Abstract:
A method of fabricating a gas sensor on a substrate and a gas sensor fabricated on a substrate that includes optical and electronic components are described. The method includes fabricating a laser to output light over a range of wavelengths within a waveguide, fabricating a splitter to split the light output by the laser to a reference waveguide and to a detection waveguide, fabricating a reference cell to house the reference waveguide and a reference gas. An output of the reference waveguide is coupled to a first optical detector and an output of the detection waveguide is coupled to a second optical detector to identify or quantify an ambient gas.
Abstract:
ProA wafer image inspection apparatus for inspecting defects of a semiconductor wafer comprises: a lighting portion for generating light; a lens portion for obtaining a wafer image, which is reflected after the light has been reflected onto a wafer to be inspected, and delivering the wafer image by lighting same in one direction; a dividing optical element for dividing the wafer image delivered from the lens portion; an image detection portion comprising a plurality of image-capturing elements, which are installed so that images which have passed through the lens portion and the dividing optical element are respectively formed on different focus positions; and an image processing portion for combining the images on different focus positions captured by the plurality of image pick-up elements to form a TSOM image, and comparing the TSOM image with a TSOM image of a normal semiconductor apparatus part to determine whether an object is defective.
Abstract:
Methods and systems for generating defect samples are provided. One method includes identifying a set of defects detected on a wafer having the most diversity in values of at least one defect attribute and generating different tiles for different defects in the set. The tiles define a portion of all values for the at least one attribute of all defects detected on the wafer that are closer to the values for the at least one attribute of their corresponding defects than the values for the at least one attribute of other defects. In addition, the method includes separating the defects on the wafer into sample bins corresponding to the different tiles based on their values of the at least one attribute, randomly selecting defect(s) from each of two or more of the sample bins, and creating a defect sample for the wafer that includes the randomly selected defects.
Abstract:
In an inspection apparatus, inspection is carried out by linearly moving a wafer while rotating the wafer with respect to light. In a case where the wafer is rotated, the velocity of flow of air in outer regions of the wafer is increased, and there is a possibility that the flow of the air in the outer regions cause particles contained in an atmosphere in the vicinity of the wafer to be adhered to the wafer. In a case where such particles are adhered to the wafer, the particles are also detected as a defect, and therefore yields and cleanliness in a semiconductor production process cannot be correctly evaluated. Therefore, it is desirable that adhesion of the particles contained in the atmosphere in the vicinity of the wafer to the wafer be reduced as much as possible. Further, it is expected that, when, for example, rotation speed of the wafer is increased or a diameter of the wafer is increased, such particles are adhered further remarkably. This point has not been satisfactorily considered in the conventional arts. The invention has a feature that a conductor such as a draft to outer regions is supplied from above a substrate while the substrate is being rotated and the supplied conductor is exhausted on outside of the substrate.
Abstract:
The disclosed device, which, using an electron microscope or the like, minutely observes defects detected by an optical appearance-inspecting device or an optical defect-inspecting device, can reliably insert a defect to be observed into the field of an electron microscope or the like, and can be a device of a smaller scale. The electron microscope, which observes defects detected by an optical appearance-inspecting device or by an optical defect-inspecting device, has a configuration wherein an optical microscope that re-detects defects is incorporated, and a spatial filter and a distribution polarization element are inserted at the pupil plane when making dark-field observations using this optical microscope. The electron microscope, which observes defects detected by an optical appearance-inspecting device or an optical defect-inspecting device, has a configuration wherein an optical microscope that re-detects defects is incorporated, and a distribution filter is inserted at the pupil plane when making dark-field observations using this optical microscope.
Abstract:
Disclosed herein is an apparatus for and method of measuring bio-chips, which can implement an illumination method of a novel type that illuminates a bio sample (which may be also referred to as a “bio specimen”) through a side face of a substrate using a diffusion plate to form an evanescent field by the illumination light over the entire surface of a substrate so as to uniformly secure brightness of the illuminated light over a wide area of a substrate, thereby more efficiently measuring fluorescence information of a bio-chip over a wide field of view.
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus for detailed observation of defects detected by an optical defect inspection apparatus or by an optical visual inspection apparatus capable of placing a defect to be observed into the field of view of an electronic microscope or the like, without fail, and reducing the size of the apparatus. SOLUTION: An electronic microscope 5, for observing defects detected by an optical defect inspection apparatus or an optical visual inspection apparatus, is configured in such a manner that an optical microscope 14 for redetecting defects is mounted thereupon and that a distribution polarization element and a spatial filter are inserted in its pupil surface, when the optical microscope 14 is used to observe dark field. In an electronic microscope 5 for observing the defects detected by an optical defect inspection apparatus or an optical visual inspection apparatus, an optical microscope 14 for redetecting defects is mounted thereupon and a distribution filter is inserted in its pupil surface, when the optical microscope 14 is used to observe dark field. COPYRIGHT: (C)2011,JPO&INPIT