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    Alignment system and method and device manufactured thereby
    1.
    发明专利
    Alignment system and method and device manufactured thereby 审中-公开
    对准系统及其制造方法及装置

    公开(公告)号：JP2009117870A

    公开(公告)日：2009-05-28

    申请号：JP2009039327

    申请日：2009-02-23

    Applicant: Asml Netherlands Bv ,  エーエスエムエル ネザーランズ ビー.ブイ.

    Inventor： TOLSMA HOITE PIETER THEODOOR ,  NAVARRO Y KOREN RAMON ,  SIMONS HUBERTUS JOHANNES GERTR ,  EDART REMI DANIEL MARIE ,  LAM PUI LENG ,  HULSHOF BERNARDUS JOHANNES ANT ,  BOGERS ROLAND ADRIANUS EMANUEL

    IPC: G03F7/20 ,  H01L21/027 ,  G03B27/42 ,  G03F9/00

    CPC classification number: G03B27/42 ,  G03F9/7046

    Abstract: PROBLEM TO BE SOLVED: To provide an arrangement configuration and a method for automatically selecting a substrate alignment mark on a substrate in lithography equipment and an overlay metering target in an overlay metering device. SOLUTION: A memory stores locations of one or a plurality of sets of substrate alignment marks or overlay metering targets available for selection and selection rules to select suitable substrate alignment marks or overlay metering targets from this at least one set. The selection rules are based on experimental or theoretical knowledge about which substrate alignment mark or overlay metering targets locations are optimal based on one or a plurality of selection criteria. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种在覆盖计量装置中在光刻设备和覆盖计量目标物中自动选择基板上的基板对准标记的布置配置和方法。 解决方案：存储器存储可用于选择和选择规则的一组或多组衬底对准标记或覆盖测量目标的位置，以从该至少一组中选择合适的衬底对准标记或覆盖测量目标。 选择规则基于关于基于一个或多个选择标准的哪些衬底对准标记或覆盖测量目标位置是最佳的实验或理论知识。 版权所有（C）2009，JPO＆INPIT

    Method and apparatus for vibration detection and analysis, and lithographic apparatus equipped therewith
    2.
    发明专利
    Method and apparatus for vibration detection and analysis, and lithographic apparatus equipped therewith 有权
    用于振动检测和分析的方法和装置，以及其设备的平面设备

    公开(公告)号：JP2006114888A

    公开(公告)日：2006-04-27

    申请号：JP2005266329

    申请日：2005-09-14

    Applicant: Asml Netherlands Bv ,  エイエスエムエル ネザランドズ ベスローテン フエンノートシャップ

    Inventor： KOK HAICO V ,  KIVITS KOEN ,  DE LAAK RON VAN ,  KUIPER JOHANNES MARIA ,  ZOUW GERBRAND VAN DER ,  TOLSMA HOITE PIETER THEODOOR

    IPC: H01L21/027 ,  G01B11/00 ,  G03F7/20

    CPC classification number: G03F7/70666 ,  G03F7/709 ,  G03F9/7096

    Abstract: PROBLEM TO BE SOLVED: To provide a system and a method for determining the vibration modes relating to a lithographic apparatus and a measure of respective magnitudes thereof. SOLUTION: In the method, vibration-related information is determined by projecting an aerial image at an image position in a projection plane, by mapping the intensity of the aerial image into an image map wherein the image map includes values of coordinates of sampling locations and of the intensity sampled at the respective sampling locations, and by measuring the intensity of the aerial image received through a slot pattern. The method further comprises a step for determining the detection position of an inclined portion of the image map from the image map, a step for measuring the temporal intensity of the aerial image at the detection position of the inclined portion and measuring the relative position between the slot pattern and the image position, and a step for determining vibration-related information relating to the aerial image from the temporal intensity of the aerial image. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种用于确定与光刻设备相关的振动模式的系统和方法以及其各自量度的测量。 解决方案：在该方法中，通过将空间图像的强度映射到图像映射中，通过将空间图像投影到投影平面中的图像位置来确定振动相关信息，其中图像映射包括 采样位置和在各采样位置采样的强度，以及通过测量通过时隙模式接收的空中图像的强度。 该方法还包括用于从图像映射确定图像映射的倾斜部分的检测位置的步骤，用于测量倾斜部分的检测位置处的空间图像的时间强度的步骤，并且测量其中的相对位置 槽图案和图像位置，以及从空中图像的时间强度确定与空中图像相关的振动相关信息的步骤。 版权所有（C）2006，JPO＆NCIPI

    Method for characterizing process step and device manufacturing method
    5.
    发明专利
    Method for characterizing process step and device manufacturing method 有权
    用于表征工艺步骤和装置制造方法的方法

    公开(公告)号：JP2008211233A

    公开(公告)日：2008-09-11

    申请号：JP2008104954

    申请日：2008-04-14

    Applicant: Asml Netherlands Bv ,  エーエスエムエル ネザーランズ ビー.ブイ.

