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公开(公告)号：JP2003041159A
公开(公告)日：2003-02-13
申请号：JP2001224484
申请日：2001-07-25
Applicant: Toppan Forms Co Ltd , トッパン・フォームズ株式会社
Inventor： NAOI SHINGO , ENDO YASUHIRO , MARUYAMA TORU
IPC: B42D15/10 , C09D11/00 , G06K19/07 , G06K19/077
Abstract: PROBLEM TO BE SOLVED: To provide an epoxy-based insulating ink for IC media usable as an insulating material for IC media in view of the facts of having no oxidative polymerization inhibitory action, having high coatability on substrate surface, and because of being very slightly foamable, producing no pinholes even on forming an electrical insulation layer by a single coating operation and therefore having no problem of short-circuit antenna.
SOLUTION: This epoxy-based insulating ink for IC media essentially comprises (A) a cationically polymerizable epoxy resin, (B) a cationic photopolymerization initiator, (C) a particulate filler and (D) a sorbitan ester-type nonionic surfactant.
COPYRIGHT: (C)2003,JPOAbstract translation: 要解决的问题：考虑到没有氧化聚合抑制作用，在基材表面上具有高涂布性，并且由于非常轻微的涂布性，提供了可用作IC介质的绝缘材料的IC介质的环氧系绝缘油墨 可发泡，即使在通过单次涂布操作形成电绝缘层时也不产生针孔，因此没有短路天线的问题。 解决方案：用于IC介质的环氧基绝缘油基本上包含（A）阳离子可聚合环氧树脂，（B）阳离子光聚合引发剂，（C）颗粒填料和（D）脱水山梨糖醇酯型非离子表面活性剂。
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公开(公告)号：JP2003006600A
公开(公告)日：2003-01-10
申请号：JP2001190235
申请日：2001-06-22
Applicant: Toppan Forms Co Ltd , トッパン・フォームズ株式会社
Inventor： MARUYAMA TORU , ENDO YASUHIRO , NAOI SHINGO
IPC: B42D15/10 , G06K19/07 , G06K19/077
Abstract: PROBLEM TO BE SOLVED: To provide the formation method of an RF-ID medium for which electric connection is not interrupted even when external force is concentrated on a conductive part for connection by strongly conducting and joining an IC chip mounted interposer and an antenna holding body.
SOLUTION: The IC chip mounted interposer is formed by providing a conductive pattern provided with at least the conductive part for the connection on a base material and mounting an IC chip on the conductive part for the connection and the antenna holding body is formed by providing the conductive pattern composed of an antenna conductive part and the conductive part for the connection positioned at the end part of the antenna conductive part on the base material. The interposer and the antenna holding body are piled up and the respective conductive parts for the connection are conductively joined by using a conductive staple.
COPYRIGHT: (C)2003,JPOAbstract translation: 要解决的问题：为了提供RF-ID介质的形成方法，即使外部力集中在用于连接的导电部分上的电连接也不会中断，强电导和连接IC芯片安装的插入件和天线保持体 。 解决方案：IC芯片安装的内插器通过提供至少在基材上设置用于连接的导电部分的导电图案并将IC芯片安装在用于连接的导电部件上而形成，并且天线保持体通过提供 导电图案由天线导电部分和用于连接的导电部分构成，位于基材上的天线导电部分的端部。 将插入物和天线保持体堆叠起来，通过使用导电性的钉将导电性接合用于连接的各导电部。
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公开(公告)号：JP2003006594A
公开(公告)日：2003-01-10
申请号：JP2001190226
申请日：2001-06-22
Applicant: Toppan Forms Co Ltd , トッパン・フォームズ株式会社
Inventor： MARUYAMA TORU , ENDO YASUHIRO , NAOI SHINGO
IPC: B42D15/10 , G06K19/07 , G06K19/077
Abstract: PROBLEM TO BE SOLVED: To provide a formation method of an RF-ID medium for which electric connection is not interrupted even when external force is concentrated on a conductive part for connection by strongly conducting and joining an IC chip mounted interposer and an antenna holding body.
