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公开(公告)号：JP2004179639A
公开(公告)日：2004-06-24
申请号：JP2003375076
申请日：2003-11-05
Inventor： SZWARC JOSEPH , GOLDSTEIN REUVEN
CPC classification number: H01C17/07 , H01C7/06 , Y10T29/49082 , Y10T29/49085 , Y10T29/49099 , Y10T29/49101
Abstract: PROBLEM TO BE SOLVED: To obtain a resistor which has very small variations depending on the power and is suitable as a high-precision power resistor for electric current detection. SOLUTION: This high-precision power resistor which has small variations in resistance which depend on power, is equipped with a substrate, having a first flat surface and a second flat surface which face each other and respectively have a predetermined shape and a predetermined composition, and a first resistive foil, which is bonded to one of the flat surfaces with a bonding agent and has a low TCR of approximately 0.1 ppm/°C, to approximately 1 ppm/°C and a thickness of approximately 0.03 mils to approximately 0.7 mils. The first resistive foil is patterned so as to give the desired resistance. The modulus of elasticity of a substrate is set to, approximately 10×10 6 psi to approximately 100×10 6 psi, and the substrate thickness is set to approximately 0.5 mils to approximately 200 mils. The type of the resistive foil, pattern, and bonding agent, the bonding agent thickness, and the substrate should be selected so as to produce cumulative effects on the reduction of variations in the resistance due to the power. This invention is for a manufacturing method of high-precision power resistors. COPYRIGHT: (C)2004,JPO
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公开(公告)号：JP2012028800A
公开(公告)日：2012-02-09
申请号：JP2011206477
申请日：2011-09-21
Inventor： HAIM GOLDBERGER , RUBEN CASTILLO , GOSELEY DORON
CPC classification number: H01G4/228 , H01G4/33 , H01L2224/11
Abstract: PROBLEM TO BE SOLVED: To provide technology of forming a high frequency capacitor on a semiconductor substrate in order to package a bottom electrode element so that the inclination thereof is reduced, with regard to the packaging technology of the electronic component of a bottom electrode element.SOLUTION: The capacitor comprises a substrate 38 having a first principal surface and a second principal surface, a dielectric layer 48 which is laminated on the first principal surface of the substrate, a first electrode 44, and a second electrode 46. A passivation layer 34 is laminated on the first electrode and second electrode. A first opening is formed in the passivation layer on the first electrode, and a second opening is formed in the passivation layer on the second electrode. A first bottom electrode termination 14 is provided in the first opening, and a second bottom electrode termination 16 is provided in the second opening. A standoff 18 is provided between the first bottom electrode termination and second bottom electrode termination, and attached to the passivation layer so that it serves as a support of an electronic component at the time of packaging. Since there is a standoff, the element does not tilt.
Abstract translation: 要解决的问题：为了提供在半导体衬底上形成高频电容器的技术，以便封装底部电极元件以使其倾斜度减小，关于底部电子元件的封装技术 电极元件。 解决方案：电容器包括具有第一主表面和第二主表面的基板38，层压在基板的第一主表面上的电介质层48，第一电极44和第二电极46。 钝化层34层叠在第一电极和第二电极上。 在第一电极上的钝化层中形成第一开口，并且在第二电极上的钝化层中形成第二开口。 第一底部电极端子14设置在第一开口中，第二底部电极端子16设置在第二开口中。 间隔件18设置在第一底部电极端子和第二底部电极端子之间，并附接到钝化层，使得其在包装时用作电子部件的支撑件。 由于有一个对立，元素不会倾斜。 版权所有（C）2012，JPO＆INPIT
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公开(公告)号：JP4162572B2
公开(公告)日：2008-10-08
申请号：JP2003375076
申请日：2003-11-05
Inventor： ロイヴァン ゴールドスタイン , ズウァーク，ジョセフ
CPC classification number: H01C17/07 , H01C7/06 , Y10T29/49082 , Y10T29/49085 , Y10T29/49099 , Y10T29/49101
