公开(公告)号：US12287510B2

公开(公告)日：2025-04-29

申请号：US17520467

申请日：2021-11-05

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: G02B6/12 ,  H01S5/02326 ,  H01S5/00 ,  H01S5/14

Abstract: A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening, such that the active region of the chip is aligned with the device layer of the platform.

公开(公告)号：US12007605B2

公开(公告)日：2024-06-11

申请号：US17314991

申请日：2021-05-07

Applicant: Skorpios Technologies, Inc.

Inventor： Majid Sodagar ,  Wenyi Wang ,  Changyi Li ,  Guoliang Li ,  Murtaza Askari ,  Yi Wang ,  John Dallesasse ,  Stephen B. Krasulick

IPC: G02B6/27 ,  G02B6/122 ,  G02F1/09 ,  G02B6/12 ,  G02B6/126

CPC classification number: G02B6/2746 ,  G02B6/1228 ,  G02F1/093 ,  G02B2006/1215 ,  G02B6/126

Abstract: A polarization-independent, optical circulator is formed in silicon photonics. The polarization-independent, optical circulator uses an optical splitter having two couplers and two waveguides joining the two couplers. One of the two waveguides is thinner than the other to create a large effective index difference between TE and TM modes transmitted through the one waveguide. Polarization rotators, including reciprocal and/or non-reciprocal rotators, are further used to create the optical circulator.

公开(公告)号：US11675134B1

公开(公告)日：2023-06-13

申请号：US17306801

申请日：2021-05-03

Applicant: Skorpios Technologies, Inc.

Inventor： Guoliang Li ,  Stephen B. Krasulick

IPC: G02B6/293

CPC classification number: G02B6/29389 ,  G02B6/2931 ,  G02B6/29346 ,  G02B6/29395

Abstract: An optical bandpass filter includes an optical splitter having at least four ports, one of the ports being designated as an input port and one of the ports being designated as an output port. First and second reflectors couple with respective third and fourth ones of the ports. The splitter directs portions of the input light from the input port, into the third and fourth ports, such that the portions of the input light propagate toward the respective first and second reflectors. The first and second reflectors reflect light having wavelengths within a predetermined wavelength range, back toward the splitter, as wavelength-selected light, and transmit light having wavelengths that are outside of the predetermined wavelength range, away from the splitter. The splitter directs at least a portion of the wavelength-selected light that propagates back toward the splitter, into the output port, as output light.

公开(公告)号：US11307440B2

公开(公告)日：2022-04-19

申请号：US16843761

申请日：2020-04-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  Damien Lambert ,  Andrew Bonthron ,  Guoliang Li

IPC: G02B6/26 ,  G02F1/01 ,  G02F1/017 ,  H03H7/38 ,  G02F1/015

Abstract: A modulator and a capacitor are integrated on a semiconductor substrate for modulating a laser beam. Integrating the capacitor on the substrate reduces parasitic inductance for high-speed optical communication.

公开(公告)号：US11181688B2

公开(公告)日：2021-11-23

申请号：US15073957

申请日：2016-03-18

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: G02B6/12 ,  H01S5/02326 ,  H01S5/00 ,  H01S5/14

Abstract: A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermetically seals the chip in the platform.

公开(公告)号：US10895686B2

公开(公告)日：2021-01-19

申请号：US15968454

申请日：2018-05-01

Applicant: Skorpios Technologies, Inc.

Inventor： Damien Lambert ,  Guoliang Li ,  John Zyskind ,  Stephen B. Krasulick

IPC: G02B6/13 ,  G02B6/14 ,  G02B6/122 ,  G02B6/136 ,  G02B6/132 ,  G02B6/30 ,  G02B6/12

Abstract: A method of fabricating a waveguide mode expander includes providing a substrate including a waveguide, bonding a chiplet including multiple optical material layers in a mounting region adjacent an output end of the waveguide, and selectively removing portions of the chiplet to form tapered stages that successively increase in number and lateral size from a proximal end to a distal end of the chiplet. The first optical material layer supports an input mode substantially the same size as a mode exiting the waveguide. One or more of the overlying layers, when combined with the first layer, support a larger, output optical mode size. Each tapered stage of the mode expander is formed of a portion of a respective layer of the chiplet. The first layer and the tapered stages form a waveguide mode expander that expands an optical mode of light traversing the chiplet.

公开(公告)号：US20190113680A1

公开(公告)日：2019-04-18

申请号：US16160706

申请日：2018-10-15

Applicant: Skorpios Technologies, Inc.