SOLUTION: The IC chip mounted interposer is formed by providing a conductive pattern provided with at least the conductive part for the connection on a base material and mounting an IC chip on the conductive part for the connection and the antenna holding body is formed by providing the conductive pattern composed of an antenna conductive part and the conductive part for the connection positioned at the end part of the antenna conductive part on the base material. The interposer and the antenna holding body are made to face each other at the respective conductive parts for the connection, and piled up by interposing an insulating both-side tape in-between and the interposer and the antenna holding body are joined by using a conducting and joining means and the insulating both-side tape.
COPYRIGHT: (C)2003,JPOAbstract translation: 要解决的问题：为了提供RF-ID介质的形成方法，即使外部力集中在用于连接的导电部分上的电连接也不会中断，强电导和连接IC芯片安装的插入件和天线保持体 。 解决方案：IC芯片安装的内插器通过提供至少在基材上设置用于连接的导电部分的导电图案并将IC芯片安装在用于连接的导电部件上而形成，并且天线保持体通过提供 导电图案由天线导电部分和用于连接的导电部分构成，位于基材上的天线导电部分的端部。 使插入件和天线保持体在用于连接的各个导电部分彼此面对，并且通过在其间插入绝缘的双面带并且插入件与天线保持体之间通过使用导电 和接合装置和绝缘双面胶带。
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公开(公告)号：JP2002298108A
公开(公告)日：2002-10-11
申请号：JP2001101128
申请日：2001-03-30
Applicant: TOPPAN FORMS CO LTD
Inventor： MARUYAMA TORU , ENDO YASUHIRO
IPC: B42D15/02 , B42D15/10 , G06K19/07 , G06K19/077
Abstract: PROBLEM TO BE SOLVED: To easily manufacture an interposer for a contactless IC medium without need of heat resistance allowing using a sheet with low heat resistance of paper or synthetic resin such as PVC or PET. SOLUTION: Thermosetting conductive ink is printed and hardened on a release sheet 10 with high heat resistance to form opposite lands 5, 7a, 7b and a jumper part 8. Thermosetting insulation ink is printed and cured in such a manner covering the jumper part 8 to form a resist part 6. An IC chip 9 is mounted so as to be connected with the opposite lands 7b, 5. An adhesive sheet 11 with low heat resistance is closely contacted with the sheet 10 and torn off again, and the opposite lands 5, 7a, 7b the resist part 6, the jumper part 8 and the IC chip 9 are integrally transferred to an adhesive face of the adhesive sheet 11. The interposer 4 manufactured in such a manner is adhered to a sheet material 1 having an antenna 3 in a plurally wound coil shape and land parts 2a, 2b to finally form the contactless IC medium.
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公开(公告)号：JP2002298107A
公开(公告)日：2002-10-11
申请号：JP2001101127
申请日：2001-03-30
Applicant: TOPPAN FORMS CO LTD
Inventor： MARUYAMA TORU , ENDO YASUHIRO
IPC: B42D15/02 , B42D15/10 , G06K19/07 , G06K19/077
Abstract: PROBLEM TO BE SOLVED: To easily manufacture a contactless IC medium at a low cost using sheet type base material made of paper or synthetic resin such as PVC or PET without need of heat resistance. SOLUTION: Thermosetting conductive ink is printed and cured on a release sheet 1 with high heat resistance to form an antenna 3 in a plurally wound coil shape and a land. An adhesive sheet 11 is closely contacted with the sheet 1 and torn off again, and the antenna 3 and the land are transferred to an adhesive face of the adhesive sheet 11. An interposer 4 whereon opposite lands 5, 7b, resist part and a jumper part are previously formed and an IC chip 9 is mounted is adhered to the adhesive face of the adhesive sheet 11. Thereby the IC chip 9 of the interposer 4 is connected with the land at one end of the antenna via the opposite land 5, the jumper part and the opposite land and is connected with the land at the other end of the antenna via the opposite land 7b.
