公开(公告)号：JP2012174681A

公开(公告)日：2012-09-10

申请号：JP2011151170

申请日：2011-07-07

Applicant: Ichia Technologies Inc ,  毅嘉科技股▲ふん▼有限公司

Inventor： CHEN KO-JU

IPC: H01H11/00 ,  H01H13/14

CPC classification number: H01H13/88 ,  H01H2009/187 ,  H01H2209/016 ,  H01H2229/016 ,  H01H2229/05 ,  H01H2229/058 ,  Y10T29/49

Abstract: PROBLEM TO BE SOLVED: To provide a new manufacturing method of a keypad capable of supplying products fast on demand, and a keypad structure.SOLUTION: A key cap layer 101 is punched (105) to form at least a key cap component used to assembly a keypad semi-product (106). The keypad semi-product is kept in a storage place (107). A pattern is provided. After a demand of the pattern is confirmed (108), the keypad semi-product is fetched and a hard coating is partially removed to form the confirmed pattern (109) to complete a keypad structure. A keypad structure and a keypad semi-structure are also provided.

Abstract translation: 要解决的问题：提供能够快速按要求提供产品的键盘的新的制造方法和键盘结构。 打孔（105），以形成用于组装小键盘半成品（106）的至少一个键帽组件。 键盘半成品保存在存放位置（107）。 提供了一种模式。 在确定了图案的需求（108）之后，取出小键盘半成品并部分去除硬涂层以形成确认的图案（109）以完成小键盘结构。 还提供了键盘结构和小键盘半结构。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2012238563A

公开(公告)日：2012-12-06

申请号：JP2011211973

申请日：2011-09-28

Applicant: Ichia Technologies Inc ,  毅嘉科技股▲ふん▼有限公司

Inventor： CHEN KO-JU

IPC: H01H13/02 ,  F21S2/00 ,  H01H11/00

CPC classification number: G02B6/006 ,  G02B6/0036

Abstract: PROBLEM TO BE SOLVED: To provide a light guide plate structure achieving local illumination and preventing light leakage, and a method for manufacturing the light guide plate structure.SOLUTION: In a light guide plate structure including a light guide layer and at least one light shielding line, the light shielding line includes an ink, is provided within the light guide layer, and blocks light transmitted from the whole light guide layer. The light shielding line is provided to transmit light only in an individual region within the light guide layer or to prevent light leakage. In a method for manufacturing the light guide plate structure, surface modification is performed on a light guide layer, and an ink is printed on the modified surface of the light guide layer so that the ink is permeated in the light guide layer and a light shielding line is formed in the light guide layer.

Abstract translation: 要解决的问题：提供实现局部照明并防止漏光的导光板结构，以及制造导光板结构的方法。 解决方案：在导光层中包括导光层和至少一个遮光线的导光板结构中，遮光线包括墨水，设置在导光层内，并且阻挡从整个导光层透射的光 。 遮光线被设置成仅在导光层内的各个区域透射光，或防止光泄漏。 在导光板结构的制造方法中，对导光层进行表面改性，并且在导光层的改性面上印刷油墨，使得油墨渗透在导光层中，并且遮光 线形成在导光层中。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2011243555A

公开(公告)日：2011-12-01

申请号：JP2010236766

申请日：2010-10-21

Applicant: Ichia Technologies Inc ,  毅嘉科技股▲ふん▼有限公司

Inventor： LAN SHAO HUA

IPC: H01H11/00 ,  H01H9/16 ,  H01H13/702

CPC classification number: H01H13/88 ,  H01H2209/068 ,  H01H2229/024 ,  H01H2229/046 ,  H01H2229/058

Abstract: PROBLEM TO BE SOLVED: To provide a keypad plunger structure satisfying a requirement for reduced thickness while maintaining an excellent key press feeling, and a method of manufacturing the keypad plunger structure.SOLUTION: According to the method, a polymer film (such as a PET film) and a plunger material layer (such as a silicone rubber) are integrally molded to form an integrally molded article including the polymer film and a plurality of plungers. The integrally molded article is utilized to attach a plurality of metal domes on a printed wiring board through an adhesive layer. The plungers are located correspondingly to the metal domes. Before performing the integral molding, the other side of the polymer film may be connected with an adhesive and a release paper. This configuration further facilitates the manufacturing.

