Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus and method capable of removing, or relaxing increase of overlay errors of patterns. SOLUTION: The lithographic method for providing an alignment mark onto a layer provided on a substrate is disclosed. The method includes providing the alignment mark to a region aligned within a specific angle range to a surface of the substrate having the layer provided thereon. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method by which a portion with no resist around an outside region of a substrate is provided in the shape of a continuous ring. SOLUTION: Ultraviolet rays radiant port UVS irradiates a region of a resist 1 already exposed by i-line ultraviolet radiation, and also a portion of a resist R surrounding the region 1 which was irradiated before. The resist R is irradiated by deep ultraviolet radiant rays, by which a layer 3 is formed. This layer 3 is a polymerized layer formed by cross-linking between other processes. An ICA in the resist R forms ester with a Novolak structure. A remained PAC polymer forms bonding with the Novolak structure (for example, a vulcanization process is caused). The polymerized layer 3 is not dissolved in MIB developer or MIF developer. Moreover, the polymerized layer 3 becomes insensitive to ultraviolet rays. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithography apparatus and a method of performing the calibration of position of a substrate effectively. SOLUTION: The method includes a step of guiding the substrate into the prealigner of the lithography apparatus, a step of using a detector to measure the position of an alignment mark formed on the substrate being in the opposite side to the position of the detector, and a step of mounting the substrate on a substrate table of the lithography apparatus after the measurement, in which the substrate is positioned on the substrate table so that the alignment mark formed on the side opposite to the substrate can be visible through the window of the substrate table. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithography device capable of producing an alignment marker on the rear side of a substrate. SOLUTION: The lithography device is provided with an enclosure for forming a closed environment locally on the rear surface of the substrate, a seal for enclosing tightly the closed environment between the enclosure and the substrate, resist supplying systems (12, 13) for supplying resist, developing systems (14, 15) for supplying developer, and etching systems (16, 17) for etching one or a plurality of markers locally or the like. Further, a mask positioning system and an exposure system are provided also. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus reducing latent adverse effect of liquid drops remained on a substrate table after light-exposure of a substrate. SOLUTION: The lithographic apparatus having a table including a target and/or a sensor and a liquid displacement device displacing a liquid from the target and/or the sensor using a localized gas flow is disclosed. The liquid displacement device can be disposed at various positions. For example, the liquid displacement device can be mounted on a liquid handling device at a light-exposure station and can be disposed adjacent to a transfer passage between the light-exposure station and a measuring station or adjacent to a load/unload station or the sensor in the transfer passage. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide lithographic apparatus and/or controller, capable of reducing or removing the variations in a critical dimension (CD) over the entire substrate having a pattern. SOLUTION: A lithography method includes a step of obtaining a temperature as a function of time, in a bake step after exposure for a different location on a testing substrate on which a chemistry amplification resist is coated. A relation between a dose of radiation on the chemistry amplification resist and a density after exposure of an accelerator generated in a resist layer is acquired. The dose of radiation for obtaining a designated CD is calculated, by using a model for relating the CD with the density after exposure of accelerator and relating the CD with the temperature as a function of time over the entire location. A substrate which is the same as the testing substrate is patterned, by using the dosage of radiation calculated for each of different locations on the substrate. By using this method, uniformity of the CD over the entire substrate with a pattern can be improved. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To accurately measure the position of an alignment mark located at a lower surface of a substrate. SOLUTION: A lithography alignment apparatus includes a radiation source constructed to generate radiation of 1,000 nm or a plurality of wavelengths longer than 1,000 nm; a control system 11 constructed to select one or plural infrared ray wavelengths; and a plurality of non focusing detector 15 constructed such that after the radiation is reflected by an alignment mark, a diffraction grating is provided, at least part of the diffraction grating has different diffraction grating periods to detect the radiation. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To perform alignment with high accuracy. SOLUTION: A lithography method includes patterning a radiation beam by a pattering device. The patterning device includes at least two image patterning portions and at least two methodology mark patterning portions. The method includes successively projecting at least two image portions of a patterned radiation beam on the target potion of a substrate so that projected image portions are mutually adjoining on the substrate to form a combined image collectively on the substrate. The method includes projecting at least two images respectively, and projecting the methodology mark on the substrate at the same time in the region outside of the combined image to measure the alignment of the methodology mark to define the relative position of at least two figure portions. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a new device and a method for attaching a substrate to a substrate carrier. SOLUTION: An exposure device includes a substrate carrier SC arranged to hold the substrate in an appropriate position using an electrostatic force. The substrate W is placed in contact with an upper end of a protrusion 1 of the substrate carrier SC. A potential difference is set between a metal layer 4 and a diamond-like carbon layer 2, and the electrostatic force for holding the substrate W in the appropriate position, is generated at the protrusion 1. The substrate carrier is formed integrally with a power source, and the device also includes a substrate table for holding the substrate carrier. COPYRIGHT: (C)2007,JPO&INPIT