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Patent Agency Ranking
公开(公告)号：JP2002294197A
公开(公告)日：2002-10-09
申请号：JP2001093403
申请日：2001-03-28
Applicant: TOPPAN FORMS CO LTD
Inventor： MARUYAMA TORU , ENDO YASUHIRO
IPC: B42D15/10 , C09J11/00 , C09J163/00 , G06K19/07 , G06K19/077
Abstract: PROBLEM TO BE SOLVED: To obtain an adhesive for laminating non-contact IC media which allows no curling of products, shows an excellent heat resistance and adhesion, has an excellent flexibility allowing no peeling off at bending or twisting when used on non-contact IC media and provides highly reliable non-contact IC media. SOLUTION: This adhesive is used for laminating, on a substrate having an IC chip-mounted antenna, other parts of the substrate or other substrates. The adhesive contains an epoxy compound, a hardener and a flexibility- imparting agent.
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公开(公告)号：JP2002268551A
公开(公告)日：2002-09-20
申请号：JP2001071984
申请日：2001-03-14
Applicant: TOPPAN FORMS CO LTD
Inventor： HANAZAWA FUMIHIRO , ENDO YASUHIRO
Abstract: PROBLEM TO BE SOLVED: To easily convey the visiting purposes of visitors to an exhibit enterprise, etc. SOLUTION: The nameplates 1 to be distributed to the visitors in an event are provided with field identification regions 13 which make the fields of the visiting purposes of the visitors to the event identifiable and these fields are made selectable by the visitors who scratch concealing layers 14 formed on the field identification regions 13.
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公开(公告)号：JP2002222405A
公开(公告)日：2002-08-09
申请号：JP2001018778
申请日：2001-01-26
Applicant: TOPPAN FORMS CO LTD
Inventor： ENDO YASUHIRO , MARUYAMA TORU , KODAMA KAZUNARI
IPC: B42D15/10 , B65G61/00 , G06K19/07 , G06K19/077 , G09F3/00
Abstract: PROBLEM TO BE SOLVED: To provide a tag for baggage which has simple constitution, can be mass-produced at low cost, and is high in reliability and its manufacturing method. SOLUTION: The tag for baggage is constituted by stacking a tack sheet which has an entry part for baggage information on the top surface side of a sheet base material and an adhesive layer on the reverse surface side and a peeling sheet which is provided with an RF-ID module on the top surface side of a resin base material having peeling property on one over the other across the adhesive layer.
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89.发明专利
公开(公告)号：JP2002203220A
公开(公告)日：2002-07-19
申请号：JP2000401565
申请日：2000-12-28
Applicant: TOPPAN FORMS CO LTD
Inventor： ENDO YASUHIRO , MARUYAMA TORU
Abstract: PROBLEM TO BE SOLVED: To provide a sealant which does not peel off even by the application of force such as bending, compression and torsion when a non-contact type IC medium is used and prevents an IC chip from being destroyed and from being separated from a base material, a method for sealing the IC chip by using the sealant, and a method for manufacturing the non-contact type IC medium by using the sealant. SOLUTION: This sealant includes an electron beam curable component including a compound to be cured by electron beams as the main component. It is desirable to use a sealant that further includes a softening agent to give flexibility. The sealant is applied to the IC chip mounted on the non-contact type IC medium, the sealant is irradiated with electron beams to be cured, and the IC chip is thereby sealed.
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公开(公告)号：JP2002197921A
公开(公告)日：2002-07-12
申请号：JP2000395464
申请日：2000-12-26
Applicant: TOPPAN FORMS CO LTD
Inventor： ENDO YASUHIRO , MARUYAMA TORU
IPC: C08K7/00 , C08F2/44 , C08F2/46 , C08L101/00 , G06K19/07 , G06K19/077 , H01B1/00 , H01B1/20 , H01B1/22
Abstract: PROBLEM TO BE SOLVED: To provide electron beam curing conductive paste capable of easily forming an antenna, a circuit of a printed circuit board, a conductor layer for connecting layers, and electrodes of a display device, and the like, and using in place of solder for connecting an IC chip. SOLUTION: This electron beam curing conductive paste contains conductive powder and electron beam curing component containing a compound curing with electron beams. The conductive powder contains 80 or more mass % in total conductive powder of a mixture of (1) conductive dendritic powder having an average particle size of 0.05-1 μm and (2) flake conductive powder having an average particle size of 1-10 μm, having a ratio of mass of 60/40 to 95/5 in (1)/(2).
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