公开(公告)号：WO0139922B1

公开(公告)日：2001-11-15

申请号：PCT/US0032720

申请日：2000-12-01

Applicant: FRYS METALS INC DBA ALPHA METALS INC

Inventor： ARORA SANYOGITA ,  SCHNEIDER ALVIN F ,  TELLEFSEN KAREN A

IPC: B23K1/00 ,  B23K3/00 ,  B23K35/36 ,  B23K35/363 ,  B23K101/42 ,  H05K3/28 ,  H05K3/34

CPC classification number: B23K35/3613 ,  B23K35/3616 ,  B23K35/3618 ,  H05K3/282 ,  H05K3/3489 ,  Y10T428/31678 ,  Y10T428/31714

Abstract: A soldering flux includes a non-acidic resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board.

Abstract translation: 助焊剂包含含水组合物中的非酸性树脂。 助焊剂还可以包含活化剂和促进表面润湿的表面活性剂。 该助焊剂可用于涂覆电路和印刷电路板。

公开(公告)号：WO0187535A3

公开(公告)日：2002-04-04

申请号：PCT/US0140518

申请日：2001-04-13

Applicant: FRYS METALS INC DBA ALPHA METALS INC

Inventor： ARORA SANYOGITA ,  MO BIN

IPC: B23K1/00 ,  B23K3/00 ,  B23K35/36 ,  B23K35/363

CPC classification number: B23K35/3612 ,  B23K35/3618

Abstract: A soldering flux includes a solvent, an activator in the solvent, and cationic and nonionic surfactants. The soldering flux can be applied to a substrate, such as a printed circuit board before solder is applied.

Abstract translation: 助焊剂包括溶剂，溶剂中的活化剂，以及阳离子和非离子表面活性剂。 在施加焊料之前，可以将焊剂施加到诸如印刷电路板的基板上。

公开(公告)号：DE60022223D1

公开(公告)日：2005-09-29

申请号：DE60022223

申请日：2000-12-01

Applicant: FRYS METALS INC DBA ALPHA METALS INC

Inventor： ARORA SANYOGITA ,  SCHNEIDER F ,  TELLEFSEN A

IPC: B23K1/00 ,  B23K3/00 ,  B23K35/36 ,  B23K35/363 ,  B23K101/42 ,  H05K3/28 ,  H05K3/34

Abstract: A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-acidic and/or in an emulsified form.

公开(公告)号：JP2011252171A

公开(公告)日：2011-12-15

申请号：JP2011193376

申请日：2011-09-05

Applicant: Fry's Metals Inc Doing Business As Alpha Metals Inc ,  フライズ・メタルズ・インコーポレーテッド・ドゥーイング・ビジネス・アズ・アルファ・メタルズ・インコーポレーテッド

Inventor： ARORA SANYOGITA ,  MO BIN

IPC: B23K1/00 ,  C11D1/62 ,  B23K3/00 ,  B23K35/36 ,  B23K35/363 ,  C11D1/66 ,  C11D3/43

CPC classification number: B23K35/3612 ,  B23K35/3618

Abstract: PROBLEM TO BE SOLVED: To provide a soldering flux composition which effectively prepares surfaces to be joined and which reduces the number of solder balls and solder bridges by reducing surface tension between printed circuit board surfaces, component leads/terminations and a molten solder without increasing the amount of visible residues.SOLUTION: A soldering flux includes a solvent, an activator in the solvent and cationic and nonionic surfactants. The soldering flux can be applied onto a substrate such as a printed circuit board before solder is applied. The fluxes providing reduced micro-solder balls, low residues, low solids and no-clean capability are described in this specification. In one embodiment, the solvent is an alcohol such as isopropyl alcohol. The cationic surfactant can be a quaternary ammonium fluoroalkyl surfactant.

Abstract translation: 要解决的问题：提供一种有助于准备要接合的表面的焊剂组合物，并且通过降低印刷电路板表面之间的表面张力，部件引线/端接和熔融焊料来减少焊球和焊料桥的数量 而不增加可见残留物的量。 解决方案：助焊剂包括溶剂，溶剂中的活化剂和阳离子和非离子表面活性剂。 在施加焊料之前，焊剂可以施加到诸如印刷电路板的基板上。 在本说明书中描述了提供减少的微焊球，低残留物，低固体和无清洁能力的焊剂。 在一个实施方案中，溶剂是醇，例如异丙醇。 阳离子表面活性剂可以是季铵氟烷基表面活性剂。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2011212748A

