公开(公告)号：EP4236208A2

公开(公告)日：2023-08-30

申请号：EP23178989.2

申请日：2020-05-01

Applicant: Panduit Corp.

Inventor： NORDIN, Ronald ,  BOLOURI-SARANSAR, Masud ,  WACHTEL, Paul W.

IPC: H04L12/10

Abstract: A method of detecting a fault in a power distribution system is provided. The method comprises: providing a power source; providing a load to be powered by the power source; providing a connection from the power source to the load; placing a current source on the connection from the power source to the load; detecting a change in a voltage on the connection indicative of a change of an impedance in the power distribution system; and determining a fault is present within the power distribution system based on the detected change in the voltage on the connection.

公开(公告)号：EP3963826A1

公开(公告)日：2022-03-09

申请号：EP20727083.6

申请日：2020-05-01

Applicant: Panduit Corp.

Inventor： NORDIN, Ronald A. ,  BOLOURI-SARANSAR, Masud ,  WACHTEL, Paul W.

IPC: H04L12/10

公开(公告)号：EP2630699B1

公开(公告)日：2020-03-11

申请号：EP11764924.4

申请日：2011-09-23

Applicant: Panduit Corp.

Inventor： BOLOURI-SARANSAR, Masud ,  NORDIN, Ronald, A. ,  WACHTEL, Paul, W. ,  BABU, Surendra, Chitti

IPC: H01R13/6469 ,  H01R24/64

公开(公告)号：EP2427887B1

公开(公告)日：2018-11-21

申请号：EP10718796.5

申请日：2010-05-05

Applicant: Panduit Corp.

Inventor： NORDIN, Ronald, A. ,  BOLOURI-SARANSAR, Masud ,  HOUGHTON, ll, Timothy, J. ,  WEIRATHER, Steven, C. ,  HOFFMAISTER, Hector, J.

IPC: H01B11/10

CPC classification number: H01B11/085 ,  H01B11/1008

Abstract: A communication cable with a plurality of twisted pairs of conductors and a matrix tape having conductive segments separated by gaps. In some embodiments, an insulating layer is placed between the twisted pairs of conductors and the matrix tape. In some embodiments, the insulating layer is an embossed or perforated film.

公开(公告)号：EP3036802B1

公开(公告)日：2018-10-03

申请号：EP14761480.4

申请日：2014-08-20

Applicant: Panduit Corp.

Inventor： BOLOURI-SARANSAR, Masud ,  BABU, Surendra Chitti

IPC: H01R13/66 ,  H01R24/64 ,  H01R27/00 ,  H01R29/00 ,  H01R107/00

CPC classification number: H01R24/64 ,  H01R4/24 ,  H01R13/648 ,  H01R13/6658 ,  H01R27/00 ,  H01R29/00 ,  H01R2107/00

Abstract: Embodiments of the present invention are generally related to communication connectors, and more specifically, to communication connectors such as jacks which are compatible with more than one style of a plug. In one embodiment, the electrical and mechanical design of a jack in accordance with the present invention may extend the usable bandwidth beyond the IEC 60603-7-71 requirement of 1000 MHz to support potential future applications such as, but not limited to, 40GBASE-T. In addition, the jack may be backwards compatible with lower speed BASE-T applications (e.g., 10GBASE-T and/or below) when an RJ45 plug is mated to the jack.

公开(公告)号：EP2764585B1

公开(公告)日：2016-08-17

申请号：EP12780341.9

申请日：2012-10-02

Applicant: Panduit Corp.

Inventor： BOLOURI-SARANSAR, Masud ,  BABU, Surentra C. ,  WACHTEL. Paul, W. ,  NORDIN, Ronald A.

IPC: H01R13/658 ,  H01R13/66 ,  H01R27/00 ,  H01R29/00 ,  H01R24/64 ,  H01R13/703 ,  H01R13/6461 ,  H05K1/02 ,  H01R107/00

CPC classification number: H01R24/62 ,  H01R13/6461 ,  H01R13/658 ,  H01R13/6658 ,  H01R13/703 ,  H01R24/64 ,  H01R27/00 ,  H01R29/00 ,  H01R2107/00 ,  H05K1/0228 ,  H05K1/0239 ,  H05K2201/10189

公开(公告)号：EP3036802A1

公开(公告)日：2016-06-29

申请号：EP14761480.4

申请日：2014-08-20

Applicant: Panduit Corp.