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公开(公告)号：JP2004519858A
公开(公告)日：2004-07-02
申请号：JP2002574675
申请日：2001-03-20
Inventor： アロンソン，イリヤ , ズウァーク，ジョセフ
Abstract: 【課題】精度、安定性および電力操作などの特性が改善され、生産コストも小さい精密表面搭載型ホイルレジスターを提供する。
【解決手段】このレジスターは平坦な上面および底面並びに両端を有する基板を具備してなる。 更に、抵抗ホイルが基板の平坦底面に固定され、該平坦底面に亘って広がっている。 非導電性の曲げプロテクタープレート部材が上記抵抗ホイル上に積層されている。 半田部材が抵抗ホイルの少なくとも２つの領域に設けられ、印刷回路基板と電気的に接触している。 この曲げプロテクターは半田部材接触領域より大きい厚みを有し、これら半田部材間に設けられている。
【選択図】図２-
公开(公告)号：JPS56100054A
公开(公告)日：1981-08-11
申请号：JP11918079
申请日：1979-09-17
Applicant: VISHAY INTERTECHNOLOGY INC
Inventor： MIRUSEA ARUKAN , BENEDEIKUTO HAINRITSUHI
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Patent Agency Ranking
公开(公告)号：JP2013080952A
公开(公告)日：2013-05-02
申请号：JP2012280566
申请日：2012-12-25
Applicant: Vishay Intertechnology Inc , ヴィシェイ インターテクノロジー インコーポレイテッド
Inventor： BERMAN MICHAEL , LEONID AKHTMAN
CPC classification number: H01C1/034 , H01C17/288
Abstract: PROBLEM TO BE SOLVED: To provide a chip resistor with sulfuration resistance.SOLUTION: The chip resistor according to the present invention comprises: an insulation substrate 11; an upper terminal electrode 12 formed on an upper face of the substrate using silver-based cermet; a resistance element 14 positioned between a bottom electrode 13 and the upper terminal electrode 12 and partially overlaid on them; an optional inner protective coating 15 completely or partially covering the resistance element 14; an outer protective coating 16 completely covering the inner protective coating 15 and partially covering the upper terminal electrode 12; a nickel plating layer 17 covering an end face of the substrate, the upper electrode 12 and the bottom electrode 13 and partially overlaid on the outer protective coating 16; and a finish plating layer 18 covering the nickel layer 17. The nickel layer 17 is overlaid on the outer protective coating 16, and so an edge of the outer protective coating 16 can be plated before a nickel plating process, so as to provide a sealing characteristic.
Abstract translation: 要解决的问题：提供具有耐硫化性的片式电阻器。 解决方案：根据本发明的芯片电阻器包括：绝缘基板11; 使用银基金属陶瓷在基板的上表面上形成的上端子电极12; 位于底部电极13和上部端子电极12之间并部分地覆盖在其上的电阻元件14; 完全或部分地覆盖电阻元件14的可选内部保护涂层15; 完全覆盖内保护涂层15并部分地覆盖上端子电极12的外保护涂层16; 覆盖基板的端面的镍镀层17，上电极12和底电极13，并且部分地覆盖在外保护涂层16上; 以及覆盖镍层17的精加工镀层18.镍层17覆盖在外保护涂层16上，因此可以在镀镍工艺之前对外保护涂层16的边缘进行电镀，以提供密封 特性。 版权所有（C）2013，JPO＆INPIT
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7.发明专利Rf modem utilizing saw device with pulse shaping and programmable frequency synthesizer 有权RF调制解调器利用脉冲形状和可编程频率合成器的SAW器件
公开(公告)号：JP2013059073A
公开(公告)日：2013-03-28
申请号：JP2012236548
申请日：2012-10-26
Applicant: Vishay Intertechnology Inc , ビシェイ インターテクノロジー, インコーポレイテッド
Inventor： DAVID BEN-BASSAT
IPC: H04B1/40
CPC classification number: H04B1/70712 , H04B1/7093
Abstract: PROBLEM TO BE SOLVED: To provide an RF modem which has frequency agility, is simple to implement, and can be constructed at low cost and small size.SOLUTION: A bidirectional direct sequence spread spectrum half-duplex RF modem for transmitting and receiving analog and digital pulse modulation incorporates a SAW based correlator for performing the spreading and de-spreading functions in the transmitter and receiver. A programmable frequency synthesizer provides the frequency source for various signals in the modem including a local oscillator (LO), IF interrogating pulse and clock signals. An upconverter/downconverter provides frequency translation to a desired frequency band. Pulse gating and interrogating pulse shaping reduce the spectral side bands of a transmitted spread pulse. The RF modem operates as an analog or digital pulse transmitter and receiver and is applicable in data communication systems such as OOK, PWM and PPM.