公开(公告)日：2011-10-27

申请号：JP2011123827

申请日：2011-06-01

Applicant: Fry's Metals Inc Doing Business As Alpha Metals Inc ,  フライズ・メタルズ・インコーポレーテッド・ドゥーイング・ビジネス・アズ・アルファ・メタルズ・インコーポレーテッド

Inventor： ARORA SANYOGITA ,  SCHNEIDER ALVIN F ,  TELLEFSEN KAREN A

IPC: B23K1/00 ,  B23K35/363 ,  B23K3/00 ,  B23K35/36 ,  B23K101/42 ,  H05K3/28 ,  H05K3/34

CPC classification number: B23K35/3613 ,  B23K35/3616 ,  B23K35/3618 ,  H05K3/282 ,  H05K3/3489 ,  Y10T428/31678 ,  Y10T428/31714

Abstract: PROBLEM TO BE SOLVED: To provide a soldering flux that can be used for flux coating when soldering electronic assemblies such as printed wiring assemblies.SOLUTION: The soldering flux includes a non-acidic resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat a circuit and a printed circuit board. There is also disclosed a method for treating the printed circuit board including the steps of: providing the printed circuit board; and applying an aqueous flux including a non-acidic resin onto a surface of the printed circuit board to form a flux coating on the surface.

Abstract translation: 要解决的问题：提供在焊接诸如印刷线路组件的电子组件时可用于焊剂涂布的焊剂。解决方案：助焊剂包括水性组合物中的非酸性树脂。 助熔剂还可以包括促进表面润湿的活化剂和表面活性剂。 焊剂可用于涂覆电路和印刷电路板。 还公开了一种处理印刷电路板的方法，包括以下步骤：提供印刷电路板; 以及将包含非酸性树脂的水性助焊剂涂布在印刷电路板的表面上以在表面上形成焊剂涂层。

公开(公告)号：BR0110075A

公开(公告)日：2003-06-24

申请号：BR0110075

申请日：2001-04-13

Applicant: FRYS METALS INC DBA ALPHA METALS INC

Inventor： ARORA SANYOGITA ,  MO BIN

IPC: B23K1/00 ,  B23K3/00 ,  B23K35/36 ,  B23K35/363 ,  B23K35/00

Abstract: A soldering flux includes a solvent, an activator in the solvent, and cationic and nonionic surfactants. The soldering flux can be applied to a substrate, such as a printed circuit board before solder is applied.

公开(公告)号：AT302666T

公开(公告)日：2005-09-15

申请号：AT00980918

申请日：2000-12-01

Applicant: FRYS METALS INC DBA ALPHA METALS INC

Inventor： ARORA SANYOGITA ,  SCHNEIDER ALVIN F ,  TELLEFSEN KAREN A

IPC: B23K1/00 ,  B23K3/00 ,  B23K35/36 ,  B23K35/363 ,  B23K101/42 ,  H05K3/28 ,  H05K3/34

Abstract: A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-acidic and/or in an emulsified form.

公开(公告)号：CA2405957A1

公开(公告)日：2001-11-22

申请号：CA2405957

申请日：2001-04-13

Applicant: FRYS METALS INC DBA ALPHA METALS INC

Inventor： MO BIN ,  ARORA SANYOGITA

IPC: B23K1/00 ,  B23K3/00 ,  B23K35/36 ,  B23K35/363

Abstract: A soldering flux includes a solvent, an activator in the solvent, and cation ic and nonionic surfactants. The soldering flux can be applied to a substrate, such as a printed circuit board before solder is applied.

公开(公告)号：CA2393399A1

公开(公告)日：2001-06-07

申请号：CA2393399

申请日：2000-12-01

Applicant: FRYS METALS INC DBA ALPHA METALS INC

Inventor： ARORA SANYOGITA ,  TELLEFSEN KAREN A ,  SCHNEIDER ALVIN F

IPC: B23K1/00 ,  B23K3/00 ,  B23K35/36 ,  B23K35/363 ,  B23K101/42 ,  H05K3/28 ,  H05K3/34

Abstract: A soldering flux includes a non-acidic resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printe d circuit board.

公开(公告)号：CA2393399C

公开(公告)日：2011-11-22

申请号：CA2393399

申请日：2000-12-01

Applicant: FRY S METALS INC D B A ALPHA METALS

Inventor： ARORA SANYOGITA ,  SCHNEIDER ALVIN F ,  TELLEFSEN KAREN A

IPC: B23K1/00 ,  B23K35/363 ,  B23K3/00 ,  B23K35/36 ,  B23K101/42 ,  H05K3/28 ,  H05K3/34

Abstract: A soldering flux includes a non-acidic resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board.