Inventor： BOLOURI-SARANSAR, Masud ,  BABU, Surendra Chitti

IPC: H01R13/66 ,  H01R24/64 ,  H01R27/00 ,  H01R29/00 ,  H01R107/00

CPC classification number: H01R24/64 ,  H01R4/24 ,  H01R13/648 ,  H01R13/6658 ,  H01R27/00 ,  H01R29/00 ,  H01R2107/00

Abstract: Embodiments of the present invention are generally related to communication connectors, and more specifically, to communication connectors such as jacks which are compatible with more than one style of a plug. In one embodiment, the electrical and mechanical design of a jack in accordance with the present invention may extend the usable bandwidth beyond the IEC 60603-7-71 requirement of 1000 MHz to support potential future applications such as, but not limited to, 40GBASE-T. In addition, the jack may be backwards compatible with lower speed BASE-T applications (e.g., 10GBASE-T and/or below) when an RJ45 plug is mated to the jack.

Abstract translation: 本发明的实施例通常涉及通信连接器，更具体地涉及与多于一种插头式兼容的诸如插座的通信连接器。 在一个实施例中，根据本发明的插座的电气和机械设计可以将可用带宽延伸超过1000MHz的IEC 60603-7-71要求，以支持潜在的未来应用，例如但不限于40GBASE- T. 此外，当RJ45插头与插孔配合时，插孔可能向下兼容低速BASE-T应用（例如，10GBASE-T和/或以下）。

公开(公告)号：EP2783469B1

公开(公告)日：2016-06-22

申请号：EP12806740.2

申请日：2012-11-20

Applicant: Panduit Corp.

Inventor： BOLOURI-SARANSAR, Masud ,  NORDIN, Ronald, A.

IPC: H04B3/32 ,  H01R13/646

CPC classification number: H01R23/005 ,  H01R13/6464 ,  H01R13/6658 ,  H01R24/60 ,  H01R24/64 ,  H04B3/32

公开(公告)号：EP2656460B1

公开(公告)日：2015-02-25

申请号：EP11813920.3

申请日：2011-12-15

Applicant: Panduit Corp.

Inventor： ASZTALOS, Michael, D. ,  MISHAL, Rami, A. ,  BOLOURI-SARANSAR, Masud ,  NORDIN, Ronald, A.

IPC: H02G3/04 ,  H05K9/00

CPC classification number: H05K9/0007 ,  H02G3/0406 ,  H02G3/0418 ,  H02G3/045

公开(公告)号：EP2764585A2

公开(公告)日：2014-08-13

申请号：EP12780341.9

申请日：2012-10-02

Applicant: Panduit Corp.

Inventor： BOLOURI-SARANSAR, Masud ,  BABU, Surentra C. ,  WACHTEL. Paul, W. ,  NORDIN, Ronald A.

IPC: H01R13/658 ,  H01R13/66 ,  H01R27/00 ,  H01R29/00 ,  H01R24/64 ,  H01R13/703 ,  H01R13/6461 ,  H01R107/00

CPC classification number: H01R24/62 ,  H01R13/6461 ,  H01R13/658 ,  H01R13/6658 ,  H01R13/703 ,  H01R24/64 ,  H01R27/00 ,  H01R29/00 ,  H01R2107/00 ,  H05K1/0228 ,  H05K1/0239 ,  H05K2201/10189

Abstract: The present invention provides a communication jack for connecting to one of a first plug and a second plug. The jack includes a housing, plug interface contacts, and coupling circuitry. The plug interface contacts are at least partially within said housing and include a plurality of contact pairs having at least a first contact pair and a second contact pair. The coupling circuitry is configured for engaging said first contact pair and said second contact pair when said first plug is inserted into said housing. The coupling circuitry is configured for disengaging from said first contact pair and said second contact pair when said second plug is inserted into said housing.