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公开(公告)号：JP2002313549A
公开(公告)日：2002-10-25
申请号：JP2001114290
申请日：2001-04-12
Inventor： KEIO SUSUMU , ASAI YASUHIRO
Abstract: PROBLEM TO BE SOLVED: To provide a cooking method and device, and a container used for the same that heats cooked food, such as in-flight food in an aircraft or hospital food, to a temperature suitable for a meal. SOLUTION: In this electromagnetic cooking method, cooked food cooked and held to a prescribed low temperature is put in a cooked food container formed of a non-electromotive material even if receiving magnetism, and provided with a magnetic electromotive thin foil. The cooked food container is placed on a heating coil which generates high electromagnetic force by high frequency power of prescribed frequency, and the high frequency power is supplied to the heating coil to excite and heat the magnetic electrogenic thin foil to thereby heat the cooked food.
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公开(公告)号：JP2002141162A
公开(公告)日：2002-05-17
申请号：JP2000333588
申请日：2000-10-31
Applicant: SEKISUI PLASTICS , OCTEC INC
Inventor： KOBAYASHI HIDEKAZU , YAMAGUCHI TETSUO , NISHI TETSUYA , KATSUTA NAOKI , ISHIMORI FUMITAKA , ASAI YASUHIRO
Abstract: PROBLEM TO BE SOLVED: To provide a hot heat generating body and its manufacturing method stably, quickly, and surely providing the thin-type hot heat generating body capable of swiftly heating the surface in a uniform hot heat state. SOLUTION: This manufacturing method for the hot heat generating body is characterized in that multiple belt-shaped metal foil materials composed of austenitic alloy steel are disposed in parallel to each other, multiple sets of connecting metal foil materials are parallel disposed at prescribed intervals in such states as crossing over the respective belt-shaped metal foil materials, intersections between the respective belt-shaped metal foil materials and the respective connecting metal foil materials are joined by a laser welding method from the insulating resin film material, and then holes are formed on the respective belt-shaped metal foil materials and also formed between the connecting metal foil materials in alternate positions on the connecting metal foil materials, which are covered with the insulating resin film materials in such a state as clamping it from the vertical directions and cut in the center of the respective connecting metal foil materials.
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公开(公告)号：JP2002216544A
公开(公告)日：2002-08-02
申请号：JP2001008457
申请日：2001-01-17
Applicant: HAKKO SEIKI KK , OCTEC INC
Inventor： ASAI YASUHIRO , GOTO YASUSHI
Abstract: PROBLEM TO BE SOLVED: To provide an electric wire adjusted to the thickness of a flat heater and a connector for the electric wire. SOLUTION: A plurality of flat metal tapes 6 is arranged in parallel with predetermined insulation interval d and processed by laminating electric insulating layers on both sides with a synthetic resin film 7a to obtain a flat wire 7. A flat connector 5 can be easily assembled by sandwiching the flat electric wire 7 between flat board-like connector materials 51, 52 of two board combinations and a projection 55 penetrate into a small hole h of the film 7a part.
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公开(公告)号：JP2002022191A
公开(公告)日：2002-01-23
申请号：JP2000204238
申请日：2000-07-05
Applicant: SEKISUI CHEMICAL CO LTD , SEKISUI PLASTICS , OCTEC INC
Inventor： GOTO YASUSHI , KOBAYASHI HIDEKAZU , ASAI YASUHIRO
Abstract: PROBLEM TO BE SOLVED: To provide a heating floor which can simply floor-heat only a required section and can be constructed simply. SOLUTION: A heating floor 1 is composed of a heating panel 6 which is laid on the required section of a subfloor and consists of a base material 4 and a planar heating element 3 stacked on the surface of that base material 4, a peripheral panel 5 which is laid around the heating panel 6 and is as thick as the heating panel 6, and a surface finishing material 2 which is laid over the surfaces of these heating panel 6 and peripheral panel 5. Then, a groove 5a is made in the peripheral panel 5, and a power supply cable 8 which connects a controller 9 with the planar heating element 3 of the heating panel 6 is stored in the groove 5a of the peripheral panel 5.
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公开(公告)号：JP2002022190A
公开(公告)日：2002-01-23
申请号：JP2000207787
申请日：2000-07-10
Applicant: SEKISUI CHEMICAL CO LTD , SEKISUI PLASTICS , OCTEC INC
Inventor： GOTO YASUSHI , KOBAYASHI HIDEKAZU , ASAI YASUHIRO
Abstract: PROBLEM TO BE SOLVED: To efficiently heat the floor of the whole room with small power consumption. SOLUTION: A heating floor is composed of a plurality of heating panels 5 which are laid in matrix form on a subfloor and consist of heat insulating materials and planar heating elements stacked on the surfaces of those heat insulating materials, and surface finishing materials which are laid on the surfaces of the heating panels 5. Then, the plural pieces of heating panels 5 are divided into a heating panel group A and a heating panel group B, and also power supply cables CA and CB of separate systems are connected, respectively, to the heating panel group A and the heating panel group B being divided, and the floor heating by the heating group A and that by the heating group B are performed alternately.