    Inventor： REUHMAN-HUISKEN MARIA ELISABET ,  DE MOL CHRISTIANUS GERARDUS MA ,  TOLSMA HOITE PIETER THEODOOR

    IPC: G03F9/00 ,  H01L21/027 ,  G03F7/20

    CPC classification number: G03F7/70616 ,  G03F7/70633 ,  G03F9/7003

    Abstract: PROBLEM TO BE SOLVED: To provide a device manufacturing method that improves the yield.
    SOLUTION: Deformation of a substrate wafer is measured by comparing positions of a plurality of reference marks with values of a data base after their exposure and process step. For taking into consideration the measured deformation and the compared results in step S1, the development step of an exposure and development step S2 is controlled using the feedforward loop. Then, a position alignment measurement step S3 is performed, in which the alignment relationship between the continuing two layers deposited on the substrate W during consecutive cycles is measured. If the positional control of a latest layer with respect to its preceding layer is insufficient, the latest layer is removed and a new layer is deposited.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供提高产量的装置制造方法。 解决方案：通过将多个参考标记的位置与其曝光和处理步骤之后的数据库的值相比较来测量衬底晶片的变形。 为了在步骤S1中考虑测量的变形和比较结果，使用前馈回路来控制曝光和显影步骤S2的显影步骤。 然后，进行位置对准测量步骤S3，其中测量在连续循环期间沉积在基板W上的连续两层之间的对准关系。 如果相对于其前一层的最新层的位置控制不足，则移除最新层并且存储新层。 版权所有（C）2008，JPO＆INPIT

    Lithographic apparatus and device manufacturing method
    7.
    发明专利
    Lithographic apparatus and device manufacturing method 有权
    LITHOGRAPHIC装置和装置制造方法

    公开(公告)号：JP2010123949A

    公开(公告)日：2010-06-03

    申请号：JP2009257618

    申请日：2009-11-11

    Applicant: Asml Netherlands Bv ,  エーエスエムエル ネザーランズ ビー.ブイ.

    Inventor： BIJNEN FRANCISCUS GODEFRIDUS CASPER ,  ROIJERS JOZEF CORNELIS ANTONIUS ,  WARNAAR PATRICK ,  VAN KEMENADE MARC ,  TOLSMA HOITE PIETER THEODOOR

    IPC: H01L21/027 ,  G03F7/20

    CPC classification number: G03F9/7049 ,  G03F9/7003 ,  G03F9/7076 ,  G03F9/7084

    Abstract: PROBLEM TO BE SOLVED: To provide a lithographic apparatus having excellent alignment reproducibility. SOLUTION: A method for manufacturing the device includes providing a substrate, the substrate including a plurality of exposure fields, each exposure field including one or more target portions and at least one mark structure, the mark structure being arranged as positional mark for the exposure field; scanning and measuring the mark of each exposure field to obtain alignment information for the respective corresponding exposure fields; determining an absolute position of each exposure field from the alignment information for the respective corresponding exposure fields; determining a relative position of each exposure field with respect to at least one other exposure field by use of additional information on the relative parameters of the exposure field and the at least one other exposure field relative to each other; and combining the absolute positions and the determined relative positions into improved absolute positions for each of the plurality of exposure fields. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供具有优异的取向再现性的光刻设备。 解决方案：一种制造该器件的方法，包括提供衬底，所述衬底包括多个曝光场，每个曝光场包括一个或多个目标部分和至少一个标记结构，所述标记结构被布置为位置标记 曝光场; 扫描和测量每个曝光场的标记以获得各个相应的曝光场的对准信息; 从各个对应的曝光场的对准信息确定每个曝光场的绝对位置; 通过使用关于相对于彼此的曝光场和至少一个其他曝光场的相对参数的附加信息来确定每个曝光场相对于至少一个其它曝光场的相对位置; 以及将所述绝对位置和所确定的相对位置组合为所述多个曝光场中的每一个的改进的绝对位置。 版权所有（C）2010，JPO＆INPIT

    Alignment system and method and device manufactured thereby
    10.
    发明专利
    Alignment system and method and device manufactured thereby 有权
    对准系统及其制造方法及装置

    公开(公告)号：JP2009117872A

    公开(公告)日：2009-05-28

    申请号：JP2009039399

    申请日：2009-02-23

    Applicant: Asml Netherlands Bv ,  エーエスエムエル ネザーランズ ビー.ブイ.

    Inventor： TOLSMA HOITE PIETER THEODOOR ,  NAVARRO Y KOREN RAMON ,  SIMONS HUBERTUS JOHANNES GERTR ,  EDART REMI DANIEL MARIE ,  LAM PUI LENG ,  HULSHOF BERNARDUS JOHANNES ANT ,  BOGERS ROLAND ADRIANUS EMANUEL

    IPC: G03F7/20 ,  H01L21/027 ,  G03B27/42

    CPC classification number: G03B27/42 ,  G03F9/7046

    Abstract: PROBLEM TO BE SOLVED: To provide an arrangement configuration and a method for automatically selecting a substrate alignment mark on a substrate in lithography equipment and an overlay metering target in an overlay metering device. SOLUTION: A memory stores locations of one or a plurality of sets of substrate alignment marks or overlay metering targets available for selection and selection rules to select suitable substrate alignment marks or overlay metering targets from this at least one set. The selection rules are based on at least one of experimental and theoretical knowledge about which substrate alignment mark or overlay metering targets locations are optimal based on one or a plurality of selection criteria. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种在覆盖计量装置中在光刻设备和覆盖计量目标物中自动选择基板上的基板对准标记的布置配置和方法。 解决方案：存储器存储可用于选择和选择规则的一组或多组衬底对准标记或覆盖测量目标的位置，以从该至少一组中选择合适的衬底对准标记或覆盖测量目标。 选择规则基于基于一个或多个选择标准的关于哪个衬底对准标记或覆盖计量目标位置是最佳的实验和理论知识中的至少一个。 版权所有（C）2009，JPO＆INPIT

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