Abstract translation: 要解决的问题：提供满足减小厚度要求的键盘柱塞结构，同时保持优异的按键感觉，以及制造键盘柱塞结构的方法。 解决方案：根据该方法，将聚合物膜（例如PET膜）和柱塞材料层（例如硅橡胶）一体地模制，以形成包括聚合物膜和多个柱塞的整体模塑制品 。 整体模塑制品用于通过粘合剂层将多个金属圆顶安装在印刷线路板上。 柱塞相应于金属圆顶定位。 在进行一体成型之前，聚合物膜的另一侧可以与粘合剂和剥离纸连接。 该构造进一步有利于制造。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2011192624A

公开(公告)日：2011-09-29

申请号：JP2010181575

申请日：2010-08-16

Applicant: Ichia Technologies Inc ,  毅嘉科技股▲ふん▼有限公司

Inventor： CHEN CHIH-CHAO

IPC: H01H11/00 ,  H01H13/70

CPC classification number: B29C51/02 ,  B29C45/0055 ,  B29C45/1418 ,  B29C45/14811 ,  B29C51/082 ,  B29C51/10 ,  B29C51/14 ,  B29C2791/001 ,  B29C2791/007 ,  B29C2795/002 ,  B29L2031/466 ,  B29L2031/7676

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a key cap structure and a keyboard equipped with the key cap structure.
SOLUTION: Firstly, an upper side coloring layer and then a lower side coloring layer are printed on a film; the film is hot-pressed to form a thin type shell and a plastic injection-molded layer is formed on the lower side coloring layer by a plastic injection-molding process; and lastly, the film including the plastic injection-molded layer is cut or punched to form a plurality of key cap structures. Further, the key cap structures and a series of keyboard members are assembled to form a key board equipped with the key cap structure.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种具有键帽结构的键帽结构和键盘的制造方法。 解决方案：首先，在膜上印刷上侧着色层和下侧着色层， 将薄膜热压成薄型壳，通过塑料注射成型工艺在下侧着色层上形成塑料注射成型层; 最后，将包括塑料注塑层的薄膜切割或冲压以形成多个键帽结构。 此外，键帽结构和一系列键盘构件被组装以形成配备有键帽结构的键盘。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2014154873A

公开(公告)日：2014-08-25

申请号：JP2013161564

申请日：2013-08-02

Applicant: Ichia Technologies Inc ,  毅嘉科技股▲ふん▼有限公司

Inventor： CHIU CHIEN-HWA ,  CHAO CHIH-MIN ,  KUO PEIR-RONG ,  CHIANG CHIA-HUA ,  HSIAO CHIH-CHENG ,  GUAN FENGPING ,  LEE YING-WEI ,  JUANG YUNG-CHANG

IPC: H05K3/46 ,  H05K3/18

CPC classification number: H05K3/4673 ,  H05K1/0393 ,  H05K3/108 ,  H05K3/426

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer flexible printed circuit board which satisfies a requirement of downsizing a product by reducing thickness of the product, improves yield and reduces the problem of cross-talk between electric circuits, and a method of manufacturing the same.SOLUTION: A multilayer flexible printed circuit board comprises: at least one electric circuit unit disposed on a vertical interval layer. At least both sides of the electric circuit unit are covered by a horizontal interval layer and another vertical interval layer formed from electric insulating layers. By using a non-pressing method to stack layer structures of the multilayer flexible printed circuit board, occurrence of a crevice between layers is reduced, yield is improved, thickness is reduced and a problem of cross-talk between electric circuits can be avoided.

Abstract translation: 要解决的问题：提供通过减小产品厚度来满足产品尺寸减小的要求的多层柔性印刷电路板，提高产量并减少电路之间串扰的问题及其制造方法。 解决方案：多层柔性印刷电路板包括：设置在垂直间隔层上的至少一个电路单元。 电路单元的至少两侧被水平间隔层和由电绝缘层形成的另一垂直间隔层覆盖。 通过使用非压制方法来堆叠多层柔性印刷电路板的层结构，层之间的缝隙的发生减少，产率提高，厚度减小，并且可以避免电路之间串扰的问题。

