Abstract:
PROBLEM TO BE SOLVED: To provide a method and apparatus for compensating or reducing errors caused when searching TIS and/or the center of a pupil plane without any large increase in throughput time. SOLUTION: In a method of measuring asymmetry in a scatterometer, a target portion is illuminated twice, first with 0° of substrate rotation and secondly with 180°of substrate rotation. One of those images is rotated and then that rotated image is subtracted from the other image. In this way, the asymmetry of the scatterometer can be corrected. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an improved method for detecting an overlay error. SOLUTION: A first layer of a substrate includes a plurality of diffraction gratings each having the periodicity of P. A second layer of the substrate includes a plurality of diffraction gratings that overlap a first set of diffraction gratings and having the periodicity of NP (here, N is two or greater integer). The first set of diffraction gratings have a bias +d and a second set of diffraction gratings have a bias -d. Radiation beams are projected to the diffraction gratings and an angular resolution spectrum of the reflected radiation is detected. Next, an overlay error is calculated using the angular resolution spectrum of the reflected radiation. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a compound alignment overlay target given on the substrate so as to enable the measurement of the alignment of a substrate to surroundings and the measurement of the relative alignment of a series of layers on the substrate. SOLUTION: The target is provided with an array of a structure at substantially equal intervals except a part of a structure which is an offset with the same size to a first direction and a second part of a structure which is an offset with the same size to the opposite direction. The target on the substrate can be used for the measurement of the alignment, and the same target, which is given to the second layer superimposed on the first layer, can be used for the measurement of the overlay. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of correcting accurately the errors caused by an alignment discrepancy generated when performing the alignment of a substrate after its processing, even though no calibrating measurement extending over a wide range is performed. SOLUTION: During manufacturing a device, a beam of radiation is projected onto a substrate via a mask. The substrate is aligned with the mask by using an alignment structure on the substrate. The characteristic of the light reflected by the alignment structure is used for determining the relative position of the substrate. The preceding processing of the substrate generates potentially errors in the position determined by the reflection light. The measurement of the characteristic of the reflection light is used for determining the correcting extent required to correct the errors generated by the processing of the substrate. Preferably, the parameters of a physical model of the alignment structure may be estimated from the reflection light, and it is preferred to use them for determining the corrections of the errors. Preferably, it is preferred to measure a plurality of amplitudes of different diffraction peaks for determining the corrections of the errors. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method of identifying a false low overlay calculation. SOLUTION: Both the first and the 0-th order of diffraction are detected with a scatterometer. The first order of diffraction is used to detect an overlay error. Then, if this is a false overlay error calculation of magnitude greater than the bias but smaller than the pitch of the diffraction grating, then, the 0-th order of diffraction is used to flag. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a simple, alternative method decreasing an influence due to the asymmetric diversity of a sensor. SOLUTION: A test system projects multiple radiation beams with different wavelengths and/or polarized radiations onto two targets. A first radiation beam is projected onto a first target to detect a reflected radiation A 1+ . The first target contains two diffraction gratings each of which has a bias of +d for the other. The first radiation beam is also projected onto a second target which contains two diffraction gratings each of which has a bias of -d for the other to detect a reflected radiation A 1- . A second radiation beam with a wavelength and/or a polarized radiation different from those of the first radiation beam is projected onto the first target to detect a reflected radiation A 2+ . The second radiation beam is also projected on the second target to detect a reflected radiation A 2- . The detected radiations A 1+ , A 1- , A 2+ and A 2- are used to determine an overlay error. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an overlay system capable of recognizing overlay error, being larger than the pitch of an overlay marker lattice, relating to alignment of a projection exposure. SOLUTION: The overlay target on a substrate comprises two pairs of lattices. A first pair has a pitch P1, and a second pair has a pitch P2, with each pair containing a lattice oriented almost vertical to the first lattice. When a resist layer is aligned with a layer below it, the same overlay mark is provided on the upper layer. The relative positions of the overlay targets on the upper and lower layers are compared each other by measuring diffraction spectrum after overlay beam is radiated on the overlay targets. By providing two pairs of overlay targets having different pitches in each lattice, such overlay error which is larger than either one pitch in the overlay lattice can be measured. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To improve a double-exposure optical technology by relaxing overlay requirements. SOLUTION: The device manufacturing method includes transferring a pattern of a main mark M0 onto a base layer W in order to form an alignment mark; depositing a pattern-receiving layer L2 on the base layer W in a first lithographic process, aligning a first mask including a first pattern PT1 and a local mark pattern LM, by using the main mark M0, and transferring the first pattern PT1 and the local mark pattern LM onto the pattern receiving layer L2; aligning a second mask MS2, including a second pattern PT2 relative to the pattern receiving layer L2 by using the local mark pattern LM; and in a second lithographic process, transferring the second pattern PT 2 onto the pattern-receiving layer L2. The first and second patterns are constituted so as to form an assembled pattern PT3. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of measuring an overlay and a target which is used for measuring the overlay, requires just a small space on a substrate, and prevents crosstalk between measuring directions. SOLUTION: An overlay marker used with a scatterometer has two two-dimensional gratings overlapping each other. The two gratings have the same pitch, and the duty ratio of the upper grating is smaller than that of the lower grating. Thus it is possible to prevent crosstalk between an X overlay measured value and a Y overlay measured value. The gratings may directly overlap each other or may be displaced from each other so as to be alternately placed in one direction or two directions. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an alternative method for calculating overlay error requiring a smaller area of a substrate. SOLUTION: Radiations are projected onto a plurality of targets on a substrate. The number of measured targets can be reduced by assuming overlay errors derived from asymmetry smoothly vary across the substrate. Therefore area of scribe lines used by target for each layer of the substrate is made smaller. COPYRIGHT: (C)2008,JPO&INPIT