Abstract:
A module for a liquid crystal display apparatus may include: a liquid crystal display panel; first and second adhesive films on first and second surfaces of the liquid crystal display panel; first and second polarizing plates on the first and second adhesive films respectively, each polarizing plate including a polarizer and having a tetragonal shape with a long side and a short side. The absorption axes of the first polarizer and the second polarizer form an angle of about 80° to about 100°. A ratio (B/A) of the creep of the first adhesive film (B) to the creep of the second adhesive film (A) is greater than about 1 at a temperature of 25° C.
Abstract:
Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.
Abstract:
A skin patch that can enhance the water resistance and handling easiness and can alleviate any irritation on the user. There is provided a skin patch having a flexible backing and, superimposed thereon, a plaster containing a styrene-isoprene-styrene block copolymer and having a glass transition temperature (Tg) of −45° to −35° C. and tan δ (lag angle) value, determined at dynamic viscoelasticity measurement (frequency 6.2832 rad/s) at 45° C., of 0.25 or less.
Abstract:
[Summary] The present invention relates to a polarizing plate and a liquid crystal display device. The polarizing plate, which is lightweight and has a small thickness and excellent physical properties including durability, water resistance, workability, pressure-sensitive adhesion and a light leakage prevention effect; and the liquid crystal display device including the same may be provided.
Abstract:
The invention relates to an adhesive strip redetachable without residue or destruction by extensive stretching substantially in the bond plane, comprising at least one layer of adhesive which is foamed with microballoons, and at least one carrier B.
Abstract:
A high temperature filter containing a membrane, a support substrate, and a porous adhesive layer. The porous adhesive layer is adjacent the inner surface of the membrane and the inner surface of the support substrate such that the membrane and the support substrate sandwich the porous adhesive layer. The porous adhesive layer comprises an adhesive having an adhesive operating temperature of at least about 450° F. The support substrate is a woven textile, a non-woven textile, a knit textile, or a film, and has a support operating temperature of at least about 500° F.
Abstract:
The present invention relates to a polarizing plate and a liquid crystal display device. The polarizing plate, which is lightweight and has a small thickness and excellent physical properties including durability, water resistance, workability, pressure-sensitive adhesion and a light leakage prevention effect; and the liquid crystal display device including the same may be provided.
Abstract:
Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.