Inventor： Majid Sodagar ,  Stephen B. Krasulick ,  John Zyskind ,  Paveen Apiratikul ,  Luca Cafiero

IPC: G02B6/122 ,  H04B10/25 ,  H04B10/40 ,  G02B6/26

Abstract: A device for optical communication is described. The device comprises two transceivers integrated on one chip. A first transceiver can be used with existing optical-communication architecture. As a more advanced optical-communication architecture becomes adopted, the device can be switched from using the first transceiver to using a second transceiver to communicate using the more advanced optical-communication architecture.

公开(公告)号：US20180348432A1

公开(公告)日：2018-12-06

申请号：US15968454

申请日：2018-05-01

Applicant: Skorpios Technologies, Inc.

Inventor： Damien Lambert ,  Guoliang Li ,  John Zyskind ,  Stephen B. Krasulick

IPC: G02B6/14 ,  G02B6/30 ,  G02B6/132 ,  G02B6/136 ,  G02B6/122 ,  G02B6/12

Abstract: A method of fabricating a waveguide mode expander includes providing a substrate including a waveguide, bonding a chiplet including multiple optical material layers in a mounting region adjacent an output end of the waveguide, and selectively removing portions of the chiplet to form tapered stages that successively increase in number and lateral size from a proximal end to a distal end of the chiplet. The first optical material layer supports an input mode substantially the same size as a mode exiting the waveguide. One or more of the overlying layers, when combined with the first layer, support a larger, output optical mode size. Each tapered stage of the mode expander is formed of a portion of a respective layer of the chiplet. The first layer and the tapered stages form a waveguide mode expander that expands an optical mode of light traversing the chiplet.

公开(公告)号：US09977188B2

公开(公告)日：2018-05-22

申请号：US15051348

申请日：2016-02-23

Applicant: Skorpios Technologies, Inc.

Inventor： Damien Lambert ,  Guoliang Li ,  John Zyskind ,  Stephen B. Krasulick

IPC: G02B6/14 ,  G02B6/122 ,  G02B6/136 ,  G02B6/132 ,  G02B6/30 ,  G02B6/12

CPC classification number: G02B6/14 ,  G02B6/1228 ,  G02B6/132 ,  G02B6/136 ,  G02B6/305 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12152

Abstract: A method of fabricating a waveguide mode expander includes providing a substrate including a waveguide, bonding a chiplet including multiple optical material layers in a mounting region adjacent an output end of the waveguide, and selectively removing portions of the chiplet to form tapered stages that successively increase in number and lateral size from a proximal end to a distal end of the chiplet. The first optical material layer supports an input mode substantially the same size as a mode exiting the waveguide. One or more of the overlying layers, when combined with the first layer, support a larger, output optical mode size. Each tapered stage of the mode expander is formed of a portion of a respective layer of the chiplet. The first layer and the tapered stages form a waveguide mode expander that expands an optical mode of light traversing the chiplet.

公开(公告)号：US09829630B2

公开(公告)日：2017-11-28

申请号：US14806270

申请日：2015-07-22

Applicant: Skorpios Technologies, Inc.

Inventor： Derek Van Orden ,  Amit Mizrahi ,  Timothy Creazzo ,  Stephen B. Krasulick

IPC: G02B6/12 ,  G02B6/125 ,  G02F1/225 ,  G02F1/025 ,  H01S3/08 ,  H01S5/40 ,  G02F1/01 ,  G02B6/293 ,  G02B6/26 ,  H01S3/063 ,  G02F1/21

CPC classification number: G02B6/125 ,  G02B6/12007 ,  G02B6/26 ,  G02B6/29337 ,  G02B6/29359 ,  G02B2006/12104 ,  G02B2006/1215 ,  G02F1/011 ,  G02F1/0147 ,  G02F1/225 ,  G02F2001/213 ,  H01S3/0637 ,  H01S3/08027 ,  H01S5/4068

Abstract: A reflective structure includes an input/output port and an optical splitter coupled to the input/output port. The optical splitter has a first branch and a second branch. The reflective structure also includes a first resonant cavity optically coupled to the first branch of the optical splitter. The first resonant cavity comprises a first set of reflectors and a first waveguide region disposed between the first set of reflectors. The reflective structure further includes a second resonant cavity optically coupled to the second branch of the optical splitter. The second resonant cavity comprises a second set of reflectors and a second waveguide region disposed between the second set of reflectors.