公开(公告)号：JP2013103276A

公开(公告)日：2013-05-30

申请号：JP2011277248

申请日：2011-12-19

Applicant: Ichia Technologies Inc ,  毅嘉科技股▲ふん▼有限公司

Inventor： LIN PEI KUANG ,  LIU KUN-SHENG

IPC: B21K25/00 ,  B21D22/02 ,  B21K1/76

Abstract: PROBLEM TO BE SOLVED: To provide a method for forming a metal button.SOLUTION: The method for forming a metal button includes the steps of: providing a metal material for a shell; stamping the metal material for a shell to form a button shell that includes a thin shall, a storage part and a plurality of first round corners; placing a metal filling blank in the storage part of the button shell; and then pressing the metal filling blank with a forging pressure to fully fill the metal filling blank in the storage part of the button shell to form a solid metal button.

Abstract translation: 要解决的问题：提供一种形成金属按钮的方法。 解决方案：用于形成金属按钮的方法包括以下步骤：提供用于壳体的金属材料; 冲压用于外壳的金属材料以形成按钮壳体，该按钮壳体包括薄的部件，存储部件和多个第一圆角; 将金属填充坯料放置在按钮壳的存储部分中; 然后用锻造压力按压金属填充坯料，以完全填充按钮壳的存储部分中的金属填充坯料，以形成固体金属按钮。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2013071452A

公开(公告)日：2013-04-22

申请号：JP2012008914

申请日：2012-01-19

Applicant: Ichia Technologies Inc ,  毅嘉科技股▲ふん▼有限公司

Inventor： CHANG YU-CHIH ,  YU SHIH-PU ,  LIU CHANG-LI

IPC: B29C45/14 ,  B29L9/00

CPC classification number: B29C45/14311 ,  B29C45/14778 ,  B29K2705/00

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal-plastic composite body, more specifically, a method for bonding a plastic member to a metal housing.SOLUTION: The metal housing 10 has an inner face and an outer face. Physical treatment is performed on the inner face of the metal housing 10 to form a bonding region. An adhesive layer is formed on the bonding region. A plastic molding member 12 is formed on the adhesive layer by plastic injection molding.

Abstract translation: 要解决的问题：提供一种用于制造金属 - 塑料复合体的方法，更具体地，涉及一种将塑料构件接合到金属壳体的方法。 金属外壳10具有内表面和外表面。 在金属外壳10的内表面进行物理处理，形成接合区域。 在接合区域上形成粘接层。 通过塑料注射成型在粘合剂层上形成塑料成型构件12。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2011192625A

公开(公告)日：2011-09-29

申请号：JP2010181826

申请日：2010-08-16

Applicant: Ichia Technologies Inc ,  毅嘉科技股▲ふん▼有限公司

Inventor： CHEN CHIH-CHAO

IPC: H01H11/00 ,  G06F3/02 ,  H01H13/14

CPC classification number: H01H13/88 ,  H01H2229/047 ,  H01H2229/05 ,  H01H2229/058

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a key cap structure capable of forming a complicated pattern even on an uneven surface.
SOLUTION: The manufacturing method of a key cap structure comprises a colored plastic body molding process 11, a final coating spraying process 12, a calcining process 13, a laser engraving process 14, a transparent layer coating process 15, and a finishing process 16. A final coating is applied on a processing object surface of the colored plastic body by spray-coating. The colored plastic body and the final coating are calcined and the final coating is cured. The final coating is laser-beam-treated to form at least one hollow part. At least one patterned part is structured in the hollow part of the final coating and a corresponding treated surface. The patterned part and the final coating are covered by a transparent layer to protect the patterned part and the final coating, and a key cap structure is obtained from the colored plastic body.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 解决的问题：提供即使在不平坦的表面上也能够形成复杂图案的键帽结构的制造方法。 解决方案：盖帽结构的制造方法包括着色塑料体成型工艺11，最终涂布喷涂工艺12，煅烧工艺13，激光雕刻工艺14，透明层涂布工艺15和精加工 过程16.通过喷涂将最终涂层施加在着色塑料体的加工对象表面上。 着色的塑料体和最终的涂层被煅烧，最后的涂层被固化。 最终的涂层被激光束处理以形成至少一个中空部分。 至少一个图案部分被构造在最终涂层的中空部分和对应的处理表面中。 图案部分和最终涂层被透明层覆盖以保护图案部分和最终涂层，并且从着色塑料体获得关键帽结构。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2014152397A