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Patent Agency Ranking
公开(公告)号：JP2002308107A
公开(公告)日：2002-10-23
申请号：JP2001114282
申请日：2001-04-12
Inventor： KEIO SUSUMU , ASAI YASUHIRO
Abstract: PROBLEM TO BE SOLVED: To provide an electromagnetic heating device capable of simultaneously heating a plurality of plates, cups, etc., on/in which foods are put to the temperatures to suit respective food materials. SOLUTION: The electromagnetic heating device includes a service cart 1 fitted internally with a plurality of supports 1b in stages, a tray 11 to be placed on any support 1b, and plates or cups 12, wherein each tray 11 is equipped with a heater coil 14, while each plate/cup 12 is equipped with a heat emitter 12b to emit heat upon receiving a electromagnetic force generated by the heater coil 14, and when the tray 11 with food 12 is placed on any support 1b of the service cart 1. an electric circuit is formed between the heater coil 14 and service cart 1, wherefrom 1 a high frequency current is supplied to the coil 14 to allow the heat emitter 12b to emit heat, and therewith the plate/cup 12 is heated.
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公开(公告)号：JP2002162047A
公开(公告)日：2002-06-07
申请号：JP2000357049
申请日：2000-11-24
Applicant: SEKISUI CHEMICAL CO LTD , SEKISUI PLASTICS , OCTEC INC
Inventor： KOBAYASHI SATOYUKI , KOBAYASHI HIDEKAZU , ASAI YASUHIRO
Abstract: PROBLEM TO BE SOLVED: To provide a system for temperature control of heating-unit panel, in which surface temperature control of a floor surface material can be done directly and with a quick response in a floor heating system, etc., and an easy manufacture and economical constitution can be effected. SOLUTION: In this system 1, a heating unit panel 2 is formed of a sheet- shaped heating unit 4 provided on the surface of a base 3 made of an heat- installation material as a principal material. A temperature sensor 6 for controlling temperature of the heating unit 4 is installed on the surface of a soaking material 5 laminated on the surface of the heating unit 4.
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公开(公告)号：JP2002071152A
公开(公告)日：2002-03-08
申请号：JP2000260062
申请日：2000-08-30
Applicant: SEKISUI CHEMICAL CO LTD , SEKISUI PLASTICS , OCTEC INC
Inventor： YAMAMOTO SATORU , KOBAYASHI HIDEKAZU , ASAI YASUHIRO
Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive floor heating panel exhibiting excellent soundproof performance and walking feeling and suitable for reform. SOLUTION: The floor heating panel comprises a planar body 2, a planar heater 3, a foamed hard resin 4, and a foamed soft resin 5 laid sequentially in layers from the surface side and has total thickness of 7-25 mm. Assuming the thickness of the planar body 2 is 1, thickness of the planar heater 3 is set in the range of 0.02-0.25, thickness of the foamed hard resin 4 is set in the range of 1-5, and thickness of the foamed soft resin 5 is set in the range of 0.2-2.5.
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公开(公告)号：JP2002013752A
公开(公告)日：2002-01-18
申请号：JP2000196158
申请日：2000-06-29
Applicant: SEKISUI CHEMICAL CO LTD , SEKISUI PLASTICS , OCTEC INC
Inventor： GOTO YASUSHI , KOBAYASHI HIDEKAZU , ASAI YASUHIRO
IPC: F24D13/02
Abstract: PROBLEM TO BE SOLVED: To improve workability and soundproofing effect. SOLUTION: In a floor heating panel 1 where a metal thin sheet 2 (or metal foil), planar heating element 3, and a heat insulation member 4 are arranged in this order from a surface side, the panel is adapted to have flexibility in itself, and bending elastic modulus of the whole panel is set less than 294 Mpa (a value measured following JIS K7203) and compression elastic modulus is more than 0.392 Mpa (a value measured following JIS K7220). Hereby, running-in of a floor base is improved, and sinking in walking and so on is prevented.
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公开(公告)号：JP2006186199A
公开(公告)日：2006-07-13
申请号：JP2004379922
申请日：2004-12-28
Applicant: IBIDEN CO LTD , OCTEC INC
Inventor： INAGAKI YASUSHI , ICHIKAWA SHINICHIRO , OKUMURA KATSUYA
IPC: H05K3/46
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board in which an undercut is not generated at an opening of a resin insulating layer. SOLUTION: Other parts than the opening forming part 250B of an uncured solder resist layer 250 are exposed Fig.10(A). At this time, the curing level of the solder resist layer 250 is left at a level where it can not withstand development. Then, the solder resist layer 250 is heated Fig.10(B). At this time, the parts other than the opening forming part 250B of the solder resist layer 250 are cured to a level where it can withstand development, with the curing level of the opening forming part 250B being left at a level where it can be removed by development. Then, development processing is performed to dissolve and remove the uncured opening forming part 250B and form an opening 251 Fig.10(C). COPYRIGHT: (C)2006,JPO&NCIPI
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