Abstract:
PROBLEM TO BE SOLVED: To provide a solving means for authenticating the success/failure of a test mode. SOLUTION: This memory is provided with an array of memory cells each having two storage elements, a plurality of peripheral devices for writing data in the memory cells and reading data from the memory cells, a plurality of voltage sources for generating a plurality of supply voltages to be used by the array and the peripheral device in response to an external voltage, and a test mode logic for determining whether the memory is a test mode or not. The plurality of peripheral devices include latch circuits for latching data stored in the first group of a memory element in response to a first external signal, and write permission circuits for writing the latched data in the second group of the memory element in response to a second external signal. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that there is an adverse influence such as noise when maximum power is not necessary if a voltage pump of a size enough to supply necessary power is arranged. SOLUTION: A voltage pump for the dynamic random access memory is provided with a variable pump for supplying power at a variable level in response to a clock signal and an enable signal generated by the dynamic random access memory, an oscillator for generating the clock signal, and a regulator for generating a first signal to control the oscillator means. The variable pump includes a plurality of first independent pump circuits, and a plurality of second independent pump circuits. Each pump includes two substantially similar pump parts cooeperatively operated in response to the clock signal. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a means for supplying a proper operation voltage to a large semiconductor memory device. SOLUTION: A method for operating the amplification part of a voltage regulator for the dynamic random access memory includes a step of operating at least one power amplifier while a memory array is operated, a step of operating at least one booster amplifier independently of a power amplifier while a voltage pump is operated, and a step of operating a standby amplifier maintained at a low current level irrespective of the operated states of the power amplifier and the booster amplifier. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To cope with a problem during power-up and to perform power-up surely in the shortest time. SOLUTION: The dynamic random access memory is provided with a memory cell array, a plurality of peripheral apparatus for writing data in the memory cell and reading out data from the memory cell, a plurality of voltage sources generating a plurality of supply voltages used by the array and the plurality of peripheral sources responding to the outside voltage, and a power-up sequence circuit for controlling power-up operation for a certain voltage source among a plurality of voltage sources. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method and an apparatus for an active termination control in a memory by a module register providing an active termination control signal to the memory. SOLUTION: The module register monitors a system command bus for read and write commands. In the case of detecting the read or write command, the module register generates the active termination control signal to the memory. The memory turns on the active termination based on information being programmed into one or more mode registers of the memory. The memory maintains the active termination in an ON state for a predetermined time based on the information being programmed into one or more mode registers of the memory. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a film composition deposited on a substrate and its semiconductor device. SOLUTION: An initiation layer is formed by exposing a substrate to at least an adhesive material enough to be adsorbed by the material on the substrate. The initiation layer gives a first reactive region. The reactive region is made to chemically react with the first reactive material under an atomic layer deposition condition to form a second reactive region. The second reactive region is made to chemically react with a second reactive material under a process condition enough to form a reactive layer on the initiation layer. This process is repeated to form a continuous reactive layer on the initiation layer. The adhesive material comprising the initiation layer is used that does not deteriorate by atomic layer deposition method. The initiation layer forms a final film together with one or a plurality of reactive layers. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a data path capable of precisely and consistently detecting readout data under a low-voltage operation condition. SOLUTION: The data path 300 includes a local input/output (LIO) line 316 and a global input/output (GIO) line 350. A source follower circuit 325 includes first and second NMOS 334A, 334B having drains connected to first and second signal lines 352A, 352B of the GIO and gates connected to first and second signal lines 318A, 318B of the LIO. A third NMOS includes a source connected to the sources of the first and second NMOS, a gate connected to a reference voltage supply part, and a drain connected to a drain of a fourth NMOS. The fourth NMOS includes a gate to which a selection signal is applied and a source connected to the ground. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To obtain the optimal chip layout under restrictions in arranging pins and to provide power supply architecture in which a device can perform appropriate operation in the shortest period of time. SOLUTION: The power supply for a dynamic random access memory is equipped with multiple array blocks and multiple pads arranged in the center of the multiple array blocks, arranged near the multiple pads and equipped with multiple voltage source for generating the supply voltage to the multiple array blocks. The multiple voltage source is equipped with a voltage regulator having multiple power amplifiers, and at least one power amplifier is related with each of the multiple array blocks. In order to attain the setup output power level, the multiple voltage sources include voltage pumps having multiple voltage pump circuits divided into multiple groups for performing either of separate or simultaneous operation. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To decrease a leakage current at the time of standby due to short circuit of a row and a column in a semiconductor memory chip. SOLUTION: In the case of a row of a memory pre-charged to negative word line voltage (VNWL), that is a word line, when a gate of an insulation (ISO) transistor connected to the short-circuited word line and digit line is held at the VNWL level by an insulation signal driven to the VNWL level during a standby state of the row of the memory, the leakage current at the time of standby passing through a P sense amplifier in the memory is almost prevented. Since the leakage current at the time of standby is decreased, whole consumption of a current Icc is decreased from supply voltage of operation voltage of a memory circuit, thereby, power consumption of the circuit at the time of standby is decreased. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To realize a high-density memory by an economical method. SOLUTION: This dynamic random memory is provided with a plurality of independent arrays constituted of memory cells and having digit lines extending therethrough, and a plurality of peripheral devices for writing/reading data in the memory cells. The peripheral device is provided with a plurality of sense amplifiers for sensing signals on the digit lines. The sense amplifier is provided with a plurality of peripheral devices controlled by a control signal larger than a data signal written in the memory cell, a power source for generating a plurality of supply voltages, and a power distribution bus for supplying the plurality of supply voltages to the plurality of independent arrays and the peripheral devices. COPYRIGHT: (C)2006,JPO&NCIPI