公开(公告)日：2014-08-25

申请号：JP2013161793

申请日：2013-08-02

Applicant: Ichia Technologies Inc ,  毅嘉科技股▲ふん▼有限公司

Inventor： CHIU CHIEN-HWA ,  CHAO CHIH-MIN ,  KUO PEIR-RONG ,  CHIANG CHIA-HUA ,  HSIAO CHIH-CHENG ,  GUAN FENGPING ,  LEE YING-WEI ,  JUANG YUNG-CHANG

IPC: C23C18/16 ,  C23C18/32 ,  C25D5/56 ,  C25D7/00 ,  H05K3/18 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K1/0393 ,  H05K3/20 ,  H05K3/22 ,  H05K3/386 ,  H05K3/426 ,  H05K3/465 ,  H05K3/4673 ,  H05K2201/0154 ,  Y10T428/24521 ,  Y10T428/265 ,  Y10T428/31678

Abstract: PROBLEM TO BE SOLVED: To provide a precursor substrate, a flexible printed board and a manufacturing method thereof capable of improving the performance and value of a product, reducing waste of a material and also showing an environmental protection effect by reducing the thickness of the product, saving a time and cost required for production, and avoiding a problem of the waste of the material caused by a large amount of etching.SOLUTION: A flexible printed board comprises at least one lamination unit provided on the board, and the lamination unit includes a catalyst layer positioned on the surface of the board, a first conductive layer bonded to the catalyst layer, and a second catalyst layer positioned on the first conductive layer. The catalyst layer is a palladium layer, and the first conductive layer is preferably a nickel layer, and the board is made of a polyimide material. By the catalyst layer, a cost problem of a material source of the flexible printed board can be solved by distributing to fastening of the first conductive layer onto the board, and also a crosstalk problem between electric circuits can be improved by reducing the thickness.

Abstract translation: 要解决的问题：提供一种前体基板，柔性印刷电路板及其制造方法，其能够提高产品的性能和价值，减少材料的浪费并且通过减小产品的厚度也显示出环保效果 节省了生产所需的时间和成本，并且避免了由于大量蚀刻引起的材料浪费的问题。解决方案：柔性印刷电路板包括设置在电路板上的至少一个层压单元，层压单元包括 位于所述板的表面上的催化剂层，与所述催化剂层接合的第一导电层和位于所述第一导电层上的第二催化剂层。 催化剂层是钯层，第一导电层优选为镍层，基板由聚酰亚胺材料构成。 通过催化剂层，通过分配第一导电层到板上可以解决柔性印刷电路板的材料源的成本问题，并且通过减小厚度也可以提高电路之间的串扰问题。

公开(公告)号：JP2013071453A

公开(公告)日：2013-04-22

申请号：JP2012008915

申请日：2012-01-19

Applicant: Ichia Technologies Inc ,  毅嘉科技股▲ふん▼有限公司

Inventor： CHANG YU-CHIH ,  YU SHIH-PU ,  LIU CHANG-LI

IPC: B29C45/14 ,  B29L9/00

CPC classification number: B29C45/14311 ,  B24C1/06 ,  B29C45/1671

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal-plastic composite body, more specifically, a method for bonding a plastic member to a metal housing.SOLUTION: The metal housing 10 having an inner face and an outer face is provided. The metal housing 10 has a region which is engraved in a hollow shape. Physical treatment is performed on the inner face of the metal housing 10 to form a bonding region. An adhesive layer is formed on the bonding region. By implementing first injection molding, a plastic molding member 12 is formed on the adhesive layer. By implementing second injection molding, an optical plastic member 14 is molded within the region which is engraved in a hollow shape.

Abstract translation: 要解决的问题：提供一种用于制造金属 - 塑料复合体的方法，更具体地，涉及一种将塑料构件接合到金属壳体的方法。 解决方案：提供具有内表面和外表面的金属外壳10。 金属壳体10具有被刻成中空形状的区域。 在金属外壳10的内表面进行物理处理，形成接合区域。 在接合区域上形成粘接层。 通过实施第一注射成型，在粘合剂层上形成塑料成型件12。 通过实施第二注射成型，在被刻成中空形状的区域内模制光学塑料构件14。 版权所有（C）2013，JPO＆INPIT