Abstract translation: 要解决的问题：提供具有频率敏捷性的RF调制解调器，易于实现，并且可以以低成本和小尺寸构造。 解决方案：用于发送和接收模拟和数字脉冲调制的双向直接序列扩频半双工RF调制解调器包含一个基于SAW的相关器，用于在发射机和接收机中执行扩展和解扩功能。 可编程频率合成器为调制解调器中的各种信号提供频率源，包括本地振荡器（LO），IF询问脉冲和时钟信号。 上变频器/下变频器提供频率转换到期望的频带。 脉冲门控和询问脉冲整形减少了发射扩展脉冲的频谱边带。 RF调制解调器作为模拟或数字脉冲发射器和接收器工作，适用于数据通信系统，如OOK，PWM和PPM。 版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JP2021519511A
公开(公告)日：2021-08-10
申请号：JP2020551524
申请日：2019-03-29
Applicant: ヴィシャイ インターテクノロジー,インコーポレイテッド , VISHAY INTERTECHNOLOGY,INC.
Inventor： ツァン,クーン−ウィン , リン,ユウ−ミン
IPC: H01L31/0232 , H04N5/33 , H04N5/369 , H04N9/07 , G01J1/02 , G01J1/04 , G01J3/26 , G01J3/36 , H01L27/146
Abstract: 【構成】本開示は光学デバイスに関し、前記光学デバイスは、複数の第1のフォトダイオードを含むフォトダイオードアレイであって、前記第1のフォトダイオードは各々n+領域およびnウェル領域を含むフォトダイオードアレイと、前記フォトダイオードアレイ上に配置されたガイドアレイであって、前記ガイドアレイは、遮光材料の層によって互いに分離された複数のガイド部材を含み、前記ガイド部材は、各ガイド部材が異なるn+領域上に配置されるように前記第1のフォトダイオードの前記n+領域と整列し、前記遮光材料の層は、前記第1のフォトダイオードの前記nウェル領域と整列したガイドアレイと、前記ガイドアレイ上に配置されたフィルタアレイであって、前記フィルタアレイは複数のバンドパスフィルタを含み、各バンドパスフィルタは複数のガイド部材のうちの異なる1つと整列し、各バンドパスフィルタは異なる通過帯域を有するフィルタアレイと、を具備する。 【選択図】図20B
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公开(公告)号：JP5237422B2
公开(公告)日：2013-07-17
申请号：JP2011206477
申请日：2011-09-21
Inventor： ゴールドバーガー，ハイム , リューヴァン カトラロ , ドロン ゴザリー，
IPC: H01G4/06
CPC classification number: H01G4/228 , H01G4/33 , H01L2224/11
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公开(公告)号：JP5096461B2
公开(公告)日：2012-12-12
申请号：JP2009509537
申请日：2006-08-18
Inventor： ゴールドバーガー，ハイム , リューヴァン カトラロ , ドロン ゴザリー，
IPC: H01G4/33 , H01G2/06 , H01L21/822 , H01L27/04
CPC classification number: H01G4/228 , H01G4/33 , H01L2224/11
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