAITL, Günter

IPC: H01L23/498 ,  H01L23/31 ,  H01L33/00

CPC classification number: H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: Disclosed is a surface-mounted semiconductor component comprising a semiconductor chip (1), at least two external electrical connections (3, 4) that are connected in an electrically conducting manner to at least two electrical contacts of the semiconductor chip (1), and a chip cover (5). The two external electrical connections (3, 4) are disposed on a film (2) having a thickness of no more than 100 µm. The semiconductor chip (1) is fixed to a first main surface (22) of the film (2) while the chip cover (5) is applied to said first main surface (22). Also disclosed is a method for producing such a component.

公开(公告)号：EP0839400B1

公开(公告)日：2003-06-04

申请号：EP96923857.5

申请日：1996-07-16

Applicant: Osram Opto Semiconductors GmbH & Co. OHG

Inventor： BOGNER, Georg ,  BRUNNER, Herbert ,  HAAS, Heinz ,  LUFT, Johann ,  NIRSCHL, Ernst ,  SPAETH, Werner ,  STATH, Norbert ,  TEICH, Wolfgang

IPC: H01S5/02 ,  H01S5/32

CPC classification number: H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0091 ,  H01S5/02228 ,  H01S5/02244 ,  H01S5/02292 ,  H01S5/0425 ,  H01S5/3428 ,  H01L2924/00014

Abstract: The invention relates to an infrared emitter component with a commercial light-emitting diode (LED) package (11) which has two electrode terminals (13, 14), one of which has a well-shaped reflector (12), and which has an optically transparent, electrically nonconductive encapsulating material (16). The invention provides that a semiconductor laser chip (1) is mounted in the well-shaped reflector (12) of the LED package. The semiconductor laser chip (1) has a quantum-well structure, especially with a strained-layer structure, for example MOVPE epitaxial layers with the layer sequence GaAlAs-InGaAs-GaAlAs. The optically transparent, electrically nonconductive material (16) of the LED package (11) may incorporate a diffuser material (17) which in terms of type and concentration is structured and introduced so as to produce, in conjunction with the semiconductor laser chip (1) encapsulated in the LED package (11), a radiation characteristic or an enlargement of the effective emission surface that is comparable to that of a commercial infrared LED.

公开(公告)号：EP1761959B1

公开(公告)日：2018-10-24

申请号：EP05753601.3

申请日：2005-05-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  GRÖTSCH, Stefan ,  WAITL, Günter ,  WANNINGER, Mario

IPC: H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L33/58 ,  H01L33/60 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/00014