THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION
    83.
    发明公开
    THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION 有权
    WÄRMELEITFÄHIGESILIKONSCHMIERZUSAMMENSETZUNG

    公开(公告)号:EP2848677A1

    公开(公告)日:2015-03-18

    申请号:EP12876345.5

    申请日:2012-05-11

    Abstract: The present invention provides a thermally conductive grease composition which scarcely increases in hardness during high-temperature heating and has a minimized reduction in growth, containing:
    (A) an organopolysiloxane including at least two alkenyl groups per molecule, the 25°C kinetic viscosity being 5,000 to 100,000 mm 2 /s;
    (B) a hydrolysable methyl polysiloxane, trifunctional at one terminus, represented by general formula (1)

    (R 1 is a C 1-6 alkyl group, and a is an integer 5 to 100);
    (C) a thermally conductive filler having a thermal conductivity of 10 W/m·°C or greater;
    (D) an organohydrogenpolysiloxane containing two to five hydrogen atoms directly bonded to a silicon atom (Si-H group) per molecule;
    (E) an adhesion promoter having a triazine ring and at least one alkenyl group per molecule; and
    (F) a catalyst selected from the group consisting of platinum and platinum compounds.

    Abstract translation: 本发明提供了一种导热油脂组合物,其在高温加热过程中几乎不增加硬度,并且生长减少最小化,其包含:(A)每分子包含至少两个烯基的有机聚硅氧烷,25℃动力粘度为 5,000至100,000 mm 2 / s; (B)由通式(1)表示的一端为三官能的可水解甲基聚硅氧烷(R 1为C 1-6烷基,a为5〜100的整数)。 (C)导热性为10W / m·℃以上的导热性填料, (D)每分子含有与硅原子(Si-H基)直接键合的2〜5个氢原子的有机氢聚硅氧烷; (E)每分子具有三嗪环和至少一个烯基的粘合促进剂; 和(F)选自铂和铂化合物的催化剂。

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