公开(公告)号：EP2266139B1

公开(公告)日：2017-08-23

申请号：EP09753505.8

申请日：2009-03-31

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： JÄGER, Harald ,  ZITZLSPERGER, Michael

IPC: H01L31/0203 ,  H01L31/18 ,  H01L23/498 ,  H01L23/00 ,  H01L33/48 ,  H01L33/62 ,  H01L31/0232 ,  H01L33/00

CPC classification number: H01L31/0203 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/97 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0066 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2396832B1

公开(公告)日：2016-03-30

申请号：EP10701548.9

申请日：2010-01-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ZITZLSPERGER, Michael ,  SPERL, Matthias

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/52 ,  H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L33/54

CPC classification number: H01L21/56 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49586 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2406827A1

公开(公告)日：2012-01-18

申请号：EP09799360.4

申请日：2009-12-23

Applicant: Osram Opto Semiconductors Gmbh

Inventor： ZITZLSPERGER, Michael

IPC: H01L31/0203 ,  H01L33/52 ,  H01L33/54 ,  H01L33/48

CPC classification number: H01L31/0203 ,  H01L33/483 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic semiconductor component (100) having – a carrier (1) comprising a mounting surface (11) and at least one penetration (3), wherein the penetration (3) extends from the mounting surface (11) to a base surface (12) of the carrier opposite the mounting surface (11); - at least one optoelectronic semiconductor chip (2) mounted on the mounting surface (11); - a cast body (5) transparent to radiation enclosing the at least one optoelectronic semiconductor chip (2) at least in places, wherein – the cast body (5) is disposed at least in places in the penetration (3) of the carrier (1).

公开(公告)号：EP2279533B1

公开(公告)日：2019-01-09

申请号：EP09753513.2

申请日：2009-04-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ZITZLSPERGER, Michael ,  ZEILER, Thomas

IPC: H01L31/167 ,  H01L33/00 ,  G01V8/12 ,  H01L25/16 ,  H01L31/0203

公开(公告)号：EP2577754A2

公开(公告)日：2013-04-10

申请号：EP11781727.0

申请日：2011-05-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： JÄGER, Harald ,  ZITZLSPERGER, Michael ,  SCHNEIDER, Albert

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic component (10) comprising a housing (1), at least one semiconductor chip (2) arranged in the housing (1), and a casting compound (3). The semiconductor chip (2) comprises an active layer suitable for producing or detecting electromagnetic radiation. The casting compound (3) at least partially surrounds the semiconductor chip (2), reflective particles (3a) being embedded in the casting compound (3). The invention relates to a method for producing such a component and a compound structure.

公开(公告)号：EP2415077A1

公开(公告)日：2012-02-08

申请号：EP10706666.4

申请日：2010-03-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： RAMCHEN, Johann ,  ZITZLSPERGER, Michael

IPC: H01L27/146 ,  H01L31/0203 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L24/34 ,  H01L24/37 ,  H01L27/14618 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/37599 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12036 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: The invention relates to an optoelectronic component (1) comprising an optoelectronic semiconductor chip (2), a contact frame (3), a contact carrier (4), a first electric connection region (5), and a second electric connection region (6) electrically insulated from the first electric connection region (5), each comprising a part of the contact frame (3) and a part of the contact carrier (4), wherein the contact frame (3) is provided with a depression (7) which separates the first electric connection region (5) at least in some regions from the second electric connection region (6) and into which the optoelectronic semiconductor chip (2) protrudes, and wherein the contact frame (3) is designed with a contact element (30) which electrically connects the contact frame (3) to the optoelectronic semiconductor chip (2).

Abstract translation: 本发明涉及一种包括光电子半导体芯片（2），接触框架（3），接触载体（4），第一电连接区域（5）和第二电连接区域（6）的光电子器件（1） ）与所述第一电连接区域（5）电绝缘，所述第一电连接区域（5）各自包括所述接触框架（3）的一部分和所述接触载体（4）的一部分，其中所述接触框架（3）设置有凹陷（7） 其至少在一些区域中将第一电连接区域（5）与第二电连接区域（6）分隔开并且光电子半导体芯片（2）突出到所述第一电连接区域中，并且其中接触框架（3）设计有接触元件 （30），其将所述接触框架（3）电连接到所述光电子半导体芯片（2）。

公开(公告)号：EP2279533A1

公开(公告)日：2011-02-02

申请号：EP09753513.2

申请日：2009-04-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ZITZLSPERGER, Michael ,  ZEILER, Thomas

IPC: H01L31/167 ,  H01L33/00

CPC classification number: H01L25/167 ,  G01V8/12 ,  H01L31/0203 ,  H01L31/167 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The application relates to a semiconductor component, a reflected-light barrier, and a method for producing a housing for a reflected-light barrier, wherein the lower part (5) of the housing is monolithic and has at least two cavities (6, 7) into which an emitter (3) and a detector (4) are introduced.

公开(公告)号：EP2218118A1

公开(公告)日：2010-08-18

申请号：EP08861500.0

申请日：2008-11-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  GRUBER, Stefan ,  ZITZLSPERGER, Michael

IPC: H01L33/00 ,  H01L25/16 ,  H01L25/075

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/00014

Abstract: The invention relates to an arrangement comprising at least one optoelectronic semiconductor component (101), said arrangement comprising a carrier element arrangement (108) suitable for carrying the at least one optoelectronic semiconductor component. The arrangement comprises a housing body (103) consisting of a light-absorbent plastic material, which is arranged on the carrier element arrangement. The housing body comprises a raised area (104) and a set-back area (105) between which an inclined flank (115) is formed. The set-back area extends up to the optoelectronic semiconductor component, in order to reduce reflections.

公开(公告)号：EP2510558B1

公开(公告)日：2019-06-26

申请号：EP10788035.3

申请日：2010-11-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： KRÄUTER, Gertrud ,  BARCHMANN, Bernd ,  BERGENEK, Krister ,  RAMCHEN, Johann ,  ZITZLSPERGER, Michael

IPC: H01L33/56 ,  H01L33/50

公开(公告)号：EP2327110B9

公开(公告)日：2019-05-15

申请号：EP09736562.1

申请日：2009-08-20

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： GRÖTSCH, Stefan ,  ZEILER, Thomas ,  ZITZLSPERGER, Michael ,  JÄGER, Harald

IPC: H01L33/48 ,  H01L33/64 ,  H01L33/00 ,  H01L25/075 ,  H01L33/62